| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 03/31/2011 | WO2011037776A2 Abrasive article with solid core and methods of making the same |
| 03/31/2011 | WO2011008499A3 Leak proof pad for cmp endpoint detection |
| 03/31/2011 | WO2010132342A3 Process for resurfacing plastic lens |
| 03/31/2011 | WO2010120128A3 Method for manufacturing a polishing retainer ring and retainer ring manufactured thereby |
| 03/31/2011 | US20110076924 Method of determining the lubrication mechanism in cmp |
| 03/31/2011 | US20110076833 Method of manufacturing semiconductor device |
| 03/31/2011 | DE102008053610B4 Verfahren zum beidseitigen Polieren einer Halbleiterscheibe A method for double-sided polishing of a semiconductor wafer |
| 03/30/2011 | EP2300199A2 Improved grinder/polisher |
| 03/30/2011 | CN201776703U Polishing head capable of trimming flatness of polished wafer |
| 03/30/2011 | CN101992422A Process control method and system of copper chemical mechanical polishing |
| 03/30/2011 | CN101992421A Chemical-mechanical polishing method in copper interconnection process |
| 03/29/2011 | US7914362 Method of evaluating the quality of a lapping plate |
| 03/24/2011 | WO2011033724A1 Polishing method and polishing device |
| 03/24/2011 | US20110070813 Method for manufacturing polishing head and polishing apparatus |
| 03/24/2011 | US20110070810 Multiple zone carrier head with flexible membrane |
| 03/24/2011 | US20110070808 Substrate polishing metrology using interference signals |
| 03/24/2011 | US20110070745 Polishing method, polishing apparatus, and manufacturing method of semiconductor device |
| 03/24/2011 | US20110070736 Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method |
| 03/23/2011 | CN201769104U Spherical surface grinding device of thrust spherical bearing |
| 03/23/2011 | CN1914241B Polyurethane polishing pad |
| 03/23/2011 | CN101990702A A polishing system having a track |
| 03/23/2011 | CN101987431A Grinding method, grinding pad and grinding system |
| 03/23/2011 | CN101987430A Fixing ring for chemically and mechanically grinding |
| 03/23/2011 | CN101987429A Grinding method and device by chemical machinery |
| 03/23/2011 | CN101987428A Chemical and mechanical grinding method |
| 03/23/2011 | CN101491889B Method for flow control to CMP tool |
| 03/23/2011 | CN101357450B Chemically machinery grinding device and method for cleaning grinding pad and grinding head |
| 03/23/2011 | CN101274419B Method for abrasing GaN substrate |
| 03/23/2011 | CN101234481B Polishing pad with grooves to retain slurry on the pad texture and its preparation method |
| 03/23/2011 | CN101096077B Substrate holding device and polishing device |
| 03/17/2011 | WO2011030706A1 Dispersant for silica particles or ceria particles, and abrasive |
| 03/17/2011 | US20110065365 Grinding method and grinding apparatus for polishing pad for use in double-side polishing device |
| 03/17/2011 | US20110064971 Glass substrate manufacturing method, glass substrate polishing method, glass substrate polishing apparatus and glass substrate |
| 03/17/2011 | US20110062374 CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device |
| 03/17/2011 | US20110062115 Composition and method for polishing bulk silicon |
| 03/17/2011 | DE112005001772B4 Verfahren und Vorrichtung zum Aufbereiten eines Polierkissens Method and apparatus for conditioning a polishing pad |
| 03/16/2011 | EP2293902A1 Semiconductor wafer polishing apparatus and method of polishing |
| 03/16/2011 | EP1496543B1 Polishing device |
| 03/16/2011 | CN101985208A Substrate polishing apparatus and method |
| 03/16/2011 | CN101530983B Polishing state monitoring apparatus and polishing apparatus and method |
| 03/16/2011 | CN101530982B Grinding clamp for changing wafer orientation |
| 03/15/2011 | US7906038 Aqueous polishing liquid and chemical mechanical polishing method |
| 03/15/2011 | US7905764 Polishing head using zone control |
| 03/10/2011 | WO2011028556A2 Structured abrasive article and method of using the same |
| 03/10/2011 | WO2011027412A1 Supporting pad |
| 03/10/2011 | WO2011027411A1 Supporting pad |
| 03/10/2011 | WO2011002149A3 Cmp polishing pad with pores formed therein, and method for forming pores |
| 03/09/2011 | CN101605629B Surface treatment method for coated cutting insert |
| 03/09/2011 | CN101541477B Lapping carrier and method |
| 03/08/2011 | US7901474 Chemical-mechanical polishing with mixture of methanesulfonic acid, potassium, oxidizing agent (hydrogen peroxide), silica abrasive and water; for inhibiting dishing and erosion of insulating film and barrier film while maintaining flatness; kits |
| 03/03/2011 | WO2011024241A1 Method and apparatus for repairing optical disc |
| 03/03/2011 | WO2011023297A1 Method for producing a semiconductor wafer |
| 03/03/2011 | US20110054057 Polyurethane polishing pad |
| 03/03/2011 | US20110053474 Polishing apparatus |
| 03/03/2011 | US20110053465 Method and apparatus for local polishing control |
| 03/03/2011 | US20110053461 Polishing apparatus and polishing method |
| 03/03/2011 | US20110053377 Polishing pad |
| 03/03/2011 | US20110048963 Method of manufacturing electropolishing pad |
| 03/02/2011 | EP2289668A2 Polishing apparatus |
| 03/02/2011 | EP2289667A1 Polishing agent for synthetic quartz glass substrate |
| 03/02/2011 | CN201752861U 刀具夹持装置 Tool holder |
| 03/02/2011 | CN101983116A Optimized cmp conditioner design for next generation oxide/metal cmp |
| 03/01/2011 | US7897250 Polishing pad |
| 03/01/2011 | US7897007 Substrate holding apparatus and substrate polishing apparatus |
| 03/01/2011 | CA2497732C Magnetorheological fluid |
| 02/24/2011 | WO2011021762A1 Double side polishing apparatus and carrier therefor |
| 02/24/2011 | WO2011021599A1 Polishing solution for cmp and polishing method |
| 02/24/2011 | US20110045753 Polishing pad |
| 02/24/2011 | US20110045748 Double side polishing apparatus and carrier therefor |
| 02/24/2011 | US20110045654 Germanium layer polishing |
| 02/23/2011 | CN101981665A Colloidal silica with modified surface and polishing composition for CMP containing the same |
| 02/23/2011 | CN101390197B Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device |
| 02/17/2011 | US20110039966 Polyurethane foam and polishing pad |
| 02/17/2011 | US20110039476 Double-disc grinding apparatus and method for producing wafer |
| 02/17/2011 | US20110039475 Polishing agent and method for polishing substrate using the polshing agent |
| 02/17/2011 | DE112009000387T5 Träger für eine Doppelseitenpoliervorrichtung, Doppelseitenpoliervorrichtung, bei der dieser Träger verwendet wird, und Doppelseitenpolierverfahren Carrier for a double-side polishing apparatus, a double-side polishing apparatus in which this carrier is used, and double-side polishing method |
| 02/17/2011 | DE102009049330B3 Semiconductor wafer repolishing method for e.g. memory element, involves effecting concave/convex erosion profile when polished semiconductor wafer exhibits concave/convex thickness profile during repolishing sides of wafer |
| 02/17/2011 | DE102009036833A1 Device for e.g. lapping of semiconductor wafers, has upper disk movable between and loading operating positions and pressable in operating position against lower disk, where upper disk does not experience tilting in course of movement |
| 02/17/2011 | DE102005001259B4 Polierverfahren für ein Halbleitersubstrat A polishing method for a semiconductor substrate |
| 02/16/2011 | CN201744919U Grinding machine platform of preheated grinding pad |
| 02/16/2011 | CN201744918U Large-size horizontal type air pump sealing surface grinding device |
| 02/16/2011 | CN101973076A Precise technology for correcting cutting angles of quartz crystal wafers in large scale |
| 02/16/2011 | CN101972983A Chemically mechanical polishing mandrel device |
| 02/16/2011 | CN101972982A Cylindrical component grinding device and grinding method thereof |
| 02/16/2011 | CN101972981A Large-diameter crystal wafer chamfering tool and chamfering method thereof |
| 02/16/2011 | CN101972980A Equipment for automatically strengthening and grinding surfaces of machines |
| 02/16/2011 | CN101972979A Diamond surface chemical mechanical combined machining method and device thereof |
| 02/16/2011 | CN101972978A Novel chemical mechanical polishing device |
| 02/15/2011 | US7887609 Consisting of a polyvalent carboxylic acid having a first stage acid dissociation exponent at 25 degrees C. of 3 or lower, colloidal silica, and water, and having a pH from 2-4; using oxalic acid, malonic acid, and tartaric acid;smoothness; high speed; chemical mechanical polishing;semiconductor wires |
| 02/15/2011 | US7887396 Method and apparatus for controlled slurry distribution |
| 02/15/2011 | US7887391 Apparatus for polishing media discs |
| 02/10/2011 | WO2011017356A2 Abrasive tool having controlled porosity distribution |
| 02/10/2011 | WO2011016971A1 Polyurethane composition for cmp pads and method of manufacturing same |
| 02/10/2011 | WO2011016941A2 Abrasive article with preconditioning and persistent indicators |
| 02/10/2011 | WO2011016323A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method using same |
| 02/10/2011 | DE102009030298A1 Verfahren zur lokalen Politur einer Halbleiterscheibe Process for the local polishing of a semiconductor wafer |
| 02/10/2011 | CA2770119A1 Abrasive tool having controlled porosity distribution |
| 02/09/2011 | CN201736114U Planetary piece |
| 02/09/2011 | CN201736113U Laminate in grinding carrier heat treatment device |
| 02/09/2011 | CN201736112U Grinding-polishing machine |