Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
05/2011
05/05/2011WO2011017356A3 Abrasive tool having controlled porosity distribution
05/05/2011US20110104995 Carrier for a double-side polishing apparatus, double-side polishing apparatus using this carrier, and double-side polishing method
05/05/2011US20110104990 Substrate Retainer
05/05/2011US20110104989 Dressing bar for embedding abrasive particles into substrates
05/05/2011DE102009051008A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
05/04/2011EP2316614A1 Polishing pad and method for manufacturing the polishing pad
05/04/2011CN201815948U Multi-sample section grinding table and grinding device
05/04/2011CN201815947U Silicon chip rotating speed detection device and silicon chip cleaning device provided with silicon chip rotating speed detection device
05/04/2011CN1840602B Method for preparing a polishing slurry having high dispersion stability
05/04/2011CN102046331A Semiconductor wafer polishing apparatus and method of polishing
05/04/2011CN102044409A Method for carrying out chemically mechanical polishing (CMP) on insulating medium
05/04/2011CN102039556A Wafer back side grinding process
05/04/2011CN102039555A 研磨头装置 Grinding head unit
05/04/2011CN102039554A Method for grinding solar silicon rod
05/04/2011CN102039553A Synchronous linkage member of clamping mechanism of valve sealing surface grinder
05/04/2011CN101590615B Tungsten chemical mechanical polishing method
05/04/2011CN101511537B 抛光垫 Polishing pad
05/04/2011CN101489722B Carrier for double-sided polishing device, double-sided polishing device using the same and double-sided polishing method
05/04/2011CN101219531B Microporous polishing pads
05/03/2011US7935216 Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
05/03/2011US7934979 Retaining ring with tapered inner surface
04/2011
04/28/2011WO2011049216A1 Composition for polishing silicon carbide
04/28/2011WO2011048889A1 Polishing agent, concentrated one-pack type polishing agent, two-pack type polishing agent and method for polishing substrate
04/28/2011WO2011016941A3 Abrasive article with preconditioning and persistent indicators
04/28/2011WO2011002149A9 Cmp polishing pad with pores formed therein, and method for forming pores
04/28/2011US20110097975 Method for producing a semiconductor wafer
04/28/2011DE102009044204A1 Wiederaufbereitungsverfahren und Wiederaufbereitungsvorrichtung zur Wiederaufbereitung von Slurry-Abwasser aus einem Halbleiterbearbeitungs-prozess, insbesondere aus einem chemisch-mechanischen Polierprozess Recycling process and recycling apparatus for recycling slurry wastewater from a semiconductor processing process, particularly a chemical mechanical polishing process
04/27/2011EP1430520B1 Chemical mechanical polishing pad with micro-holes
04/27/2011CN201807965U Device for improving surface grinding quality of copper band
04/27/2011CN201807964U Improved eccentric shaft structure of grinder
04/27/2011CN102034697A Method for polishing semiconductor wafers
04/27/2011CN102030499A Glass setting plate for glass polishing system
04/27/2011CN102029573A Method for grinding semiconductor wafer
04/27/2011CN102029572A Control method of CMP (chemical mechanical polishing) time
04/27/2011CN102029571A Polishing pad and application and manufacturing method thereof
04/27/2011CN102029570A Method and device for machining tungsten and titanium alloy target material
04/27/2011CN102029569A Valve sealing face grinding assembly
04/27/2011CN101186784B 抛光组合物 The polishing composition
04/21/2011WO2011046017A1 Polishing pad
04/20/2011EP2311074A2 Method of polishing nickel-phosphorous
04/20/2011EP1433197B1 Chemical mechanical polishing pad having wave-shaped grooves
04/20/2011CN201799928U Grinder for inner holes of thin-wall boring holder
04/20/2011CN201799927U Foundation grinding tool
04/20/2011CN102026775A Polishing pad
04/20/2011CN102026774A Double-head grinding apparatus and wafer manufacturing method
04/20/2011CN102019581A Wafer grinding equipment and wafer manufacturing method
04/20/2011CN102019580A Apparatus and method for locally polishing glass plate, and apparatus and method for producing glass product
04/20/2011CN102019579A Glass substrate manufacturing method, glass substrate polishing method, glass substrate polishing apparatus and glass substrate
04/20/2011CN102019578A Method for removing wafer from grinding head of chemical mechanical polishing equipment
04/20/2011CN102019577A Optimization method of chemical mechanical polishing process
04/20/2011CN102019576A Cambered surface grinding device
04/20/2011CN101346805B Abrasive grain-free polishing liquid and CMP polishing method
04/20/2011CN101195293B Pre-honed blade with a curved profile lamella and method for producing said blade
04/19/2011US7927190 Retaining ring with shaped surface
04/19/2011US7927187 Method of polishing a target surface
04/19/2011US7927186 Method for producing glass substrate for magnetic disk
04/19/2011US7927184 Method and system for endpoint detection
04/19/2011US7927183 Polishing pad
04/19/2011US7927182 Polishing system with in-line and in-situ metrology
04/19/2011CA2467806C Method for polishing a substrate surface
04/14/2011WO2011043567A2 Wafer-supporting member, method for manufacturing same, and wafer-polishing unit comprising same
04/14/2011WO2011042017A1 Recycling method and device for recycling waste water containing slurry from a semi-conductor treatment process, in particular from a chemico-mechanical polishing process
04/14/2011US20110086753 Method and System for Polishing Float Glass
04/14/2011US20110086584 Glass Setting Plate For Glass Polishing System
04/14/2011US20110086580 Wafer back side grinding process
04/14/2011DE102009047926A1 Verfahren zum Polieren von Halbleiterscheiben A method of polishing semiconductor wafers
04/13/2011CN1845007B Substrate and a method for polishing a substrate
04/13/2011CN102017091A Polishing agent and method for polishing substrate using the polishing agent
04/13/2011CN102015812A Polyurethane foam and polishing pad
04/13/2011CN102015207A Apparatus and method for polishing semi-conductor dice
04/13/2011CN102009385A Chemical mechanical polishing method for semiconductor wafer
04/13/2011CN102009384A Grinding head device for chemically mechanical polishing equipment
04/13/2011CN102009383A Chemical machinery grinding equipment and grinding method
04/13/2011CN102009382A Grinder
04/13/2011CN101612719B Polishing apparatus and polishing method
04/13/2011CN101410955B Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical poli
04/13/2011CN101223006B Double side polishing method for wafer
04/13/2011CN101153838B Method of determining the number of active diamonds on a conditioning disk
04/13/2011CN101137740B Lubricant composition for bonded-abrasive polishing of magnetic head
04/13/2011CN101015907B Grinding device for controlling grinding thickness
04/12/2011US7923178 Glass substrate for mask blank and method of polishing for producing the same
04/12/2011US7922783 Polishing pad and production method thereof
04/12/2011US7922562 Systems and methods for reducing electrostatic charge of semiconductor wafers
04/07/2011WO2011040296A1 Method for grinding green ball, method for manufacturing ceramic ball, and grinding device
04/07/2011US20110081841 Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same
04/07/2011US20110081840 Method for polishing semiconductor wafers
04/07/2011US20110081832 Polishing device and polishing method
04/07/2011US20110081829 Polishing endpoint detection method and polishing endpoint detection apparatus
04/06/2011EP2303506A1 Apparatus and method for polishing semi-conductor dice
04/06/2011EP1417703B1 Chemical mechanical polishing pad having holes and/or grooves
04/06/2011EP1323187B1 Method for cleaning the surface of a substrate
04/06/2011CN201783872U Double-faced grinding and polishing machine
04/06/2011CN1986717B Polishing composition for hard disk substrate
04/06/2011CN102007577A Polishing liquid for cmp and polishing method
04/06/2011CN102001044A System and method for supplying grinding fluid by chemically mechanical polishing (CMP)
04/06/2011CN102001036A Polishing apparatus
04/06/2011CN102001035A Chemical mechanical polishing system
04/06/2011CN101496143B Polishing composition
04/06/2011CN101432854B Polishing liquid for CMP and method of polishing
04/06/2011CN101402187B Polishing pad
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