Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
07/1998
07/28/1998US5785585 Polish pad conditioner with radial compensation
07/28/1998US5785584 Planarizing apparatus with deflectable polishing pad
07/21/1998US5782680 Burnishing head for polishing surfaces of carriers of magnetic media
07/21/1998US5782678 Dual column abrading machine
07/21/1998US5782675 Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
07/16/1998WO1998030356A1 Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto
07/15/1998EP0853335A2 Slurry and process for the mechano-chemical polishing of semiconductor devices
07/15/1998EP0853110A1 CMP slurry with high selectivity
07/15/1998EP0852528A1 Composition and method for refinishing compact disks
07/15/1998CN1187407A Polishing method of substrate and polishing device therefor
07/15/1998CN1187406A New chemical mechanical polishing process for layers of isolating material based on silicon derivatives or silicon
07/14/1998US5779526 Pad conditioner
07/14/1998US5779525 Polishing machine
07/14/1998US5779522 Chemical-mechanical planarization apparatus
07/14/1998US5779521 Method and apparatus for chemical/mechanical polishing
07/14/1998US5779520 Method and apparatus of polishing wafer
07/14/1998US5779426 Loading and unloading unit for polishing apparatus
07/14/1998US5778481 Silicon wafer cleaning and polishing pads
07/08/1998EP0852063A1 Method of modifying an exposed surface of a semiconductor wafer
07/07/1998US5777739 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers
07/07/1998US5775983 Apparatus and method for conditioning a chemical mechanical polishing pad
07/07/1998US5775980 Polishing method and polishing apparatus
07/02/1998WO1998028108A1 Manufacture of porous polishing pad
07/02/1998DE19723060A1 Chemo-mechanical wafer polisher and process for semiconductors
07/01/1998EP0850726A1 Method and apparatus automatically changing a polishing pad in a chemical mechanical polishing system
07/01/1998EP0850725A2 Platen coating structure for chemical mechanical polishing and method
07/01/1998EP0850723A1 Wafer holding jig
07/01/1998EP0656031B1 Polymeric substrate with polymeric microelements
07/01/1998CN1186010A Chemical mechanical polishing method and apparatus thereof
06/1998
06/30/1998US5772493 Method and apparatus for controlling the lapping of magnetic heads
06/24/1998EP0849778A2 Improvements in or relating to wafer polishing
06/24/1998EP0849041A2 Polishing method
06/24/1998EP0849040A2 Method of polishing
06/24/1998EP0849039A2 Lapping apparatus and lapping method
06/24/1998CN1185471A Polishing composition
06/23/1998US5770948 Rotary signal coupling for chemical mechanical polishing endpoint detection with a strasbaugh tool
06/23/1998US5770522 Polishing block heater
06/23/1998US5770521 Anti-shear method and system for semiconductor wafer removal
06/23/1998US5770103 Composition and method for polishing a composite comprising titanium
06/23/1998US5769699 Polishing pad for chemical-mechanical polishing of a semiconductor substrate
06/23/1998US5769697 Method and apparatus for polishing semiconductor substrate
06/23/1998US5769696 Chemical-mechanical polishing of thin materials using non-baked carrier film
06/23/1998US5769695 Chamfer grinding system for wafer
06/23/1998US5769694 Appartus for the surface machining of workpieces
06/23/1998US5769692 On the use of non-spherical carriers for substrate chemi-mechanical polishing
06/23/1998US5769691 Methods and apparatus for the chemical mechanical planarization of electronic devices
06/18/1998DE19755716A1 Device for determining the quantity of material removed e.g. from a semiconductor wafer
06/17/1998EP0847835A1 Method and apparatus for polishing semiconductor substrates
06/17/1998CN2284120Y Grinder
06/17/1998CN1185028A Method and device for polishing semiconductor wafers
06/16/1998US5767016 Method of forming a wiring layer on a semiconductor by polishing with treated slurry
06/16/1998US5766279 Mixed oxides
06/16/1998US5766058 Chemical-mechanical polishing using curved carriers
06/10/1998EP0846741A1 Polishing composition
06/10/1998EP0846740A1 Slurry compositions
06/10/1998EP0846040A1 Polishing pads
06/10/1998CN1184019A Platen coating structure for chemical mechanical polishing and method
06/09/1998US5762544 Carrier head design for a chemical mechanical polishing apparatus
06/09/1998US5762543 Polishing apparatus with improved product unloading
06/09/1998US5762539 Apparatus for and method for polishing workpiece
06/09/1998US5762537 System for real-time control of semiconductor wafer polishing including heater
06/09/1998US5762536 Sensors for a linear polisher
06/09/1998US5761781 Method of manufacturing a piezoelectric ceramic resonator
06/04/1998WO1998023408A1 A composition and slurry useful for metal cmp
06/03/1998EP0845329A2 Method and apparatus for polishing a thin plate
06/03/1998EP0845328A2 Polishing pad and apparatus for polishing a semiconductor wafer
06/02/1998US5759918 Method for chemical mechanical polishing
06/02/1998US5759427 Method and apparatus for polishing metal surfaces
06/02/1998US5759088 Process for machining components made of brittle materials and a device for carrying out the same
05/1998
05/28/1998WO1998022978A1 Method of preparing silicon carbide wafers for epitaxial growth
05/28/1998WO1998022976A1 Abrading method for semiconductor device
05/27/1998EP0844290A1 A composition and slurry useful for metal CMP
05/26/1998US5755979 Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish
05/26/1998US5755614 Rinse water recycling in CMP apparatus
05/22/1998WO1998021289A1 Abrasive composition for the base of magnetic recording medium and process for producing the base by using the same
05/22/1998WO1998021008A1 Bearing assembly for wafer planarization carrier
05/20/1998EP0843342A1 Method and apparatus to separate a semiconductor wafer from a flat support
05/20/1998EP0842738A2 Method of and apparatus for polishing and cleaning planar workpiece
05/20/1998EP0842737A1 Drainage structure in polishing plant
05/19/1998US5752875 Method of chemically-mechanically polishing an electronic component
05/19/1998US5752874 Means and method for fabrication of grazing incidence optics
05/14/1998WO1998020487A1 Gimbal micropositioning device
05/14/1998WO1998019828A1 Multi-point bending of bars during fabrication of magnetic recording heads
05/14/1998WO1998019827A1 Wet etch for silicon carbide
05/13/1998EP0841123A1 A carrier head with a flexible membrane for a chemical mechanical polishing system
05/13/1998EP0841122A1 Endpoint detector for a chemical mechanical polishing system
05/12/1998US5750440 Apparatus and method for dynamically mixing slurry for chemical mechanical polishing
05/12/1998US5749772 Method and apparatus for polishing wafer
05/12/1998US5749771 Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost
05/12/1998US5749769 Lapping process using micro-advancement for optimizing flatness of a magnetic head air bearing surface
05/07/1998WO1998019301A1 Apparatus for polishing planar substrates between rotating plates
05/07/1998WO1998018596A1 Improved elg wiring configuration
05/06/1998CN2280587Y 钻石研磨轮 Diamond grinding wheel
05/05/1998US5746931 Using porous platen having planar surface and molten metal in pores
04/1998
04/30/1998WO1998018159A1 Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
04/30/1998WO1998017438A1 Surface polishing apparatus
04/29/1998EP0838845A1 New process for chemical mechanical polishing of isolating layers based on silicon or silicon containing materials
04/29/1998CN1180007A Curve form adaptive grinding method for free curve grinding and its tool
04/28/1998US5743788 Method for removing material from a work piece
04/28/1998US5743784 Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process
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