Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
07/1999
07/13/1999US5921849 Method and apparatus for distributing a polishing agent onto a polishing element
07/13/1999CA2003381C Polishing plate
07/08/1999WO1999033615A1 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
07/08/1999WO1999033614A1 A carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
07/08/1999WO1999033613A1 A carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
07/08/1999WO1999033612A1 Polishing device
07/08/1999WO1999033610A1 Magnetic float polishing of magnetic materials
07/08/1999DE19858361A1 Verfahren und Vorrichtung zum Polieren von Wafern mit verbesserter Erfassung des Zeitpunkts zur Beendigung des Poliervorgangs Method and apparatus for polishing wafers with improved detection of the timing of the termination of the polishing operation
07/06/1999US5919082 Fixed abrasive polishing pad
07/01/1999WO1999032259A1 Method for producing a valve seat body for a fuel injection valve, and corresponding fuel injection valve
06/1999
06/29/1999US5916412 Apparatus for and method of polishing workpiece
06/29/1999US5916016 Methods and apparatus for polishing wafers
06/29/1999US5916012 Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher
06/29/1999US5916011 Process for polishing a semiconductor device substrate
06/29/1999US5916010 CMP pad maintenance apparatus and method
06/29/1999US5916009 Apparatus for applying an urging force to a wafer
06/24/1999WO1999031744A1 Apparatus and method for treating a cathode material provided on a thin-film substrate
06/24/1999WO1999031195A1 Abrasive, method of polishing wafer, and method of producing semiconductor device
06/24/1999DE19757117A1 Valve seat body fabrication method for fuel injection valve
06/24/1999CA2605696A1 Process for producing semiconductor device
06/24/1999CA2325367A1 Apparatus and method for treating a cathode material provided on a thin-film substrate
06/24/1999CA2315057A1 Process for producing semiconductor device
06/23/1999EP0924030A2 Work unloading method and surface polishing apparatus with work unloading mechanism
06/22/1999US5914275 Polishing dielectric surface using aqueous cerium oxide abrasive slurry having low impurity concentration
06/22/1999US5914053 Apparatus and method for double-sided polishing semiconductor wafers
06/22/1999US5913719 Workpiece holding mechanism
06/22/1999US5913718 Head for a chemical mechanical polishing apparatus
06/22/1999US5913717 Sphere polishing machine
06/22/1999US5913715 Use of hydrofluoric acid for effective pad conditioning
06/22/1999US5913714 Method for dressing a polishing pad during polishing of a semiconductor wafer
06/22/1999US5913713 Used in a chemical mechanical planarization apparatus for polishing
06/22/1999US5913712 Scratch reduction in semiconductor circuit fabrication using chemical-mechanical polishing
06/17/1999WO1999029505A1 Polishing solution feeder
06/17/1999DE19755975A1 Semiconductor wafer holder suitable also for other flat workpieces
06/16/1999EP0923122A2 A method of manufacturing an integrated circuit using chemical mechanical polishing and a chemical mechanical polishing system
06/16/1999EP0922534A2 Slurry mixing apparatus and method
06/16/1999EP0922531A1 Carrier and CMP apparatus
06/16/1999EP0921906A1 Abrasive construction for semiconductor wafer modification
06/16/1999EP0921904A1 Apparatus and method for polishing semiconductor devices
06/16/1999CN1219454A Grinding method for steel bearing ball
06/16/1999CN1219453A Modular wafer polishing apparatus and method
06/15/1999US5911864 Method of fabricating a semiconductor structure
06/15/1999US5911835 Treatment of substrates with oxyamines, hydrazines, alkanolamines and water
06/15/1999US5911619 Apparatus for electrochemical mechanical planarization
06/15/1999US5911257 Device for removing objects adhered to a plate for bonding a semiconductor wafer
06/10/1999WO1999028083A1 Segmented polishing pad
06/09/1999EP0920956A2 Polishing apparatus and method
06/09/1999EP0920955A2 Method and apparatus for endpoint detection in polishing of components, especially semiconductor components
06/09/1999EP0686076B1 Wafer polishing apparatus and method
06/08/1999US5910846 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
06/08/1999US5910043 Polishing pad for chemical-mechanical planarization of a semiconductor wafer
06/08/1999US5910041 Lapping apparatus and process with raised edge on platen
06/03/1999WO1999026763A2 Polishing apparatus
06/03/1999WO1999026762A1 Wafer backing insert for free mount semiconductor polishing apparatus and process
06/03/1999WO1999026761A1 Polishing apparatus
06/03/1999WO1999026760A1 Wafer polishing machine
06/03/1999WO1999026758A1 Electrochemical-control of abrasive polishing and machining rates
06/03/1999WO1999013498A3 Combined cmp and wafer cleaning apparatus and associated methods
06/02/1999EP0919602A1 Metal polishing agent and process for polishing metal using same
06/02/1999EP0919336A2 Surface polishing pad
06/02/1999EP0919330A1 Polishing pad cluster for polishing a semiconductor wafer
06/02/1999EP0919329A1 Liquid dispensing system and method
06/02/1999DE19855455A1 Finishing processing, e.g. final polishing of workpiece
06/01/1999US5908530 Apparatus for chemical mechanical polishing
06/01/1999US5908347 Polishing system for polishing wafer
05/1999
05/27/1999WO1999026282A1 Method of producing semiconductor wafer
05/27/1999WO1999025520A1 Method and apparatus for modeling a chemical mechanical polishing process
05/25/1999US5906949 Efficient and noncontaminated planarization using alkaline aqueous slurry containing sialon abrasive particles
05/25/1999US5906533 Infrared heater to soften a bonding agent for semiconductor wafer
05/25/1999US5906532 Method for polishing semiconductor substrate and apparatus for the same
05/20/1999WO1999024218A1 Manufacturing a memory disk or semiconductor device using an abrasive polishing system, and polishing pad
05/19/1999EP0916463A1 Method for recycling an abrasive suspension
05/19/1999EP0916452A2 Method and apparatus for polishing semiconductor wafers
05/19/1999EP0916451A2 Method and apparatus for polishing semiconductor wafer
05/19/1999EP0916450A1 Method and apparatus for polishing semiconductor wafers
05/19/1999CN2319172Y Improved structure of vertical abrasive grinder
05/19/1999CN1216727A Lapping method
05/18/1999US5904615 Pad conditioner for chemical mechanical polishing apparatus
05/18/1999US5904611 Precision polishing apparatus
05/18/1999US5904609 Polishing apparatus and polishing method
05/18/1999US5904608 For polishing a surface of a workpiece
05/14/1999WO1999023449A1 Method and apparatus for modeling substrate reflectivity during chemical mechanical polishing
05/12/1999EP0914908A2 Polishing apparatus and method
05/12/1999EP0914907A2 Polishing member support and polishing method
05/12/1999EP0914906A2 Polishing tool support and related method
05/12/1999EP0914905A2 Wafer polishing apparatus and method
05/12/1999EP0914904A2 Apparatus for dispensing slurry
05/12/1999CN2317992Y Grinding board with ball-guiding device
05/12/1999CN1216266A Chemical mechanical polishing system and method therefor
05/11/1999US5902780 Comprising hydroxylamine, about 10-80% by weight of an alkanolamine which is miscible with said hydroxylamine, and water
05/11/1999US5902172 Method of polishing memory disk substrate
05/06/1999EP0913442A2 Polishing method
05/06/1999EP0913233A2 Polishing solution supply system
05/04/1999US5900164 Sliding a planarizing pad made of a polymeric matrix impregnated with hollow flexible polymeric microelements on a semiconductor work surface; work surface of the pad may be continuously regenerated
05/04/1999US5899801 Method and apparatus for removing a substrate from a polishing pad in a chemical mechanical polishing system
05/04/1999US5899800 Chemical mechanical polishing apparatus with orbital polishing
05/04/1999US5899799 Method and system to increase delivery of slurry to the surface of large substrates during polishing operations
05/04/1999US5899798 Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
05/04/1999US5899793 Lapping apparatus including a lapping base having pads
05/04/1999US5899792 Of a wafer
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