Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
06/1993
06/23/1993EP0547894A1 An automatic wafer lapping apparatus
06/23/1993EP0547684A2 Method of manufacturing a semiconductor body comprising a carrier wafer and a monocrystalline semiconducting top layer
06/08/1993US5216843 Polishing pad conditioning apparatus for wafer planarization process
06/01/1993US5214884 Ball polishing apparatus and method for the same
05/1993
05/26/1993EP0294478B1 Improved grinding guide and method
05/25/1993US5213655 Device and method for detecting an end point in polishing operation
05/25/1993US5212910 Composite polishing pad for semiconductor process
05/19/1993CN2133408Y High-speed grinder
05/05/1993EP0539896A1 Method of chucking semiconductor wafers
05/04/1993US5207759 Texturing slurry and method
04/1993
04/28/1993EP0539194A1 Method and apparatus for ceramic ferrule bore lap processing
04/27/1993US5205082 Wafer polisher head having floating retainer ring
04/21/1993EP0537627A2 Semiconductor wafer planarization
04/20/1993US5203119 Automated system for lapping air bearing surface of magnetic heads
03/1993
03/31/1993EP0534108A1 Method for one-sided surface making of workpieces
03/31/1993EP0534071A1 Processing of magnetic head flexures with slider elements
03/30/1993US5197999 Dielectrics on wafers for semiconductors, stiffening
03/30/1993US5197230 Finish-machining machine
03/16/1993US5193316 Semiconductor wafer polishing using a hydrostatic medium
03/09/1993US5191738 Method of polishing semiconductor wafer
03/02/1993US5190567 Sintered aluminous abrasive grains and method of producing the same
02/1993
02/23/1993US5187901 Circumferential pattern finishing machine
02/04/1993WO1993001914A1 Superpolishing agent, process for polishing hard materials, and polished hard materials
02/03/1993EP0526262A1 Method for polishing microelectronic components
01/1993
01/26/1993US5181346 Thru-feed lapping apparatus
01/12/1993US5177908 Polishing pad
01/07/1993EP0521102A1 Apparatus for interlayer planarization of semiconductor material.
12/1992
12/30/1992CN2126139U Lapping machine
12/29/1992US5174067 Automatic wafer lapping apparatus
12/09/1992EP0517596A1 Polishing machine with an improved workpiece holder
12/09/1992EP0517595A1 Polishing machine with pressure control
12/09/1992EP0517594A1 Polishing machine with a tensioned finishing belt and an improved work supporting head
12/09/1992EP0517033A1 Cleaning device for wafer mount plate
12/09/1992CN2124104U Vibration lapping machine
12/08/1992US5168659 Apparatus for finely working piston rings
12/08/1992CA1311272C Electrical guide for tight tolerance machining
12/01/1992US5167667 Process for treating polishing cloths used for semiconductor wafers
12/01/1992US5167096 Method for texturing a magnetic disc substrate
11/1992
11/25/1992CN2122707U Hand-operated valve lapping machine
11/10/1992US5163109 Optical connector assembly
11/03/1992US5159787 Method for lapping two surfaces of a titanium disk
11/03/1992CA1309594C Superfinishing machine using lapping film
10/1992
10/27/1992US5157877 Method for preparing a semiconductor wafer
10/27/1992US5157876 Stress-free chemo-mechanical polishing agent for II-VI compound semiconductor single crystals and method of polishing
10/22/1992DE4101353A1 Lapping machine with two lapping discs - has adjustment for eccentricity of lapping discs with respect to machine axis
10/13/1992US5154023 Polishing process for refractory materials
10/13/1992US5154021 Pneumatic pad conditioner
09/1992
09/30/1992EP0505425A1 Methods of preparation of surfaces and applications thereof
09/29/1992US5151584 Method and apparatus for endpoint detection in a semiconductor wafer etching system
09/23/1992EP0504887A2 Automated system for lapping magnetic heads
09/23/1992CN1064639A Grinding device for spiral tray
09/22/1992US5149338 Superpolishing agent, process for polishing hard ceramic materials, and polished hard ceramics
09/22/1992US5148945 Apparatus and method for the transfer and delivery of high purity chemicals
09/01/1992US5142828 Correcting a defective metallization layer on an electronic component by polishing
08/1992
08/25/1992US5141527 Ceramic sintered body and method of producing it
08/25/1992US5140774 Apparatus for polishing hard disk substrates
08/19/1992EP0499084A1 Wafer mount plate
08/11/1992US5137544 Stress-free chemo-mechanical polishing agent for II-VI compound semiconductor single crystals and method of polishing
08/11/1992US5137540 Composite monolithic lamp and a method of making the same
08/11/1992US5136819 Method for mirror polishing of ti-made magnetic disk substrate
08/11/1992US5136818 Using slurry of cerium oxide, water, glycerin and optionally sodium hydroxide; measuring transmission loss
08/11/1992US5136817 Automatic lapping apparatus for piezoelectric materials
08/06/1992WO1992010441A3 Composite monolithic lap and a method of making the same
07/1992
07/21/1992US5132617 Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within the air gap of a magnetic core
07/21/1992US5131190 Lapping machine and non-constant pitch grooved bed therefor
07/07/1992US5128281 Method for polishing semiconductor wafer edges
07/07/1992US5127196 Apparatus for planarizing a dielectric formed over a semiconductor substrate
07/01/1992EP0493117A2 A method and an apparatus for handling wafers
07/01/1992EP0474768A4 Ultra-precision lapping apparatus
06/1992
06/25/1992WO1992010441A2 Composite monolithic lap and a method of making the same
06/23/1992US5123933 Applying lapping tape having abrasive particles of diamond and aluminium oxide or silicon carbide; minimization or surface roughness
06/23/1992US5123218 Circumferential pattern finishing method
06/23/1992US5123214 Method of grinding a plate-like material and apparatus for carrying out the method
06/03/1992EP0488267A2 Wafer binding method and apparatus
05/1992
05/27/1992EP0245289B1 Polishing system with underwater bernoulli pickup
05/20/1992CN2104730U Finishing machine for general-purpose valve
05/19/1992US5113622 Apparatus for grinding semiconductor wafer
05/19/1992CA1300890C Grinding guide and method
05/19/1992CA1300889C Biased grinding assembly
05/13/1992EP0485161A1 Stripping compositions and method of stripping resists from substrates
05/05/1992US5110428 Differently polarizing front and rear surfaces
05/05/1992US5109631 Finish-machining machine comprising means for feeding an abrasive slurry at a controlled rate
05/05/1992CA1299873C Grinding guide and method for controlling the automatic grinding of objects
04/1992
04/22/1992EP0481936A2 Method of and apparatus for continuously controlling the pressure applied on workpieces in a double-plate lapping machine
04/22/1992EP0481935A2 Method and apparatus for the post-process check of the workpieces in a double-plate lapping machine
04/22/1992EP0481826A1 An automatic wafer lapping apparatus
04/22/1992CN2102177U Moving type large flange sealing face abrasive machine
04/21/1992US5106394 Water, cerium oxide, water soluble liquid having index of refraction greater than that of the core
04/16/1992DE4130316A1 Mechano-chemical polishing abrasive - comprises colloidal silica paste and mechanical abrasive for high speed polishing of hard substrate, e.g. ceramics or glass
04/15/1992EP0480678A2 Lapping abrasive of aluminazirconia system and method for producing the same
04/14/1992US5104828 Method of planarizing a dielectric formed over a semiconductor substrate
04/10/1992CA2052948A1 Lapping abrasive of alumina-zirconia system and method for producing the same
04/10/1992CA2039998A1 Mechanochemical polishing abrasive
04/08/1992EP0478912A2 Working disc for lapping, honing and polishing machine
04/07/1992US5101602 Foam backing for use with semiconductor wafers
04/02/1992WO1992005406A1 Improved apparatus and method for the transfer and delivery of high purity chemicals
04/01/1992CN2100278U Lapping machine
03/1992
03/31/1992US5099614 Flat lapping machine with sizing mechanism
03/31/1992CA1298087C Automatic grinding machine
03/25/1992EP0316381B1 Lapping-machine, especially for fine surface-machining of bearing balls