Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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12/30/1997 | US5702290 Block for polishing a wafer during manufacture of integrated circuits |
12/29/1997 | EP0813932A1 Polishing apparatus having a cloth cartridge |
12/28/1997 | CA2208430A1 Polishing disk holder and method of polishing |
12/23/1997 | US5700348 Forming hydrophilic thin film by oxygen plasma treatment on exposed silicon surface, polishing insulating film, removing abrasive grains adhering to surface by scrubbing |
12/23/1997 | US5700180 System for real-time control of semiconductor wafer polishing |
12/23/1997 | US5700179 Method of manufacturing semiconductor wafers and process of and apparatus for grinding used for the same method of manufacture |
12/18/1997 | WO1997047433A1 Methods and apparatus for the chemical mechanical planarization of electronic devices |
12/18/1997 | WO1997047432A1 Lapping apparatus |
12/17/1997 | EP0812656A2 Dressing device for dressing a polishing pad in a lapping machine |
12/17/1997 | CN1167667A Apparatus and method for shaping polishing pads |
12/16/1997 | US5698455 Method for predicting process characteristics of polyurethane pads |
12/16/1997 | US5697832 Variable speed bi-directional planetary grinding or polishing apparatus |
12/11/1997 | WO1997047030A1 Fluoride additive containing chemical mechanical polishing slurry and method for use of same |
12/10/1997 | EP0811666A2 Fluoride additive containing chemical mechanical polishing slurry and method for use of same |
12/09/1997 | US5695601 Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method |
12/09/1997 | US5695392 Polishing device with improved handling of fluid polishing media |
12/09/1997 | US5695386 Cleaning method using abrasive tape |
12/03/1997 | EP0810635A1 Method and apparatus for mounting a semiconductor wafer on a polishing block by applying radiant heat |
12/03/1997 | EP0810066A2 Automated wafer lapping system |
12/03/1997 | EP0810064A2 Polishing apparatus having interlock function |
12/03/1997 | EP0809798A2 Method and apparatus for predicting process characteristics of polyurethane pads |
12/03/1997 | EP0809557A1 Determining the coefficient of friction of a polishing pad |
12/03/1997 | CN1166805A Chemical mechanical polishing slurry for metal layers |
12/02/1997 | US5693239 Polishing slurries comprising two abrasive components and methods for their use |
12/02/1997 | US5692950 Abrasive construction for semiconductor wafer modification |
12/02/1997 | US5692947 Linear polisher and method for semiconductor wafer planarization |
11/27/1997 | WO1997044160A1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
11/26/1997 | EP0808231A1 Chemical-mechanical polishing using curved carriers |
11/26/1997 | EP0808230A1 Chemical-mechanical polishing of thin materials using a pulse polishing technique |
11/26/1997 | CN1165727A method of and apparatus for polishing wafer |
11/25/1997 | US5691253 Forming layer over patterned substrate, wherein the layer has first exposed surface lying in a first elevation, and a second elevation that is different from the first elevation, polishing to form second exposed surface, analyzing |
11/25/1997 | US5690542 Disc streak pattern forming method and apparatus |
11/25/1997 | US5690540 Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers |
11/20/1997 | WO1997043091A1 Abrasive foam grinding composition |
11/19/1997 | EP0807673A1 Protective adhesive foil for optical glasses and process for removing it |
11/19/1997 | EP0807492A2 Method for polishing workpieces and apparatus therefor |
11/18/1997 | US5689693 Range finding circuit for selecting a consecutive sequence of reorder buffer entries using circular carry lookahead |
11/18/1997 | US5688364 Semiconductor wafers |
11/12/1997 | EP0806267A1 Cross-hatched polishing pad for polishing substrates in a chemical mechanical polishing system |
11/12/1997 | EP0806266A2 Polishing method and polishing apparatus using the same |
11/12/1997 | EP0806265A1 Precision polishing apparatus |
11/11/1997 | US5685947 Chemical-mechanical polishing with an embedded abrasive |
11/11/1997 | US5685766 Polishing control method |
11/05/1997 | EP0805000A1 Semiconductor wafer post-polish clean and dry method and apparatus |
11/05/1997 | EP0674565B1 Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles |
11/05/1997 | CN2266481Y Multi-axle lapping machine |
11/04/1997 | US5683289 CMP polishing pad conditioning apparatus |
10/30/1997 | WO1997040525A1 Chemical-mechanical planarization apparatus and method |
10/30/1997 | DE19715460A1 Poliervorrichtung mit verbesserter Führung eines flüssigen Poliermediums Polishing apparatus with improved management of liquid polishing medium |
10/29/1997 | EP0803329A2 Polishing machine |
10/29/1997 | EP0803328A1 Polishing system for polishing wafer |
10/29/1997 | EP0803327A2 Apparatus and method for shaping polishing pads |
10/29/1997 | CN1163180A Scraping method for fixed binding surface in position of grinding point |
10/28/1997 | US5681423 Support pillar positioned in cavity to support polishing pad during planarization |
10/28/1997 | US5681215 Carrier head design for a chemical mechanical polishing apparatus |
10/28/1997 | US5681212 Polishing device and correcting method therefor |
10/21/1997 | US5679212 Etchant containing no loose abrasives and permitting selective etching of deformed layers |
10/21/1997 | US5679065 Wafer carrier having carrier ring adapted for uniform chemical-mechanical planarization of semiconductor wafers |
10/21/1997 | US5679064 Polishing apparatus including detachable cloth cartridge |
10/21/1997 | US5679063 Polishing apparatus |
10/21/1997 | US5679060 Wafer grinding machine |
10/21/1997 | US5679059 Method of polishing a surface of a workpiece |
10/21/1997 | US5679055 Automated wafer lapping system |
10/16/1997 | WO1997037813A1 Method and structure for polishing a wafer during manufacture of integrated circuits |
10/16/1997 | WO1997037812A1 Device for preparing metallographic samples |
10/15/1997 | EP0800896A2 Endpoint detection for chemical mechanical polishing using frequency or amplitude mode |
10/15/1997 | CN1161998A 抛光剂 Polishes |
10/14/1997 | US5676590 Polishing apparatus provided with abrasive cloth |
10/07/1997 | US5674352 Process related to a modified polishing pad for polishing |
10/07/1997 | US5674115 Apparatus for grinding a master disc |
10/07/1997 | US5674109 Apparatus and method for polishing workpiece |
10/07/1997 | US5674107 Diamond polishing method and apparatus employing oxygen-emitting medium |
10/01/1997 | EP0798355A2 Base material for adhesive tape |
10/01/1997 | EP0798080A1 Lapping apparatus and method |
10/01/1997 | EP0798078A2 Method for manufacturing backing pad and apparatus used therefor |
09/30/1997 | US5672577 Stripper solution also contains water, 1,2-dihydroxybenzene or derivatives, mercaptophenol/o-/ or mercaptobenzoic acid/o-/, and ethylenediaminetetracarboxylic acid as chelating agents to provide stability and effectiveness |
09/30/1997 | US5672382 Composite powder particle, composite body and method of preparation |
09/30/1997 | US5672095 Elimination of pad conditioning in a chemical mechanical polishing process |
09/30/1997 | US5672093 Specimen load control mechanism for automatic polishing apparatus |
09/30/1997 | US5672091 Polishing apparatus having endpoint detection device |
09/23/1997 | US5670410 End-point detection |
09/23/1997 | US5670011 Apparatus and method for polishing workpiece |
09/18/1997 | WO1997033716A1 Tribochemical polishing of ceramics and metals |
09/17/1997 | CN2262468Y Lapping aid with irregular shaft end |
09/16/1997 | US5667567 Ethyl silicate monomer and/or polymer |
09/16/1997 | US5667433 Keyed end effector for CMP pad conditioner |
09/16/1997 | US5667426 Surface treatment using an abrasive sheet having alumina particles disposed in resin film with silicon dioxide colloidal particles |
09/10/1997 | CN2261911Y Grinder |
09/09/1997 | US5665249 Micro-electromechanical die module with planarized thick film layer |
09/09/1997 | US5665201 High removal rate chemical-mechanical polishing |
09/09/1997 | US5664990 Slurry recycling in CMP apparatus |
09/09/1997 | US5664989 Polishing pad, polishing apparatus and polishing method |
09/09/1997 | US5664988 Process of polishing a semiconductor wafer having an orientation edge discontinuity shape |
09/09/1997 | US5664987 Methods and apparatus for control of polishing pad conditioning for wafer planarization |
09/09/1997 | US5664986 Apparatus for polishing a dielectric layer formed on a substrate |
09/03/1997 | EP0792721A1 Polishing apparatus |
09/02/1997 | US5663797 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
09/02/1997 | US5663637 Rotary signal coupling for chemical mechanical polishing endpoint detection with a westech tool |
08/28/1997 | DE19605588A1 Method for finishing piston track in internal combustion engines |
08/27/1997 | EP0791431A1 Workpiece holding mechanism |