Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
12/1997
12/30/1997US5702290 Block for polishing a wafer during manufacture of integrated circuits
12/29/1997EP0813932A1 Polishing apparatus having a cloth cartridge
12/28/1997CA2208430A1 Polishing disk holder and method of polishing
12/23/1997US5700348 Forming hydrophilic thin film by oxygen plasma treatment on exposed silicon surface, polishing insulating film, removing abrasive grains adhering to surface by scrubbing
12/23/1997US5700180 System for real-time control of semiconductor wafer polishing
12/23/1997US5700179 Method of manufacturing semiconductor wafers and process of and apparatus for grinding used for the same method of manufacture
12/18/1997WO1997047433A1 Methods and apparatus for the chemical mechanical planarization of electronic devices
12/18/1997WO1997047432A1 Lapping apparatus
12/17/1997EP0812656A2 Dressing device for dressing a polishing pad in a lapping machine
12/17/1997CN1167667A Apparatus and method for shaping polishing pads
12/16/1997US5698455 Method for predicting process characteristics of polyurethane pads
12/16/1997US5697832 Variable speed bi-directional planetary grinding or polishing apparatus
12/11/1997WO1997047030A1 Fluoride additive containing chemical mechanical polishing slurry and method for use of same
12/10/1997EP0811666A2 Fluoride additive containing chemical mechanical polishing slurry and method for use of same
12/09/1997US5695601 Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method
12/09/1997US5695392 Polishing device with improved handling of fluid polishing media
12/09/1997US5695386 Cleaning method using abrasive tape
12/03/1997EP0810635A1 Method and apparatus for mounting a semiconductor wafer on a polishing block by applying radiant heat
12/03/1997EP0810066A2 Automated wafer lapping system
12/03/1997EP0810064A2 Polishing apparatus having interlock function
12/03/1997EP0809798A2 Method and apparatus for predicting process characteristics of polyurethane pads
12/03/1997EP0809557A1 Determining the coefficient of friction of a polishing pad
12/03/1997CN1166805A Chemical mechanical polishing slurry for metal layers
12/02/1997US5693239 Polishing slurries comprising two abrasive components and methods for their use
12/02/1997US5692950 Abrasive construction for semiconductor wafer modification
12/02/1997US5692947 Linear polisher and method for semiconductor wafer planarization
11/1997
11/27/1997WO1997044160A1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
11/26/1997EP0808231A1 Chemical-mechanical polishing using curved carriers
11/26/1997EP0808230A1 Chemical-mechanical polishing of thin materials using a pulse polishing technique
11/26/1997CN1165727A method of and apparatus for polishing wafer
11/25/1997US5691253 Forming layer over patterned substrate, wherein the layer has first exposed surface lying in a first elevation, and a second elevation that is different from the first elevation, polishing to form second exposed surface, analyzing
11/25/1997US5690542 Disc streak pattern forming method and apparatus
11/25/1997US5690540 Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers
11/20/1997WO1997043091A1 Abrasive foam grinding composition
11/19/1997EP0807673A1 Protective adhesive foil for optical glasses and process for removing it
11/19/1997EP0807492A2 Method for polishing workpieces and apparatus therefor
11/18/1997US5689693 Range finding circuit for selecting a consecutive sequence of reorder buffer entries using circular carry lookahead
11/18/1997US5688364 Semiconductor wafers
11/12/1997EP0806267A1 Cross-hatched polishing pad for polishing substrates in a chemical mechanical polishing system
11/12/1997EP0806266A2 Polishing method and polishing apparatus using the same
11/12/1997EP0806265A1 Precision polishing apparatus
11/11/1997US5685947 Chemical-mechanical polishing with an embedded abrasive
11/11/1997US5685766 Polishing control method
11/05/1997EP0805000A1 Semiconductor wafer post-polish clean and dry method and apparatus
11/05/1997EP0674565B1 Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles
11/05/1997CN2266481Y Multi-axle lapping machine
11/04/1997US5683289 CMP polishing pad conditioning apparatus
10/1997
10/30/1997WO1997040525A1 Chemical-mechanical planarization apparatus and method
10/30/1997DE19715460A1 Poliervorrichtung mit verbesserter Führung eines flüssigen Poliermediums Polishing apparatus with improved management of liquid polishing medium
10/29/1997EP0803329A2 Polishing machine
10/29/1997EP0803328A1 Polishing system for polishing wafer
10/29/1997EP0803327A2 Apparatus and method for shaping polishing pads
10/29/1997CN1163180A Scraping method for fixed binding surface in position of grinding point
10/28/1997US5681423 Support pillar positioned in cavity to support polishing pad during planarization
10/28/1997US5681215 Carrier head design for a chemical mechanical polishing apparatus
10/28/1997US5681212 Polishing device and correcting method therefor
10/21/1997US5679212 Etchant containing no loose abrasives and permitting selective etching of deformed layers
10/21/1997US5679065 Wafer carrier having carrier ring adapted for uniform chemical-mechanical planarization of semiconductor wafers
10/21/1997US5679064 Polishing apparatus including detachable cloth cartridge
10/21/1997US5679063 Polishing apparatus
10/21/1997US5679060 Wafer grinding machine
10/21/1997US5679059 Method of polishing a surface of a workpiece
10/21/1997US5679055 Automated wafer lapping system
10/16/1997WO1997037813A1 Method and structure for polishing a wafer during manufacture of integrated circuits
10/16/1997WO1997037812A1 Device for preparing metallographic samples
10/15/1997EP0800896A2 Endpoint detection for chemical mechanical polishing using frequency or amplitude mode
10/15/1997CN1161998A 抛光剂 Polishes
10/14/1997US5676590 Polishing apparatus provided with abrasive cloth
10/07/1997US5674352 Process related to a modified polishing pad for polishing
10/07/1997US5674115 Apparatus for grinding a master disc
10/07/1997US5674109 Apparatus and method for polishing workpiece
10/07/1997US5674107 Diamond polishing method and apparatus employing oxygen-emitting medium
10/01/1997EP0798355A2 Base material for adhesive tape
10/01/1997EP0798080A1 Lapping apparatus and method
10/01/1997EP0798078A2 Method for manufacturing backing pad and apparatus used therefor
09/1997
09/30/1997US5672577 Stripper solution also contains water, 1,2-dihydroxybenzene or derivatives, mercaptophenol/o-/ or mercaptobenzoic acid/o-/, and ethylenediaminetetracarboxylic acid as chelating agents to provide stability and effectiveness
09/30/1997US5672382 Composite powder particle, composite body and method of preparation
09/30/1997US5672095 Elimination of pad conditioning in a chemical mechanical polishing process
09/30/1997US5672093 Specimen load control mechanism for automatic polishing apparatus
09/30/1997US5672091 Polishing apparatus having endpoint detection device
09/23/1997US5670410 End-point detection
09/23/1997US5670011 Apparatus and method for polishing workpiece
09/18/1997WO1997033716A1 Tribochemical polishing of ceramics and metals
09/17/1997CN2262468Y Lapping aid with irregular shaft end
09/16/1997US5667567 Ethyl silicate monomer and/or polymer
09/16/1997US5667433 Keyed end effector for CMP pad conditioner
09/16/1997US5667426 Surface treatment using an abrasive sheet having alumina particles disposed in resin film with silicon dioxide colloidal particles
09/10/1997CN2261911Y Grinder
09/09/1997US5665249 Micro-electromechanical die module with planarized thick film layer
09/09/1997US5665201 High removal rate chemical-mechanical polishing
09/09/1997US5664990 Slurry recycling in CMP apparatus
09/09/1997US5664989 Polishing pad, polishing apparatus and polishing method
09/09/1997US5664988 Process of polishing a semiconductor wafer having an orientation edge discontinuity shape
09/09/1997US5664987 Methods and apparatus for control of polishing pad conditioning for wafer planarization
09/09/1997US5664986 Apparatus for polishing a dielectric layer formed on a substrate
09/03/1997EP0792721A1 Polishing apparatus
09/02/1997US5663797 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
09/02/1997US5663637 Rotary signal coupling for chemical mechanical polishing endpoint detection with a westech tool
08/1997
08/28/1997DE19605588A1 Method for finishing piston track in internal combustion engines
08/27/1997EP0791431A1 Workpiece holding mechanism