Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
05/1999
05/04/1999US5899745 Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor
05/04/1999US5899743 Method for fabricating semiconductor wafers
04/1999
04/28/1999EP0911115A1 Polishing apparatus
04/28/1999EP0911114A2 Polishing apparatus
04/27/1999US5897426 Chemical mechanical polishing with multiple polishing pads
04/27/1999US5897425 Vertical polishing tool and method
04/27/1999US5897424 Renewable polishing lap
04/27/1999US5897375 Improved throughput; reduced corrosion; pitting, performance yield; interconnects in integrated circuits,
04/27/1999US5896870 Method of removing slurry particles
04/21/1999EP0909610A2 Liquid dispensing apparatus and method
04/21/1999EP0909311A1 Post clean treatment
04/20/1999US5895583 Reduces polishing time to a matter of hours.
04/20/1999US5895550 To enhance the planarization of semiconductor substrate wafer surfaces.
04/20/1999US5895509 Abrasive composition
04/20/1999US5895315 Recovery device for polishing agent and deionizing water for a polishing machine
04/20/1999US5895270 Chemical mechanical polishing method and apparatus
04/15/1999WO1999018600A1 Apparatus and method for cleaning semiconductor wafer
04/14/1999EP0908487A2 Preparation of expanded fluorine type resin products
04/14/1999EP0907460A1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
04/14/1999EP0784517B1 Process and device for thoroughly cleaning surfaces
04/13/1999US5893983 Technique for removing defects from a layer of metal
04/13/1999US5893796 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
04/13/1999US5893795 Apparatus for moving a cassette
04/13/1999US5893755 Method of polishing a semiconductor wafer
04/13/1999US5893754 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
04/13/1999US5893753 Vibrating polishing pad conditioning system and method
04/08/1999WO1999016578A1 Chemical and mechanical planishing method and device to carry out said method
04/08/1999DE19743721A1 Spent grinding suspension, used for machining silicon, quartz or ceramic, is reprocessed
04/07/1999CN1212919A Chemical mechanical polishing method suitable for highly accurate planarization
04/06/1999US5891353 Polishing agent used for polishing semiconductor wafers and polishing method using the same
04/06/1999US5890951 Utility wafer for chemical-mechanical planarization
04/01/1999WO1999015312A1 Polishing machine including a platform assembly mounted on three columns
04/01/1999WO1999015311A1 Abrasive articles comprising a fluorochemical agent for wafer surface modification
03/1999
03/31/1999EP0904895A2 Substrate polishing method and apparatus
03/30/1999US5888126 Polishing apparatus including turntable with polishing surface of different heights
03/30/1999US5888124 Apparatus for polishing and cleaning a wafer
03/30/1999US5888121 Controlling groove dimensions for enhanced slurry flow
03/30/1999US5888120 Method and apparatus for chemical mechanical polishing
03/30/1999US5887974 Slurry mixing apparatus and method
03/25/1999DE19740529A1 Sample holder for grinding fixture
03/24/1999CN1211487A Polishing machine with improved polishing pad structure
03/23/1999US5885147 Apparatus for conditioning polishing pads
03/23/1999US5885140 Single-side abrasion apparatus with dresser
03/23/1999US5885138 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
03/23/1999US5885137 Chemical mechanical polishing pad conditioner
03/23/1999US5885134 Polishing apparatus
03/23/1999US5885131 Interactive device for lapping transducers
03/18/1999WO1999013498A2 Combined cmp and wafer cleaning apparatus and associated methods
03/18/1999DE19737854A1 Vorrichtung und Verfahren zum Reinigen von Polierpads, beispielsweise Poliertüchern, insbesondere für das Polieren von Wafern Apparatus and method for cleaning the polishing pad, for example, polishing cloths, particularly for polishing wafers
03/16/1999US5882539 Wafer processing method and equipment therefor
03/16/1999US5882251 Chemical mechanical polishing pad slurry distribution grooves
03/16/1999US5882248 Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
03/16/1999US5882245 Polymer carrier gears for polishing of flat objects
03/16/1999US5882244 Polishing apparatus
03/16/1999US5882243 Method for polishing a semiconductor wafer using dynamic control
03/11/1999WO1999011433A1 Device and method for cleaning polishing pads, such as polishing cloths, especially for polishing wafers
03/11/1999WO1999011432A1 Device and method for heating a liquid or semiliquid polishing agent, and device for polishing wafers
03/11/1999WO1999011427A1 Cavitational polishing pad conditioner
03/11/1999DE19737849A1 Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern Device and method for heating a liquid or viscous as well as polishing agent for polishing wafers device
03/10/1999EP0900630A2 End-face polishing and cleaning apparatus
03/09/1999US5879226 Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
03/09/1999US5879225 Polishing machine
03/09/1999US5879222 Abrasive polishing pad with covalently bonded abrasive particles
03/09/1999US5879220 Apparatus for mirror-polishing thin plate
03/09/1999US5878973 Tool for peeling turntable polishing cloth
03/05/1999CA2243125A1 End-face polishing and cleaning apparatus
03/04/1999WO1999010129A1 A pad for chemical-mechanical polishing and apparatus and methods of manufacture thereof
03/03/1999EP0899005A1 Aqueous dispersion slurry of inorganic particles and production methods thereof
03/02/1999US5877088 Flattening method and apparatus for semiconductor device
03/02/1999US5876508 Method of cleaning slurry remnants after the completion of a chemical-mechanical polish process
03/02/1999US5876490 Polish process and slurry for planarization
03/02/1999US5876273 Apparatus for polishing a wafer
03/02/1999US5876272 Semiconductor wafer polishing machine
03/02/1999US5876271 Slurry injection and recovery method and apparatus for chemical-mechanical polishing process
03/02/1999US5876269 Apparatus and method for polishing semiconductor device
03/02/1999US5876266 Polishing pad with controlled release of desired micro-encapsulated polishing agents
03/02/1999US5876265 End point polishing apparatus and polishing method
03/02/1999US5875559 Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system
02/1999
02/25/1999WO1999009371A1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
02/25/1999WO1999008837A1 An abrasive means and a grinding process
02/24/1999EP0897811A1 Surface treatment method and apparatus for support of lithographic plate and grinding apparatus for graining brush
02/23/1999US5873772 Method for polishing the top and bottom of a semiconductor wafer simultaneously
02/23/1999US5873769 Temperature compensated chemical mechanical polishing to achieve uniform removal rates
02/18/1999WO1999007518A1 Continuously variable planarization and polishing pad system
02/18/1999WO1999007516A1 A carrier head with local pressure control for a chemical mechanical polishing apparatus
02/18/1999WO1999007515A1 Improved polishing pads and methods relating thereto
02/17/1999EP0896859A2 Wafer polishing apparatus
02/17/1999CN1208248A Mechanical-chemical polishing method for semiconductor or insulation material layer
02/16/1999US5871393 Without a template, water repellence is conferred on at least the surface skin layer of this sheet of continuous porous structure
02/16/1999US5871392 Under-pad for chemical-mechanical planarization of semiconductor wafers
02/16/1999US5871390 Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing
02/11/1999WO1999006182A1 Polishing semiconductor wafers
02/10/1999EP0896042A1 A polishing composition including an inhibitor of tungsten etching
02/10/1999CN1207334A Lapping apparatus, lapping jig for use therein and workpiece mounting member attached to lapping jig
02/09/1999US5868953 Method for manufacturing a magnetic disk substrate
02/09/1999US5868896 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
02/09/1999US5868857 Rotating belt wafer edge cleaning apparatus
02/09/1999US5868610 Mehtod and aparatus for polishing semiconductor substrate
02/09/1999US5868609 Wafer carrier rotating head assembly for chemical-mechanical polishing apparatus
02/09/1999US5868608 Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus