Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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05/04/1999 | US5899745 Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor |
05/04/1999 | US5899743 Method for fabricating semiconductor wafers |
04/28/1999 | EP0911115A1 Polishing apparatus |
04/28/1999 | EP0911114A2 Polishing apparatus |
04/27/1999 | US5897426 Chemical mechanical polishing with multiple polishing pads |
04/27/1999 | US5897425 Vertical polishing tool and method |
04/27/1999 | US5897424 Renewable polishing lap |
04/27/1999 | US5897375 Improved throughput; reduced corrosion; pitting, performance yield; interconnects in integrated circuits, |
04/27/1999 | US5896870 Method of removing slurry particles |
04/21/1999 | EP0909610A2 Liquid dispensing apparatus and method |
04/21/1999 | EP0909311A1 Post clean treatment |
04/20/1999 | US5895583 Reduces polishing time to a matter of hours. |
04/20/1999 | US5895550 To enhance the planarization of semiconductor substrate wafer surfaces. |
04/20/1999 | US5895509 Abrasive composition |
04/20/1999 | US5895315 Recovery device for polishing agent and deionizing water for a polishing machine |
04/20/1999 | US5895270 Chemical mechanical polishing method and apparatus |
04/15/1999 | WO1999018600A1 Apparatus and method for cleaning semiconductor wafer |
04/14/1999 | EP0908487A2 Preparation of expanded fluorine type resin products |
04/14/1999 | EP0907460A1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
04/14/1999 | EP0784517B1 Process and device for thoroughly cleaning surfaces |
04/13/1999 | US5893983 Technique for removing defects from a layer of metal |
04/13/1999 | US5893796 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
04/13/1999 | US5893795 Apparatus for moving a cassette |
04/13/1999 | US5893755 Method of polishing a semiconductor wafer |
04/13/1999 | US5893754 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
04/13/1999 | US5893753 Vibrating polishing pad conditioning system and method |
04/08/1999 | WO1999016578A1 Chemical and mechanical planishing method and device to carry out said method |
04/08/1999 | DE19743721A1 Spent grinding suspension, used for machining silicon, quartz or ceramic, is reprocessed |
04/07/1999 | CN1212919A Chemical mechanical polishing method suitable for highly accurate planarization |
04/06/1999 | US5891353 Polishing agent used for polishing semiconductor wafers and polishing method using the same |
04/06/1999 | US5890951 Utility wafer for chemical-mechanical planarization |
04/01/1999 | WO1999015312A1 Polishing machine including a platform assembly mounted on three columns |
04/01/1999 | WO1999015311A1 Abrasive articles comprising a fluorochemical agent for wafer surface modification |
03/31/1999 | EP0904895A2 Substrate polishing method and apparatus |
03/30/1999 | US5888126 Polishing apparatus including turntable with polishing surface of different heights |
03/30/1999 | US5888124 Apparatus for polishing and cleaning a wafer |
03/30/1999 | US5888121 Controlling groove dimensions for enhanced slurry flow |
03/30/1999 | US5888120 Method and apparatus for chemical mechanical polishing |
03/30/1999 | US5887974 Slurry mixing apparatus and method |
03/25/1999 | DE19740529A1 Sample holder for grinding fixture |
03/24/1999 | CN1211487A Polishing machine with improved polishing pad structure |
03/23/1999 | US5885147 Apparatus for conditioning polishing pads |
03/23/1999 | US5885140 Single-side abrasion apparatus with dresser |
03/23/1999 | US5885138 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
03/23/1999 | US5885137 Chemical mechanical polishing pad conditioner |
03/23/1999 | US5885134 Polishing apparatus |
03/23/1999 | US5885131 Interactive device for lapping transducers |
03/18/1999 | WO1999013498A2 Combined cmp and wafer cleaning apparatus and associated methods |
03/18/1999 | DE19737854A1 Vorrichtung und Verfahren zum Reinigen von Polierpads, beispielsweise Poliertüchern, insbesondere für das Polieren von Wafern Apparatus and method for cleaning the polishing pad, for example, polishing cloths, particularly for polishing wafers |
03/16/1999 | US5882539 Wafer processing method and equipment therefor |
03/16/1999 | US5882251 Chemical mechanical polishing pad slurry distribution grooves |
03/16/1999 | US5882248 Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers |
03/16/1999 | US5882245 Polymer carrier gears for polishing of flat objects |
03/16/1999 | US5882244 Polishing apparatus |
03/16/1999 | US5882243 Method for polishing a semiconductor wafer using dynamic control |
03/11/1999 | WO1999011433A1 Device and method for cleaning polishing pads, such as polishing cloths, especially for polishing wafers |
03/11/1999 | WO1999011432A1 Device and method for heating a liquid or semiliquid polishing agent, and device for polishing wafers |
03/11/1999 | WO1999011427A1 Cavitational polishing pad conditioner |
03/11/1999 | DE19737849A1 Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern Device and method for heating a liquid or viscous as well as polishing agent for polishing wafers device |
03/10/1999 | EP0900630A2 End-face polishing and cleaning apparatus |
03/09/1999 | US5879226 Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers |
03/09/1999 | US5879225 Polishing machine |
03/09/1999 | US5879222 Abrasive polishing pad with covalently bonded abrasive particles |
03/09/1999 | US5879220 Apparatus for mirror-polishing thin plate |
03/09/1999 | US5878973 Tool for peeling turntable polishing cloth |
03/05/1999 | CA2243125A1 End-face polishing and cleaning apparatus |
03/04/1999 | WO1999010129A1 A pad for chemical-mechanical polishing and apparatus and methods of manufacture thereof |
03/03/1999 | EP0899005A1 Aqueous dispersion slurry of inorganic particles and production methods thereof |
03/02/1999 | US5877088 Flattening method and apparatus for semiconductor device |
03/02/1999 | US5876508 Method of cleaning slurry remnants after the completion of a chemical-mechanical polish process |
03/02/1999 | US5876490 Polish process and slurry for planarization |
03/02/1999 | US5876273 Apparatus for polishing a wafer |
03/02/1999 | US5876272 Semiconductor wafer polishing machine |
03/02/1999 | US5876271 Slurry injection and recovery method and apparatus for chemical-mechanical polishing process |
03/02/1999 | US5876269 Apparatus and method for polishing semiconductor device |
03/02/1999 | US5876266 Polishing pad with controlled release of desired micro-encapsulated polishing agents |
03/02/1999 | US5876265 End point polishing apparatus and polishing method |
03/02/1999 | US5875559 Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system |
02/25/1999 | WO1999009371A1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
02/25/1999 | WO1999008837A1 An abrasive means and a grinding process |
02/24/1999 | EP0897811A1 Surface treatment method and apparatus for support of lithographic plate and grinding apparatus for graining brush |
02/23/1999 | US5873772 Method for polishing the top and bottom of a semiconductor wafer simultaneously |
02/23/1999 | US5873769 Temperature compensated chemical mechanical polishing to achieve uniform removal rates |
02/18/1999 | WO1999007518A1 Continuously variable planarization and polishing pad system |
02/18/1999 | WO1999007516A1 A carrier head with local pressure control for a chemical mechanical polishing apparatus |
02/18/1999 | WO1999007515A1 Improved polishing pads and methods relating thereto |
02/17/1999 | EP0896859A2 Wafer polishing apparatus |
02/17/1999 | CN1208248A Mechanical-chemical polishing method for semiconductor or insulation material layer |
02/16/1999 | US5871393 Without a template, water repellence is conferred on at least the surface skin layer of this sheet of continuous porous structure |
02/16/1999 | US5871392 Under-pad for chemical-mechanical planarization of semiconductor wafers |
02/16/1999 | US5871390 Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing |
02/11/1999 | WO1999006182A1 Polishing semiconductor wafers |
02/10/1999 | EP0896042A1 A polishing composition including an inhibitor of tungsten etching |
02/10/1999 | CN1207334A Lapping apparatus, lapping jig for use therein and workpiece mounting member attached to lapping jig |
02/09/1999 | US5868953 Method for manufacturing a magnetic disk substrate |
02/09/1999 | US5868896 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers |
02/09/1999 | US5868857 Rotating belt wafer edge cleaning apparatus |
02/09/1999 | US5868610 Mehtod and aparatus for polishing semiconductor substrate |
02/09/1999 | US5868609 Wafer carrier rotating head assembly for chemical-mechanical polishing apparatus |
02/09/1999 | US5868608 Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus |