| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 06/23/1994 | WO1994013847A1 Method of manufacturing cast iron of high strength and low expansion |
| 06/23/1994 | WO1994013434A1 Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles |
| 06/23/1994 | CA2151932A1 Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles |
| 06/14/1994 | US5321304 Detecting the endpoint of chem-mech polishing, and resulting semiconductor device |
| 06/14/1994 | US5320706 Removing slurry residue from semiconductor wafer planarization |
| 06/07/1994 | US5317837 Device on a double disk lapping machine |
| 06/01/1994 | EP0599299A1 Method and apparatus for polishing a workpiece |
| 05/25/1994 | EP0598190A1 Apparatus for polishing wafer |
| 05/18/1994 | EP0597709A1 Means and method for fabrication of grazing incidence optics |
| 05/18/1994 | CN2164949Y Guide aerodynamic turbine grinder |
| 05/18/1994 | CN2164948Y Surface abrasive polishing machine capable of grinding inner concave surface and external convex surface |
| 05/10/1994 | US5310455 Bonding strength |
| 05/10/1994 | US5310441 Wafer binding method and apparatus |
| 05/03/1994 | US5308438 Providing a polishing pad coated with a slurry, rotating workpiece on pad, controlling rotational speed of workpiece and applying pressure, and monitoring current drawn by motor |
| 04/27/1994 | CN2163025Y Iron pot polishing machine |
| 04/27/1994 | CN2163024Y Precision finishing machine with correcting ring |
| 04/20/1994 | EP0593057A1 Planarization apparatus and method for performing a planarization operation |
| 04/13/1994 | CN2161422Y Sand cylinder |
| 04/12/1994 | US5302233 Method for shaping features of a semiconductor structure using chemical mechanical planarization (CMP) |
| 04/12/1994 | US5301470 Ball lapping machine |
| 04/06/1994 | EP0590871A1 Thinning a diamond body by means of molten rare-earth-containing alloys |
| 04/05/1994 | US5300188 Depositing patterned polish stopping layer on substrate, depositing diamond layer, polishing down to stopping layer |
| 04/05/1994 | US5300155 IC chemical mechanical planarization process incorporating slurry temperature control |
| 04/05/1994 | US5300130 Diamond particles and alumina particles in suspension |
| 04/05/1994 | US5299393 Slurry containment device for polishing semiconductor wafers |
| 03/30/1994 | EP0589434A1 Polishing apparatus |
| 03/30/1994 | EP0589433A1 Polishing apparatus |
| 03/29/1994 | US5297364 Polishing pad with controlled abrasion rate |
| 03/29/1994 | US5297361 Polishing machine with an improved sample holding table |
| 03/23/1994 | CN2159287Y Spile of finishing machine |
| 03/16/1994 | CN1083758A Precision lapping machine with correction ring |
| 03/15/1994 | US5294309 Electro-abrasive polishing of the inner surface of pipes to extra-smooth mirror finish |
| 03/09/1994 | CN2158325Y Lapping machine for ferrite article |
| 03/08/1994 | US5291693 For removing particulate from a lapping surface |
| 03/08/1994 | CA1327453C Aluminum oxide/aluminum oxynitride/group ivb metal nitride abrasive particles derived from a sol-gel process |
| 03/03/1994 | WO1994004599A1 Polymeric substrate with polymeric microelements |
| 03/02/1994 | EP0584905A1 Apparatus for wafer chamfer polishing |
| 03/02/1994 | CN2157850Y Lapping machine |
| 02/23/1994 | CN1082567A A polymeric substrate containing polymeric microelements and methods of making and using the same |
| 02/22/1994 | US5287663 Polishing pad and method for polishing semiconductor wafers |
| 02/08/1994 | US5284803 Metod of manufacturing a semiconductor body using a carrier wafer and a monocrystalline semiconducting top layer |
| 02/08/1994 | US5284524 Method and apparatus for enhancing surface treatment of perforated materials |
| 02/02/1994 | EP0581350A1 Slurry containment device for polishing semiconductor wafers |
| 02/01/1994 | US5283680 Optical connector assembly |
| 01/26/1994 | EP0580162A1 Wafer with defined grinded warp and process for manufacturing |
| 01/26/1994 | CN2154148Y Three-ring plane abrader |
| 01/19/1994 | EP0579298A1 Method of manufacturing a plate having a plane main surface, method of manufacturing a plate having parallel main surfaces, and device suitable for implementing said methods |
| 01/19/1994 | CN2153436Y 砂磨机 Sander |
| 01/19/1994 | CN1080889A 研磨机 Grinder |
| 01/18/1994 | US5279771 Removal photoresist from substrate |
| 01/12/1994 | EP0578507A2 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
| 01/12/1994 | EP0578351A1 Elastic foamed sheet and wafer-polishing jig using the sheet |
| 01/11/1994 | US5277702 Plately alumina |
| 01/05/1994 | EP0577537A1 Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
| 01/04/1994 | US5274960 Uniform velocity double sided finishing machine |
| 12/28/1993 | US5272844 Polishing fixture with adjustable sample mount with adjustable weight |
| 12/23/1993 | WO1993025347A1 Wafer polishing method and apparatus |
| 12/22/1993 | CN2150017Y Lapping-head of stone-lapping machine |
| 12/08/1993 | CN2148638Y Gas-filling temperature-controlling wet-type finishing machine |
| 12/07/1993 | US5267418 Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
| 11/30/1993 | US5265378 Detecting the endpoint of chem-mech polishing and resulting semiconductor device |
| 11/11/1993 | DE4314152A1 Appts. to eliminate tendency of wafer substrates to swing in semiconductor processing - comprising elastically deformable ring with its inner periphery lying next to source |
| 11/03/1993 | EP0567894A1 Device for guiding a workpiece or a tool while machining toric or spheric surfaces of ophtalmic lenses on grinding or polishing machines |
| 11/02/1993 | USRE34425 Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer |
| 11/02/1993 | US5257478 Apparatus for interlayer planarization of semiconductor material |
| 10/28/1993 | WO1993017829A3 System and method for texturing magnetic data storage disks |
| 10/20/1993 | EP0566258A1 Improved slurry polisher using ultrasonic agitation |
| 10/20/1993 | EP0566218A2 Method for finding a preferred spot for a laser beam of a laser beam interferometer and laser interferometer apparatus |
| 10/20/1993 | EP0566217A2 Method and apparatus for focussing a beam of radiant energy |
| 10/20/1993 | CN1077406A Method for polishing plate and apparatus therefor |
| 10/19/1993 | US5254205 Wafer binding method and apparatus |
| 10/06/1993 | EP0563954A1 Method for polishing plate and apparatus therefor |
| 10/03/1993 | CA2093046A1 Method for polishing plate and apparatus therefor |
| 09/29/1993 | EP0562718A1 Polishing machine and method of dissipating heat therefrom |
| 09/28/1993 | US5248318 Lapping abrasive of alumina-zirconia system and method for producing the same |
| 09/28/1993 | US5248024 Wafer mounting device having position indicator |
| 09/22/1993 | EP0560902A1 Composite monolithic lap and a method of making the same |
| 09/21/1993 | US5246525 Apparatus for polishing |
| 09/21/1993 | US5245796 Slurry polisher using ultrasonic agitation |
| 09/21/1993 | US5245794 Audio end point detector for chemical-mechanical polishing and method therefor |
| 09/21/1993 | US5245790 Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers |
| 09/16/1993 | WO1993017829A2 System and method for texturing magnetic data storage disks |
| 09/15/1993 | CN1076152A Apparatus for interlayer planarization of semiconductor material |
| 09/07/1993 | US5242524 Device for detecting an end point in polishing operations |
| 08/31/1993 | US5240552 Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection |
| 08/18/1993 | EP0555660A2 Apparatus for interlayer planarization of semiconductor material |
| 08/11/1993 | EP0554908A1 Fine alpha alumina particles, their production and use |
| 08/11/1993 | CN1075110A Cover operating device for a grinding drum and grinding device |
| 08/10/1993 | US5234867 Method for planarizing semiconductor wafers with a non-circular polishing pad |
| 08/03/1993 | US5232875 Method and apparatus for improving planarity of chemical-mechanical planarization operations |
| 07/29/1993 | DE4302067A1 Chemical-mechanical planarising - by turning semiconductor wafer, planarising, and polishing wafer |
| 07/20/1993 | US5229656 Optical comparator circuit |
| 07/20/1993 | US5228243 Support for a mirror blank |
| 07/14/1993 | CN2138009Y Platinum finisher for vehicle |
| 07/13/1993 | US5226955 Polishing composition for memory hard disc |
| 07/13/1993 | US5226758 Method and an apparatus for handling wafers |
| 07/11/1993 | CA2086447A1 Foam buffing pad having a finishing surface with a splash reducing configuration |
| 07/06/1993 | US5224304 Automated free abrasive machine for one side piece part machining |
| 06/30/1993 | EP0548846A1 Wafer polisher head having floating retainer ring |
| 06/29/1993 | US5222329 Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials |