| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 01/19/2000 | CN1241782A Reduced voltage input/reduced voltage output tri-state buffers and methods therefor |
| 01/19/2000 | CN1241469A Chemical and mechanical grinder |
| 01/18/2000 | US6015754 Chemical mechanical polishing apparatus and method |
| 01/18/2000 | US6015499 Filter media for physically separating agglomerations of abrasive particles from a chemical-mechanical polishing process slurry stream |
| 01/18/2000 | US6015337 Polishing apparatus |
| 01/18/2000 | US6015333 Method of forming planarized layers in an integrated circuit |
| 01/12/2000 | CN1240696A Surface polishing machine |
| 01/11/2000 | US6014218 Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components |
| 01/11/2000 | US6012970 Process for forming a semiconductor device |
| 01/11/2000 | US6012968 Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
| 01/11/2000 | US6012967 Polishing method and polishing apparatus |
| 01/11/2000 | US6012966 Precision polishing apparatus with detecting means |
| 01/11/2000 | US6012964 Carrier and CMP apparatus |
| 01/06/2000 | WO2000000873A1 System and method for controlling a multi-arm polishing tool |
| 01/06/2000 | WO2000000560A2 Chemical mechanical polishing slurry and method for using same |
| 01/06/2000 | CA2335035A1 Chemical mechanical polishing slurry and method for using same |
| 01/05/2000 | CN1048118C Method of rough polishing semiconductor wafes to reduce surface roughness |
| 01/04/2000 | US6010538 In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link |
| 01/04/2000 | US6010395 Chemical-mechanical polishing apparatus |
| 01/04/2000 | US6010392 Die thinning apparatus |
| 01/04/2000 | US6010010 Process for reclaiming a grinding suspension |
| 12/29/1999 | WO1999067054A1 Wafer edge polishing method and apparatus |
| 12/29/1999 | EP0967634A1 Method of producing semiconductor wafer |
| 12/29/1999 | EP0967049A1 Polishing apparatus |
| 12/29/1999 | EP0967048A1 Two-sided flattening apparatus |
| 12/29/1999 | EP0966338A1 Integrated pad and belt for chemical mechanical polishing |
| 12/28/1999 | US6007411 Wafer carrier for chemical mechanical polishing |
| 12/28/1999 | US6007409 Sample holder for parallel lapping tool and method of using |
| 12/28/1999 | US6007408 Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates |
| 12/28/1999 | US6007407 Abrasive construction for semiconductor wafer modification |
| 12/28/1999 | US6007406 Polishing systems, methods of polishing substrates, and method of preparing liquids for semiconductor fabrication process |
| 12/28/1999 | US6007405 Method and apparatus for endpoint detection for chemical mechanical polishing using electrical lapping |
| 12/28/1999 | CA2007805C Buffing composition |
| 12/23/1999 | WO1999066546A1 Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context |
| 12/23/1999 | WO1999066544A1 A technique for chemical mechanical polishing silicon |
| 12/23/1999 | WO1999065649A1 Method and apparatus for improved semiconductor wafer polishing |
| 12/23/1999 | WO1999065592A1 Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization |
| 12/23/1999 | DE19927490A1 Verfahren und Vorrichtung zum verbesserten Polieren von Halbleiterwafern Method and apparatus for improved polishing of semiconductor wafers |
| 12/23/1999 | CA2335175A1 Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization |
| 12/22/1999 | EP0822884B1 A polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine |
| 12/22/1999 | CN1239278A Apparatus and method for lapping magnetic heads |
| 12/21/1999 | US6004880 Polishing integrated circuit while concurrently applying voltage; electrolysis |
| 12/21/1999 | US6004193 Dual purpose retaining ring and polishing pad conditioner |
| 12/21/1999 | US6003361 System for predicting accurate MR sensor height |
| 12/16/1999 | WO1999064205A1 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 12/15/1999 | CN2353486Y Grinder for treating side edge of sole shoe |
| 12/14/1999 | US6001007 Template used for polishing a semiconductor wafer |
| 12/14/1999 | US6001005 Polishing apparatus |
| 12/14/1999 | US6001001 Apparatus and method for chemical mechanical polishing of a wafer |
| 12/14/1999 | US6000999 Preparatory abrading method for support of lithographic plate |
| 12/14/1999 | US6000997 Temperature regulation in a CMP process |
| 12/09/1999 | WO1999062673A1 Improved polishing pad with reduced moisture absorption |
| 12/09/1999 | WO1999062672A1 A carrier head with a multilayer retaining ring for chemical mechanical polishing |
| 12/09/1999 | WO1999062671A1 Apparatus for polishing silicon wafers |
| 12/08/1999 | CN1237783A Wafer polishing apparatus and backing pad for wafer polishing |
| 12/07/1999 | US5997620 Polishing composition |
| 12/07/1999 | US5997392 Slurry injection technique for chemical-mechanical polishing |
| 12/07/1999 | US5997390 Polishing apparatus with improved alignment of polishing plates |
| 12/07/1999 | US5997385 Method and apparatus for polishing semiconductor substrate |
| 12/07/1999 | US5996594 Post-chemical mechanical planarization clean-up process using post-polish scrubbing |
| 12/02/1999 | WO1999061540A1 Cmp slurry containing a solid catalyst |
| 12/02/1999 | CA2336482A1 Cmp slurry containing a solid catalyst |
| 12/01/1999 | EP0960694A1 Wafer polishing apparatus and backing pad for wafer polishing |
| 12/01/1999 | EP0960693A2 A polishing machine |
| 12/01/1999 | EP0960692A2 Machining apparatus |
| 12/01/1999 | EP0960655A2 Method for grinding silicon metalloid |
| 12/01/1999 | EP0960436A1 Method of preparing silicon carbide wafers for epitaxial growth |
| 12/01/1999 | EP0959719A1 A brush assembly apparatus |
| 11/30/1999 | US5996067 Range finding circuit for selecting a consecutive sequence of reorder buffer entries using circular carry lookahead |
| 11/30/1999 | US5994224 IC mechanical planarization process incorporating two slurry compositions for faster material removal times |
| 11/30/1999 | US5993686 Fluoride additive containing chemical mechanical polishing slurry and method for use of same |
| 11/30/1999 | US5993647 Circulation system of slurry |
| 11/30/1999 | US5993303 Hand-held cutting tool for cutting fiber-cement siding |
| 11/30/1999 | US5993302 Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
| 11/30/1999 | US5993299 Method and apparatus of uninterrupted slurry supply |
| 11/30/1999 | US5993298 Lapping apparatus and process with controlled liquid flow across the lapping surface |
| 11/30/1999 | US5993293 Method and apparatus for improved semiconductor wafer polishing |
| 11/30/1999 | US5993291 Specimen block preparation for TEM analysis |
| 11/30/1999 | US5993289 Methods for the in-process detection of workpieces in a CMP environment |
| 11/25/1999 | WO1999059776A1 Substrate retainer |
| 11/25/1999 | WO1999059775A1 Wafer polishing with improved backing arrangement |
| 11/24/1999 | CN1236184A Polishing apparatus |
| 11/23/1999 | US5990012 Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads |
| 11/23/1999 | US5990010 Pre-conditioning polishing pads for chemical-mechanical polishing |
| 11/23/1999 | US5989470 Curing within a mold a liquid matrix material which encapsulates uniformly distributed microcolumns arranged in parallel to form a pad body with interspersed microcolumns, cutting into individual pads |
| 11/23/1999 | US5989301 Optical polishing formulation |
| 11/23/1999 | US5989107 Method for polishing workpieces and apparatus therefor |
| 11/23/1999 | US5989104 Workpiece carrier with monopiece pressure plate and low gimbal point |
| 11/18/1999 | WO1999059201A1 Polished ceramic chuck for low backside particles in semiconductor plasma processing |
| 11/18/1999 | WO1999058297A1 A carrier head with a retaining ring for a chemical mechanical polishing system |
| 11/17/1999 | CN1235698A Cerium oxide abrasive and method of abrading substrates |
| 11/16/1999 | US5985679 Automated endpoint detection system during chemical-mechanical polishing |
| 11/16/1999 | US5985094 Semiconductor wafer carrier |
| 11/16/1999 | US5985093 Chemical-mechanical polish (CMP) pad conditioner |
| 11/16/1999 | US5985090 Polishing cloth and polishing apparatus having such polishing cloth |
| 11/16/1999 | US5985045 Polishing semiconductor in polisher with polishing fluid including two components mixed within polisher and flowed through tube before reaching substrate |
| 11/16/1999 | US5984769 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| 11/16/1999 | US5984764 Method of dressing an abrasive cloth and apparatus therefor |
| 11/11/1999 | WO1999056972A1 Indirect endpoint detection by chemical reaction and chemiluminescence |
| 11/10/1999 | EP0954408A1 Polishing apparatus |