Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
02/1996
02/27/1996US5494473 Electrical access for electrical lapping guides
02/22/1996WO1996005497A1 Polishing device with specimen-holder
02/21/1996CN1117203A Method of rough polishing semiconductor wafers to reduce surface roughness
02/20/1996US5492594 Chemical-mechanical polishing tool with end point measurement station
02/15/1996WO1996004101A1 Method of planarizing polycrystalline diamonds
02/14/1996EP0696495A1 Linear polisher and method for semiconductor wafer planarization
02/14/1996CN1030992C Base substance for grinding, finishing and lapping
02/13/1996US5491030 Surface finishing for metal moldings
02/13/1996US5490809 System and method for texturing magnetic data storage disks
02/13/1996US5490611 Process for precise volumetrio diluting/mixing of chemicals
02/07/1996CN1116150A Production of piezoelectric ceramic vibrator
02/06/1996US5489233 Polishing pads and methods for their use
02/01/1996WO1996002355A1 Wafer polishing method and apparatus
02/01/1996WO1996002319A2 Chemical slurry mixing apparatus and method
01/1996
01/31/1996CN2218627Y Vacuum suction disc type porous sheet stacking machine
01/30/1996US5487697 Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
01/23/1996US5486265 Chemical-mechanical polishing of thin materials using a pulse polishing technique
01/23/1996US5486134 System and method for texturing magnetic data storage disks
01/23/1996US5486131 Device for conditioning polishing pads
01/23/1996US5486129 System and method for real-time control of semiconductor a wafer polishing, and a polishing head
01/17/1996EP0692318A1 Method of and apparatus for cleaning workpiece
01/17/1996EP0683709A4 Apparatus and method for polishing.
01/10/1996CN2216886Y Lapping machine for lapping stone of same highness and same pressure type
01/09/1996US5483568 Pad condition and polishing rate monitor using fluorescence
01/09/1996US5482566 Mixed with alkanolamine and chelate compound
12/1995
12/24/1995CA2126609A1 Lapping tool disk apparatus
12/20/1995EP0687526A1 Polishing method and apparatus for automatic reduction of wafer taper in single-wafer polishing
12/20/1995EP0687525A1 A lapping system for automatic contouring
12/19/1995US5476606 Compositions and methods for polishing
12/19/1995US5476414 Polishing apparatus
12/13/1995EP0686684A1 Slicing slurry
12/13/1995EP0686076A1 Wafer polishing apparatus and method
12/07/1995CA2150856A1 Sawing suspension
12/06/1995EP0685877A2 Polishing agent used for polishing silicon wafers and polishing method using the same
12/06/1995EP0685573A1 Chemical polishing of ferroelectric materials
12/06/1995EP0685299A1 Polishing pad used for polishing silicon wafers and polishing method using the same
12/05/1995US5473433 Method of high yield manufacture of VLSI type integrated circuit devices by determining critical surface characteristics of mounting films
12/05/1995US5472374 Polishing method and polishing device using the same
12/05/1995US5472370 Method of planarizing polycrystalline diamonds, planarized polycrystalline diamonds and products made therefrom
11/1995
11/30/1995EP0684105A4 Process for machining components made of brittle materials and a device for carrying out the same.
11/29/1995EP0684634A2 Method of rough polishing semiconductor wafers to reduce surface roughness
11/29/1995EP0684106A2 Polishing apparatus and method to produce a hard material-coated wafer
11/29/1995EP0684105A1 Process for machining components made of brittle materials and a device for carrying out the same
11/29/1995EP0683709A1 Apparatus and method for polishing
11/28/1995US5470368 Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles
11/23/1995WO1995031310A1 Apparatus and method of polishing and planarizing polycrystalline diamonds
11/23/1995WO1995031309A1 Semiconductor wafer polishing apparatus and method
11/21/1995US5468177 Lapping fixture for disk sliders
11/16/1995WO1995030711A1 Fluororesin foam and process for producing the same
11/16/1995WO1995030514A1 Polishing apparatus
11/15/1995CN2212479Y Lapping machine for end surface of spring conveyed continuously
11/14/1995US5465447 Apparatus for scrubbing substrate
11/02/1995WO1995029039A1 Separation type grinding surface plate and grinding apparatus using same
11/02/1995EP0679988A1 Range finding circuits
11/01/1995CN2211338Y Fast grinding block shifter for stone grinder
10/1995
10/31/1995US5462568 Nontoxic alkaline powder mixture containing abrasives and compounds from groups 1A and/or 2A, for use with water
10/24/1995US5461007 Process for polishing and analyzing a layer over a patterned semiconductor substrate
10/19/1995WO1995027595A1 Improved polishing pads and methods for their use
10/18/1995EP0677867A2 Method and apparatus for scrubbing substrate
10/18/1995CN2210064Y Lapping machine
10/17/1995US5458827 Method of polishing and figuring diamond and other superhard material surfaces
10/10/1995US5456736 Lap and lapping liquor
10/10/1995US5456627 Conditioner for a polishing pad and method therefor
10/04/1995EP0675210A1 Method of manufacturing cast iron of high strength and low expansion
10/04/1995EP0674972A1 Chemical mechanical polishing apparatus with improved slurry distribution
10/04/1995EP0674565A1 Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles
10/04/1995CN2209014Y Hard stone button grinder
10/03/1995US5454921 Electrolytic combined processing machine
09/1995
09/27/1995EP0674341A1 Improved semiconductor wafer carrier and method
09/20/1995EP0672499A1 Apparatus for polishing wafers
09/20/1995EP0452501B1 Electro-abrasive Polishing Process of the Inner Surface of Pipes to Extra-smooth Mirror Finish
09/20/1995CN1108590A Method for the polishing and finishing of optical lenses
09/14/1995DE4407148A1 Form correcting device for lapping and polishing tools
09/12/1995US5449316 Wafer carrier for film planarization
09/12/1995US5449313 Magnetorheological polishing devices and methods
09/12/1995CA2012878C Apparatus for grinding semiconductor wafer
09/06/1995EP0670591A2 Method for chemical mechanical polishing a semiconductor device using slurry
09/06/1995CN2206699Y Motor vibration device of vibration grinder
09/06/1995CN2206698Y Vertical grinding device
08/1995
08/30/1995CN2206184Y Lapping working device for shaping minisize flexible concave ball
08/29/1995US5445996 Forming first insulating layer on a silicon substrate, a wiring portion on above layer, a polysilicon conductive layer which later oxidized to form second insulating layer, third insulating layer, polishing using cerium oxide slurry
08/22/1995US5443416 Rotary union for coupling fluids in a wafer polishing apparatus
08/22/1995US5443415 Burnishing apparatus for flexible magnetic disks and method therefor
08/16/1995EP0667211A1 Mechanical and chemical polishing method and polishing apparatus therefor
08/15/1995US5441598 Controlling the surface of the polishing side to control size and shapes
08/15/1995US5441444 Polishing machine
08/15/1995US5441442 Method of manufacturing a plate having a plane main surface, method of manufacturing a plate having parallel main surfaces, and device suitable for implementing said methods
08/09/1995EP0666141A1 Lapping machine
08/09/1995EP0665817A1 Oxide particles and method for producing them
08/09/1995CN2204683Y Energy recovering gearbox loading device
08/09/1995CN2204682Y High effective grinder
08/08/1995US5439551 Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes
08/02/1995CN2204219Y Helical-angle improved grinding device
07/1995
07/26/1995EP0664540A2 Substrate independent superpolishing process and slurry
07/26/1995EP0656031A4 Polymeric substrate with polymeric microelements.
07/26/1995CN1105618A Polishing method, device and buff wheel therefor
07/25/1995US5435772 Method of polishing a semiconductor substrate
07/20/1995DE4401199A1 Method of machining profiles for interlocking parts e.g. shaft and hub
07/19/1995EP0663265A1 In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
07/18/1995US5433651 In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing