| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 05/17/2000 | EP1000705A2 A scalable multipad design for improved CMP process |
| 05/17/2000 | EP1000704A2 Flattening polishing device and flattening polishing method |
| 05/17/2000 | EP0999918A1 Polishing semiconductor wafers |
| 05/17/2000 | CN1253160A New type abrasive composition used in integrated circuit electronic industry |
| 05/16/2000 | US6062968 Polishing pad for a semiconductor substrate |
| 05/16/2000 | US6062964 Chemical mechanical polishing apparatus for controlling slurry distribution |
| 05/16/2000 | US6062963 Retainer ring design for polishing head of chemical-mechanical polishing machine |
| 05/16/2000 | US6062961 Wafer polishing head drive |
| 05/16/2000 | US6062959 Polishing system including a hydrostatic fluid bearing support |
| 05/16/2000 | US6062958 Variable abrasive polishing pad for mechanical and chemical-mechanical planarization |
| 05/16/2000 | US6062955 Installation for improving chemical-mechanical polishing operation |
| 05/16/2000 | US6062954 Semiconductor wafer surface flattening apparatus |
| 05/16/2000 | US6062952 Planarization process with abrasive polishing slurry that is selective to a planarized surface |
| 05/16/2000 | US6062949 Polishing amount control system and method for same |
| 05/11/2000 | WO2000026613A1 Optical monitoring of radial ranges in chemical mechanical polishing a metal layer on a substrate |
| 05/11/2000 | WO2000026609A2 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| 05/11/2000 | WO2000026443A2 Method and apparatus for electrochemical mechanical deposition |
| 05/11/2000 | WO2000025984A1 Chemical mechanical polishing a substrate having a filler layer and a stop layer |
| 05/11/2000 | WO2000025983A1 Use of zeta potential during chemical mechanical polishing for end point detection |
| 05/11/2000 | WO2000025982A1 Apparatus and method for performing end point detection on a linear planarization tool |
| 05/11/2000 | WO2000025981A1 Unpolished work holding board and production method thereof and work polishing method and device |
| 05/11/2000 | WO2000025980A1 Method and apparatus for grinding wafer |
| 05/10/2000 | EP0999013A1 Polishing grinding wheel and substrate polishing method with this grinding wheel |
| 05/10/2000 | EP0999012A2 Method and apparatus for polishing substrate |
| 05/10/2000 | EP0998536A1 Polishing agent for semiconductor substrates |
| 05/09/2000 | US6060396 Polishing agent used for polishing semiconductor silicon wafers and polishing method using the same |
| 05/09/2000 | US6059921 Chemical mechanical polishing apparatus and a polishing cloth for a chemical mechanical polishing apparatus |
| 05/09/2000 | US6059920 Semiconductor device polishing apparatus having improved polishing liquid supplying apparatus, and polishing liquid supplying method |
| 05/09/2000 | US6059643 Apparatus and method for polishing a flat surface using a belted polishing pad |
| 05/09/2000 | US6059638 Magnetic force carrier and ring for a polishing apparatus |
| 05/09/2000 | US6059636 Wafer polishing apparatus |
| 05/04/2000 | WO2000024842A1 A chemical mechanical polishing slurry system having an activator solution |
| 05/04/2000 | WO2000024550A1 Belt for polishing semiconductors |
| 05/04/2000 | WO2000024548A1 Polishing apparatus and a semiconductor manufacturing method using the same |
| 05/02/2000 | US6056851 Slurry supply system for chemical mechanical polishing |
| 05/02/2000 | US6056632 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| 05/02/2000 | US6056631 Chemical mechanical polish platen and method of use |
| 05/02/2000 | US6056630 Polishing apparatus with carrier head pivoting device |
| 04/27/2000 | WO2000023534A1 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles |
| 04/27/2000 | WO2000023230A1 Catastrophic error recovery apparatus and associated methods |
| 04/27/2000 | WO2000023229A1 Wafer-polishing apparatus |
| 04/27/2000 | WO2000023228A1 Wafer grinder and method of detecting grinding amount |
| 04/27/2000 | WO1999064205A9 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 04/27/2000 | CA2347632A1 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles |
| 04/26/2000 | EP0808230B1 Chemical-mechanical polishing of thin materials using a pulse polishing technique |
| 04/25/2000 | US6054422 Polyoxyalkylene glycol |
| 04/25/2000 | US6054388 Apparatus for lapping semiconductor wafers and method of lapping thereof |
| 04/25/2000 | US6054017 Chemical mechanical polishing pad with controlled polish rate |
| 04/25/2000 | US6053802 Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulse |
| 04/25/2000 | US6053801 Substrate polishing with reduced contamination |
| 04/20/2000 | WO2000021715A2 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| 04/20/2000 | WO2000021714A1 A carrier head with a flexible membrane for chemical mechanical polishing |
| 04/19/2000 | EP0809557A4 Determining the coefficient of friction of a polishing pad |
| 04/18/2000 | US6051500 Device and method for polishing a semiconductor substrate |
| 04/18/2000 | US6051499 Rotation |
| 04/18/2000 | US6051498 Method for manufacturing a semiconductor wafer which is coated on one side and provided with a finish |
| 04/18/2000 | US6051495 Comprising a supports and a seasoning layer attached to the first surface of the support device, for seasoning a polishing pad with tungsten polishing by-product to polish tungsten |
| 04/18/2000 | US6050885 Device for the chemical-mechanical polishing of an object, in particular a semiconductor wafer |
| 04/18/2000 | US6050884 Polishing apparatus |
| 04/18/2000 | US6050882 Carrier head to apply pressure to and retain a substrate |
| 04/18/2000 | US6050879 Process for lapping air bearing surfaces |
| 04/18/2000 | US6050878 Processing jig |
| 04/13/2000 | WO2000020167A2 Method and apparatus for automatically polishing magnetic disks and other substrates |
| 04/12/2000 | EP0992322A1 Polishing device |
| 04/12/2000 | CN2373219Y Universal valve lapping machine |
| 04/11/2000 | US6048577 Nano-sized alpha alumina particles having a silica coating thereon |
| 04/11/2000 | US6048261 Polishing disc support and polishing process |
| 04/11/2000 | US6048259 Wafer loading and unloading mechanism for loading robot |
| 04/11/2000 | US6048256 Apparatus and method for continuous delivery and conditioning of a polishing slurry |
| 04/11/2000 | US6048254 Lapping apparatus and process with annular abrasive area |
| 04/06/2000 | WO2000018544A1 Apparatus and method for supplying slurry either to a polishing pad or to a return line |
| 04/06/2000 | WO2000018543A1 Method of post cmp defect stability improvement |
| 04/06/2000 | WO2000018542A1 Chemical mechanical polishing conditioner |
| 04/06/2000 | DE19842954A1 Chemical mechanical polishing (CMP) system for semiconductor wafer |
| 04/05/2000 | EP0990491A1 Slitter |
| 04/05/2000 | EP0990486A1 Polishing solution feeder |
| 04/05/2000 | EP0990485A2 Method for enhancing semiconductor wafer release |
| 04/04/2000 | US6047224 Machining guide for magnetic recording reproduce heads |
| 04/04/2000 | US6045605 Abrasive material for polishing a semiconductor wafer, and methods for manufacturing and using the abrasive material |
| 04/04/2000 | US6045439 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| 04/04/2000 | US6045437 Method and apparatus for polishing a hard disk substrate |
| 04/04/2000 | US6045436 Process for the material-abrading machining of the edge of a semiconductor wafer |
| 04/04/2000 | US6045435 Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects |
| 04/04/2000 | US6045433 Apparatus for optical inspection of wafers during polishing |
| 03/30/2000 | WO2000017284A1 Workpiece retainer and method for attaching/detaching workpiece by using the same |
| 03/30/2000 | WO2000017283A1 Oxidizing polishing slurries for low dielectric constant materials |
| 03/30/2000 | WO2000017281A1 Polishing liquid for polishing components, preferably wafers, especially for chemically-mechanically polishing components of this type |
| 03/30/2000 | DE19842709A1 Polierflüssigkeit zum Polieren von Bauelementen, vorzugsweise Wafern, insbesondere zum Chemisch-Mechanischen Polieren derartiger Bauelemente Polishing liquid for polishing devices, preferably wafers, in particular for mechanical chemical polishing of such devices |
| 03/29/2000 | EP0988931A2 Carrier and polishing apparatus |
| 03/29/2000 | CN2370998Y Grinder for cylinder open of T815 engine |
| 03/29/2000 | CN1248496A Chemical and mechanical lapping device and method |
| 03/28/2000 | US6043961 Magnetic recording medium and method for producing the same |
| 03/28/2000 | US6043159 Chemical mechanical polishing process for layers of isolating materials based on silicon derivatives or silicon |
| 03/28/2000 | US6043156 Method of making semiconductor wafers |
| 03/28/2000 | US6042741 Water, abrasive particles, surfactant and compound which complexes with silica and silicon nitride containing functional groups having dissociable protons |
| 03/28/2000 | US6042688 Carrier for double-side polishing |
| 03/28/2000 | US6042457 Conditioner assembly for a chemical mechanical polishing apparatus |
| 03/28/2000 | US6042455 Polishing apparatus |
| 03/28/2000 | US6042454 System for detecting the endpoint of the polishing of a semiconductor wafer by a semiconductor wafer polisher |
| 03/23/2000 | WO2000015387A1 Oscillating orbital polisher and method |