| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/29/1997 | US5624300 Apparatus and method for uniformly polishing a wafer |
| 04/29/1997 | US5624299 Chemical mechanical polishing apparatus with improved carrier and method of use |
| 04/23/1997 | EP0769350A1 Method and apparatus for dressing polishing cloth |
| 04/17/1997 | WO1997013889A1 Improved polishing slurries and methods for their use |
| 04/16/1997 | EP0768148A1 Apparatus for and method of polishing workpiece |
| 04/16/1997 | CN1147782A Semiconductor wafer polishing apparatus and method |
| 04/15/1997 | US5620357 Polishing method and apparatus for automatic reduction of wafer taper in single-wafer polishing |
| 04/15/1997 | US5620356 Row tool balance and bow correction apparatus |
| 04/09/1997 | CN2251462Y Valve dynamic lapping machine |
| 04/08/1997 | US5618447 Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers |
| 04/08/1997 | US5618354 Apparatus and method for carrier backing film reconditioning |
| 04/08/1997 | US5618227 Apparatus for polishing wafer |
| 04/03/1997 | WO1997011815A1 Composition and method for refinishing compact disks |
| 04/03/1997 | CA2232784A1 Composition and method for refinishing compact disks |
| 04/01/1997 | US5616212 Method for polishing a wafer by supplying surfactant to the rear surface of the wafer |
| 04/01/1997 | US5616069 Directional spray pad scrubber |
| 04/01/1997 | US5616063 For polishing and then washing a workpiece |
| 03/27/1997 | WO1997011484A1 Method of modifying an exposed surface of a semiconductor wafer |
| 03/27/1997 | CA2231159A1 Method of modifying an exposed surface of a semiconductor wafer |
| 03/26/1997 | EP0764976A1 Wafer processing method and equipment |
| 03/26/1997 | EP0764975A1 Process for producing superficial piling-up defects on the backside of semiconductor wafers |
| 03/20/1997 | WO1997010613A1 Grinding method of grinding device |
| 03/19/1997 | EP0763402A1 Method and apparatus for polishing semiconductor substrate |
| 03/19/1997 | EP0763401A1 Method and apparatus for polishing semiconductor substrate |
| 03/18/1997 | US5611943 Method and apparatus for conditioning of chemical-mechanical polishing pads |
| 03/13/1997 | DE19636578A1 Prodn. of magnetic recording medium |
| 03/12/1997 | EP0761387A1 Polishing apparatus |
| 03/11/1997 | US5609719 Method for performing chemical mechanical polish (CMP) of a wafer |
| 03/11/1997 | US5609718 Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers |
| 03/11/1997 | US5609517 Composite polishing pad |
| 03/04/1997 | US5607718 Polishing method and polishing apparatus |
| 03/04/1997 | US5607341 Method and structure for polishing a wafer during manufacture of integrated circuits |
| 03/04/1997 | US5607340 Row tool |
| 02/27/1997 | WO1997006921A1 Polishing pads |
| 02/26/1997 | EP0758941A1 Semiconductor wafer polishing apparatus and method |
| 02/25/1997 | US5605760 Solid transparent uniform polymer |
| 02/25/1997 | US5605499 Flattening method and flattening apparatus of a semiconductor device |
| 02/25/1997 | US5605488 Polishing apparatus of semiconductor wafer |
| 02/25/1997 | US5605487 Semiconductor wafer polishing appartus and method |
| 02/18/1997 | US5604014 Magnetic recording medium and manufacturing method for the same |
| 02/18/1997 | US5603654 Method for supplying a polishing liquid and polishing method using the same |
| 02/18/1997 | US5603156 Lapping process for minimizing shorts and element recession at magnetic head air bearing surface |
| 02/11/1997 | US5602058 Method and apparatus for applying a wafer to a mount plate |
| 02/11/1997 | US5601732 Protecting film for wafer and method for grinding surface of wafer with the same |
| 02/05/1997 | EP0757378A1 Process of polishing silicon wafers |
| 02/05/1997 | EP0756917A1 Separation type grinding surface plate and grinding apparatus using same |
| 02/04/1997 | US5599423 Computer process control; for integrated circuits |
| 01/30/1997 | WO1997002924A1 Renewable polishing lap |
| 01/29/1997 | EP0755751A1 Method of manufacturing semiconductor wafers and process of and apparatus for grinding used for the same method of manufacture |
| 01/28/1997 | US5597443 Method and system for chemical mechanical polishing of semiconductor wafer |
| 01/28/1997 | US5597442 Determining endpoint for polishing semiconductor wafer surface |
| 01/28/1997 | US5597346 Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process |
| 01/28/1997 | US5597341 Semiconductor planarizing apparatus |
| 01/28/1997 | US5597340 Ultimate inductive head integrated lapping system |
| 01/23/1997 | DE19629286A1 Polishing pad device for chemical mechanical polishing of semiconductor wafer |
| 01/22/1997 | EP0754785A1 Method of manufacturing semiconductor mirror wafers |
| 01/21/1997 | US5595529 Dual column abrading machine |
| 01/21/1997 | US5595527 Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish |
| 01/21/1997 | US5595526 Method and apparatus for endpoint detection in a chemical/mechanical process for polishing a substrate |
| 01/14/1997 | US5593537 Apparatus for processing semiconductor wafers |
| 01/14/1997 | US5593344 Wafer polishing machine with fluid bearings and drive systems |
| 01/14/1997 | US5593343 Apparatus for reconditioning digital recording discs |
| 01/07/1997 | US5591073 Method and apparatus for lapping sliders |
| 01/03/1997 | WO1997000155A1 Method and apparatus for optical polishing |
| 01/02/1997 | EP0751553A2 No coat backside wafer grinding process |
| 01/02/1997 | EP0750968A1 Improvements in or relating to the processing of semiconductor devices |
| 01/01/1997 | CN2243956Y Rotary plain grinder |
| 12/31/1996 | US5588902 Apparatus for polishing wafers |
| 12/31/1996 | CA2110615C Polishing material |
| 12/27/1996 | EP0750335A2 Polishing agent used for polishing semiconductor wafers and polishing method using the same |
| 12/25/1996 | CN1138745A Grinding appts. of retaining device basilar plate of grinded basilar plate and grinding method of basilar plate |
| 12/25/1996 | CN1138510A Adhesion elastic fluid frequency-converting and voltage-converting vibrating finishing machine and tech. |
| 12/24/1996 | US5586926 Method for texturing a metallic thin film |
| 12/19/1996 | WO1996040473A1 Vertically stacked planarization machine |
| 12/18/1996 | EP0549733B1 Apparatus and method for the transfer and delivery of high purity chemicals |
| 12/17/1996 | US5584898 Polishing ceramic substrate supported between moving upper and lower microporous polishing pads within enclosure |
| 12/17/1996 | US5584751 Wafer polishing apparatus |
| 12/17/1996 | US5584750 Polishing machine with detachable surface plate |
| 12/17/1996 | US5584749 Surface polishing apparatus |
| 12/17/1996 | US5584746 Method of polishing semiconductor wafers and apparatus therefor |
| 12/17/1996 | US5584146 Method of fabricating chemical-mechanical polishing pad providing polishing uniformity |
| 12/11/1996 | EP0747167A2 Apparatus for holding a substrate during polishing |
| 12/10/1996 | US5582540 Hydrostatic and hydrodynamic polishing tool |
| 12/10/1996 | US5582534 Orbital chemical mechanical polishing apparatus and method |
| 12/05/1996 | WO1996038262A1 Compositions for polishing silicon wafers and methods |
| 12/03/1996 | US5579717 Method of grinding thin-film magnetic heads using optical grinding markers |
| 11/28/1996 | WO1996037340A1 Interactive system for lapping transducers |
| 11/28/1996 | DE19612195A1 Wafer polishing appts. for esp. semiconductor wafer |
| 11/27/1996 | CN2241040Y Lapping head |
| 11/26/1996 | US5578529 Method for using rinse spray bar in chemical mechanical polishing |
| 11/26/1996 | US5578362 Which are flexible, having a work surface and subsurface proximate to it; semiconductors |
| 11/26/1996 | US5577948 Method of finishing a workpiece surface |
| 11/21/1996 | WO1996036459A1 Improved method and apparatus for chemical mechanical polishing |
| 11/19/1996 | US5575886 Method for fabricating semiconductor device with chemical-mechanical polishing process for planarization of interlayer insulation films |
| 11/19/1996 | US5575707 Polishing pad cluster for polishing a semiconductor wafer |
| 11/19/1996 | US5575706 Chemical/mechanical planarization (CMP) apparatus and polish method |
| 11/19/1996 | CA2044581C An electro-abrasive polishing process of the inner surface of pipes to extra-smooth mirror finish |
| 11/13/1996 | CN2239864Y Electric valve lapping machine |
| 11/13/1996 | CN2239863Y Disk friction lapping head of portable valve lapping machine |
| 11/13/1996 | CN2239862Y Lapping and burnishing tool head |