| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/28/1998 | US5742995 Method to predict an accurate MR sensor dimension when viewed from abs |
| 04/23/1998 | WO1998016348A1 Grindstone with seat and method of manufacturing the same |
| 04/21/1998 | US5741173 Method and apparatus for machining semiconductor material |
| 04/21/1998 | US5741171 Precision polishing system |
| 04/16/1998 | WO1998015384A1 Polishing pad contour indicator for mechanical or chemical-mechanical planarization |
| 04/15/1998 | EP0835723A1 A carrier head with a layer of conformable material for a chemical mechanical polishing system |
| 04/15/1998 | EP0835709A1 Machine tool cutter position adjustment device |
| 04/15/1998 | CN2278564Y High-efficiency sand grinder |
| 04/15/1998 | CN2278563Y Hand-held valve lapping machine |
| 04/14/1998 | US5738800 Polishing with aqueous slurry of abrasive particles containing complexing agent to increase selectivity |
| 04/14/1998 | US5738574 Continuous processing system for chemical mechanical polishing |
| 04/14/1998 | US5738573 Semiconductor wafer polishing apparatus |
| 04/14/1998 | US5738568 Flexible tilted wafer carrier |
| 04/14/1998 | US5738567 Polishing pad for chemical-mechanical planarization of a semiconductor wafer |
| 04/14/1998 | US5738566 Lapping guide system, method and article of manufacture |
| 04/14/1998 | US5738562 Apparatus and method for planar end-point detection during chemical-mechanical polishing |
| 04/09/1998 | WO1998014987A1 Cerium oxide abrasive and method of abrading substrates |
| 04/09/1998 | WO1998014307A1 Superabrasive tool and method of its manufacture |
| 04/09/1998 | WO1998014306A1 A method and system for controlling chemical mechanical polishing thickness removal |
| 04/09/1998 | WO1998014305A1 Methods and apparatus for measuring and dispensing processing solutions to a cmp machine |
| 04/09/1998 | WO1998014304A1 Polishing pad and method for making polishing pad with elongated microcolumns |
| 04/09/1998 | DE19742665A1 Grinding method for cylindrical metal workpiece |
| 04/08/1998 | EP0833720A1 Method and apparatus for optical polishing |
| 04/08/1998 | CN2277851Y Lapping head |
| 04/07/1998 | US5736463 Applying slurry, pressing and rotating shape memory material polishing pad relative to surface; for silicon wafers |
| 04/07/1998 | US5736427 Polishing pad contour indicator for mechanical or chemical-mechanical planarization |
| 04/07/1998 | US5735992 Polishing device with sample holder |
| 04/07/1998 | US5735731 For planarizing a semiconductor wafer |
| 04/07/1998 | US5735729 Abrasive composition with an electrolytic water and a polishing process with the use of said abrasive composition |
| 04/07/1998 | US5735649 Machine tool cutter position adjustment device |
| 04/07/1998 | US5735036 Lapping process for minimizing shorts and element recession at magnetic head air bearing surface |
| 04/02/1998 | WO1998013218A1 Composition and method for polishing a composite |
| 04/01/1998 | EP0833378A2 Polishing system |
| 03/31/1998 | US5733182 Ultra flat polishing |
| 03/31/1998 | US5733179 Method and apparatus for reconditioning digital recording discs |
| 03/31/1998 | US5733177 Process of polishing wafers |
| 03/31/1998 | US5733176 Polishing pad and method of use |
| 03/31/1998 | US5733175 Polishing a workpiece using equal velocity at all points overlapping a polisher |
| 03/31/1998 | US5733171 Apparatus for the in-process detection of workpieces in a CMP environment |
| 03/26/1998 | WO1998012739A1 Semiconductor wafer polishing device |
| 03/26/1998 | WO1998012020A1 Methods and apparatus for uniform polishing of a workpiece |
| 03/25/1998 | CN2276855Y Grinder |
| 03/25/1998 | CN1176864A Slurry recycling in CMP apparatus |
| 03/24/1998 | US5730642 System for real-time control of semiconductor wafer polishing including optical montoring |
| 03/18/1998 | EP0829328A2 Polymeric substrate with polymeric microelements |
| 03/18/1998 | EP0829327A1 Polishing pad control method and apparatus |
| 03/12/1998 | DE19636055A1 Edge material removing machining method for semiconductor wafer |
| 03/11/1998 | EP0827811A1 Apparatus for mirror-polishing thin plate |
| 03/11/1998 | EP0827810A1 Material for lapping tools and lapping surface plate using the same |
| 03/11/1998 | EP0827809A1 Polishing apparatus |
| 03/11/1998 | EP0827808A2 Apparatus for applying an urging force to a wafer |
| 03/10/1998 | US5726454 Tripod for polishing a sample and for viewing the sample under a microscope |
| 03/10/1998 | US5725420 Polishing device having a pad which has grooves and holes |
| 03/10/1998 | US5725417 Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates |
| 03/10/1998 | US5725414 Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer |
| 03/10/1998 | US5725413 Apparatus for and method of polishing and planarizing polycrystalline diamonds, and polished and planarized polycrystalline diamonds and products made therefrom |
| 03/05/1998 | WO1998008418A1 A brush assembly apparatus |
| 03/04/1998 | EP0826459A1 Apparatus and method for chamfering wafer with loose abrasive grains |
| 03/03/1998 | US5722879 Variable travel carrier device and method for planarizing semiconductor wafers |
| 03/03/1998 | US5722877 Technique for improving within-wafer non-uniformity of material removal for performing CMP |
| 03/03/1998 | US5722875 Method and apparatus for polishing |
| 03/03/1998 | US5722156 Method for processing ceramic wafers comprising plural magnetic head forming units |
| 03/03/1998 | US5722155 Machining guide method for magnetic recording reproduce heads |
| 02/25/1998 | EP0824995A1 Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| 02/19/1998 | WO1998006541A1 Abrasive construction for semiconductor wafer modification |
| 02/19/1998 | WO1998006540A1 Apparatus and method for polishing semiconductor devices |
| 02/19/1998 | CA2262579A1 Abrasive construction for semiconductor wafer modification |
| 02/18/1998 | CN1173733A Radiant polishing block heater |
| 02/17/1998 | US5718620 Polishing machine and method of dissipating heat therefrom |
| 02/17/1998 | US5718618 Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers |
| 02/17/1998 | US5718182 Pressure foot unit for sewing machine |
| 02/11/1998 | EP0823465A2 Polishing composition for chemical mechanical polishing |
| 02/11/1998 | EP0823308A1 Method for fabricating silicon semiconductor discrete wafer |
| 02/11/1998 | EP0822884A1 A polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine |
| 02/10/1998 | US5716264 Polishing apparatus |
| 02/10/1998 | US5716258 Semiconductor wafer polishing machine and method |
| 02/04/1998 | EP0822033A1 Slurry recycling in chemical-mechanical polishing (CMP) apparatus |
| 02/03/1998 | US5714417 Planarization process using artificial gravity |
| 02/03/1998 | US5713969 Abrasives composition and process for producing substrate for magnetic recording medium |
| 02/03/1998 | US5713968 Mixing silicon carbide, diluents and dispersant, ball milling to remove agglomerates, then adding resin, thermoplastic microballoons for cellular structure and curing catalyst, molding while heating to cure to a solid |
| 01/29/1998 | WO1998003305A1 Methods and apparatus for the in-process detection of workpieces |
| 01/22/1998 | DE19652839A1 Level sensor for chemical-mechanical polishing device for semiconductor wafer |
| 01/21/1998 | EP0819500A1 Automatic measuring apparatus |
| 01/21/1998 | CN1170655A Automated wafer lapping system |
| 01/20/1998 | US5710077 Method for the generation of stacking-fault-induced damage on the back of semiconductor wafers |
| 01/20/1998 | US5709593 Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
| 01/20/1998 | US5709588 Polishing slurry and polishing process using the same |
| 01/14/1998 | EP0818272A1 Holding a polishing pad on a platen in a chemical mechanical polishing system |
| 01/14/1998 | EP0764975B1 Process for producing superficial piling-up defects on the backside of semiconductor wafers |
| 01/13/1998 | US5708506 Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process |
| 01/13/1998 | US5707492 Metallized pad polishing process |
| 01/13/1998 | US5707274 Chemical mechanical polishing apparatus for semiconductor wafer |
| 01/13/1998 | US5706567 Method of surface finishing of metal moldings |
| 01/07/1998 | EP0816018A1 Polishing disc holder and polishing method |
| 01/06/1998 | USRE35709 Reduced viscosity slurries, abrasive articles made therefrom and methods of making said articles |
| 01/06/1998 | US5705435 Detecting endpoint without removing substrate |
| 01/06/1998 | US5704987 Process for removing residue from a semiconductor wafer after chemical-mechanical polishing |
| 01/06/1998 | US5704827 Polishing apparatus including cloth cartridge connected to turntable |
| 12/30/1997 | US5702293 Holding fixture for metallographic mount polishing |
| 12/30/1997 | US5702291 Wafer polishing method and wafer polishing apparatus |