| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 02/09/1999 | US5868605 In-situ polishing pad flatness control |
| 02/09/1999 | US5868604 Alumina small particle abrasives, |
| 02/04/1999 | WO1999005706A1 A polishing composition including an inhibitor of tungsten etching |
| 02/04/1999 | WO1999005232A1 Polishing agent for semiconductor substrates |
| 02/04/1999 | WO1999004931A1 Apparatus for holding workpieces during lapping, honing, and polishing |
| 02/03/1999 | EP0894570A2 Method and apparatus for polishing |
| 02/02/1999 | US5866480 Method and apparatus for polishing semiconductor substrate |
| 02/02/1999 | US5866477 Method of polishing a chamfered portion of a semiconductor silicon substrate |
| 02/02/1999 | US5866436 Process of manufacturing an intergrated circuit having an interferometrically profiled mounting film |
| 02/02/1999 | US5866226 Polishing agent used for polishing semiconductor wafers and polishing method using the same |
| 02/02/1999 | US5865891 Planarization process using artificial gravity |
| 02/02/1999 | US5865670 For removal of a semiconductor wafer adhered to a polishing block |
| 01/28/1999 | WO1999003639A1 Methods and apparatus for conditioning polishing pads utilizing brazed diamond technology |
| 01/27/1999 | EP0893203A2 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
| 01/27/1999 | CN2305271Y Mutation correcting mechanism for stone grinder |
| 01/26/1999 | US5862822 Cleaning device for buffing pads and the like |
| 01/21/1999 | WO1999002623A1 Composition and method for polishing a composite comprising titanium |
| 01/21/1999 | WO1999002309A1 Cvd diamond coated substrate for polishing pad conditioning head and method for making same |
| 01/21/1999 | WO1999002305A1 Substrate polishing |
| 01/21/1999 | WO1999002304A1 A carrier head with a flexible membrane for a chemical mechanical polishing system |
| 01/19/1999 | US5861055 Slurries of polishing particles suspended in mixtures of soluble film forming polymeric binder, solvent and wetting agent; dissolving film frees particles to polish surface in chemical mechanical polishing |
| 01/19/1999 | US5861054 Cotaining particles selected from silicon carbide, siliconnitride, graphite dispersed in acidic solvent; semiconductor etching |
| 01/19/1999 | US5860853 Apparatus for polishing wafers |
| 01/19/1999 | US5860851 Polishing apparatus and polishing method using the same |
| 01/19/1999 | US5860848 Polishing silicon wafers with improved polishing slurries |
| 01/19/1999 | US5860847 Polishing apparatus |
| 01/19/1999 | US5860640 Semiconductor wafer alignment member and clamp ring |
| 01/14/1999 | DE19828477A1 Chemical and mechanical (CMP) polisher for microelectronic industry |
| 01/14/1999 | DE19755705A1 Double sided lapping method for large sized wafer |
| 01/13/1999 | EP0890416A2 Wafer polishing apparatus |
| 01/12/1999 | US5857899 For polishing a semiconductor wafer |
| 01/12/1999 | US5857893 Methods and apparatus for measuring and dispensing processing solutions to a CMP machine |
| 01/07/1999 | EP0888846A2 Method for wafer polishing and method for polishing-pad dressing |
| 01/05/1999 | US5855998 Hard material-coated wafer, method of making same, polishing apparatus and polishing method of hard material-coated wafer |
| 01/05/1999 | US5855804 Removing material with abrasive, selectively preventing contact between abrasive and selected area of substrate |
| 01/05/1999 | US5855735 Inducing microfractures using rotating pads, abrasive slurries |
| 12/30/1998 | EP0887153A2 Combined slurry dispenser and rinse arm and method of operation |
| 12/30/1998 | EP0887152A2 Carrier for double-side polishing |
| 12/30/1998 | EP0887151A2 Improved chemical mechanical polishing pad conditioner |
| 12/30/1998 | CN2302105Y Hollow column stone cutting and grinding machine |
| 12/29/1998 | US5853504 Material for lapping tools and lapping surface plate using the same |
| 12/29/1998 | US5853317 Polishing pad and polishing apparatus having the same |
| 12/24/1998 | DE19726665A1 In situ end point determination during chemical-mechanical polishing |
| 12/23/1998 | EP0885691A2 Polishing apparatus |
| 12/23/1998 | CN1202406A Inflated polishing machine |
| 12/22/1998 | US5851140 Semiconductor wafer polishing apparatus with a flexible carrier plate |
| 12/22/1998 | US5851138 In a chemical mechanical polishing process |
| 12/22/1998 | US5851136 Apparatus for chemical mechanical polishing |
| 12/22/1998 | US5851135 System for real-time control of semiconductor wafer polishing |
| 12/16/1998 | EP0884136A1 Polishing method and polishing apparatus using the same |
| 12/10/1998 | WO1998055264A1 Semiconductor wafer cmp process monitoring and endpoint |
| 12/10/1998 | WO1998055263A1 Method and apparatus for distributing a polishing agent onto a polishing element |
| 12/10/1998 | WO1998055262A1 Methods and apparatus for conditioning grinding stones |
| 12/09/1998 | EP0882550A2 Polisher with a vibration detection system |
| 12/09/1998 | EP0868543A4 Improved polishing slurries and methods for their use |
| 12/08/1998 | US5846882 Endpoint detector for a chemical mechanical polishing system |
| 12/08/1998 | US5846398 CMP slurry measurement and control technique |
| 12/08/1998 | US5846336 Apparatus and method for conditioning a planarizing substrate used in mechanical and chemical-mechanical planarization of semiconductor wafers |
| 12/08/1998 | US5846335 Method for cleaning workpiece |
| 12/08/1998 | US5846122 Method and apparatus for polishing metal-soluble materials such as diamond |
| 12/03/1998 | WO1998053952A1 Chemical mechanical planarization tool having a linear polishing roller |
| 12/03/1998 | DE19822495A1 Procedure for processing spherical mirror surfaces |
| 12/02/1998 | EP0881484A2 Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
| 12/02/1998 | EP0881040A2 Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing |
| 12/02/1998 | EP0881039A2 Wafer polishing apparatus with retainer ring |
| 12/02/1998 | EP0881038A1 Wafer chuck and method of manufacturing a semiconductor wafer |
| 12/02/1998 | EP0881035A1 Method for material removing machining of a wafer edge |
| 12/01/1998 | US5843269 Slurry dispensing system for chemical-mechanical polishing apparatus |
| 12/01/1998 | US5842912 Apparatus for conditioning polishing pads utilizing brazed diamond technology |
| 12/01/1998 | US5842910 Off-center grooved polish pad for CMP |
| 12/01/1998 | US5842909 System for real-time control of semiconductor wafer polishing including heater |
| 11/25/1998 | EP0879678A1 A carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| 11/25/1998 | EP0879115A1 Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers |
| 11/24/1998 | US5840202 Apparatus and method for shaping polishing pads |
| 11/18/1998 | EP0878838A2 Process for chemical-mechanical polishing of semiconductor or insulating layers |
| 11/18/1998 | EP0878270A2 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| 11/18/1998 | EP0878269A2 Apparatus for conditioning polishing pads |
| 11/18/1998 | EP0878268A2 Polishing apparatus and method for hard material-coated wafer |
| 11/18/1998 | CN1199429A Improved polishing slurries and method for their use |
| 11/17/1998 | US5837610 Chemical mechanical polishing (CMP) apparatus and CMP method using the same |
| 11/17/1998 | US5836807 Method and structure for polishing a wafer during manufacture of integrated circuits |
| 11/17/1998 | US5836805 Method of forming planarized layers in an integrated circuit |
| 11/12/1998 | WO1998050201A1 Mosaic polishing pads and methods relating thereto |
| 11/12/1998 | WO1998050200A1 Abrasive and method for polishing semiconductor substrate |
| 11/12/1998 | DE19719503A1 Semiconductor wafer chemical and mechanical polishing device |
| 11/12/1998 | DE19718473A1 Surface finishing machine for workpieces |
| 11/11/1998 | EP0877418A2 Edge-polishing apparatus and method |
| 11/11/1998 | EP0876242A1 A polishing pad and a method for making a polishing pad with covalently bonded particles |
| 11/11/1998 | CN2296798Y Regulating mechanism for axial displacement of rotary spindle of lapping machine |
| 11/10/1998 | US5834645 In a chemical mechanical planarization system |
| 11/10/1998 | US5834377 In situ method for CMP endpoint detection |
| 11/10/1998 | US5834375 Chemical-mechanical polishing planarization monitor |
| 11/10/1998 | US5833519 Method and apparatus for mechanical polishing |
| 11/05/1998 | WO1998049723A1 Method of planarizing the upper surface of a semiconductor wafer |
| 11/04/1998 | EP0875339A1 Method of flattening surfaces of sheet material, and method of manufacturing sheet material on the basis of same |
| 11/03/1998 | US5830806 Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
| 11/03/1998 | US5830048 Pivot sample block cross-section tool |
| 11/03/1998 | US5830045 Polishing apparatus |
| 11/03/1998 | US5830043 Chemical-mechanical polishing apparatus with in-situ pad conditioner |
| 11/03/1998 | US5830041 Method and apparatus for determining endpoint during a polishing process |