Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
08/1997
08/27/1997CN2260683Y Air-inflation polisher
08/27/1997CN2260682Y Automatic grinding machine for drill bit
08/26/1997US5660581 Grinding apparatus
08/20/1997EP0790100A1 Apparatus for and method of polishing workpiece
08/20/1997EP0701499A4 Improved polishing pads and methods for their use
08/19/1997US5659492 For removing a film from a wafer
08/19/1997US5658190 Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
08/19/1997US5658186 Jig for polishing the edge of a thin solid state array panel
08/19/1997US5658185 Chemical-mechanical polishing apparatus with slurry removal system and method
08/19/1997US5658183 System for real-time control of semiconductor wafer polishing including optical monitoring
08/14/1997WO1997028925A1 Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
08/13/1997CN1156651A Method and apparatus for lapping sliders
08/12/1997US5655954 Polishing apparatus
08/12/1997US5655951 Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
08/12/1997US5655949 Method of polishing waxers using a vertically stacked planarization machine
08/12/1997US5655475 Method of grinding thin-film magnetic heads using optical grinding markers
08/06/1997EP0788146A1 Method of polishing semiconductor wafers
08/06/1997EP0787562A1 Double side polishing machine and method of polishing opposite sides of a workpiece using the same
08/06/1997CN1156326A Grinding method and method for producing semiconductor device and equipment for making semiconductor
08/05/1997US5653624 Polishing apparatus with swinging structures
08/05/1997US5653622 Chemical mechanical polishing system and method for optimization and control of film removal uniformity
07/1997
07/30/1997EP0786803A1 Backing pad and method for polishing semiconductor wafer therewith
07/30/1997EP0786310A1 Wafer polishing head
07/30/1997EP0758941A4 Semiconductor wafer polishing apparatus and method
07/29/1997US5651725 Apparatus and method for polishing workpiece
07/29/1997US5651724 Method and apparatus for polishing workpiece
07/29/1997US5651720 Bore size correcting apparatus
07/24/1997WO1997026114A1 A polishing pad and a method for making a polishing pad with covalently bonded particles
07/23/1997EP0784517A1 Process and device for thoroughly cleaning surfaces
07/22/1997US5650039 Chemical mechanical polishing apparatus with improved slurry distribution
07/22/1997US5649855 For polishing a semiconductor substrate wafer
07/22/1997US5649854 Polishing apparatus with indexing wafer processing stations
07/22/1997US5649849 Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface
07/17/1997WO1997025660A1 In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
07/17/1997DE4345408A1 Semiconductor wafer polishing appts.
07/15/1997US5647952 Chemical/mechanical polish (CMP) endpoint method
07/15/1997US5647792 Polishing apparatus
07/15/1997US5647789 Polishing machine and a method of polishing a work
07/09/1997EP0703847A4 Magnetorheological polishing devices and methods
07/08/1997US5645736 Coating the surface a film forming binder with suspended particles, applying a wash to dissolve the film and release the particles for abrasion
07/08/1997US5645682 Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers
07/08/1997US5645675 Selective planarization apparatus
07/08/1997US5645474 Workpiece retaining device and method for producing the same
07/08/1997US5645473 Polishing apparatus
07/08/1997US5645472 For a disc
07/08/1997US5645470 Method of honing a knife blade
07/08/1997US5645469 Polishing pad with radially extending tapered channels
07/02/1997EP0782179A2 Method of manufacturing semiconductor mirror wafers
07/02/1997EP0781822A2 Polishing composition
07/02/1997EP0781628A1 Apparatus for polishing wafers
07/01/1997US5644221 Endpoint detection for chemical mechanical polishing using frequency or amplitude mode
07/01/1997US5643406 Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
07/01/1997US5643405 Both sides
07/01/1997US5643067 Dressing apparatus and method
07/01/1997US5643061 Pneumatic polishing head for CMP apparatus
07/01/1997US5643060 System for real-time control of semiconductor wafer polishing including heater
07/01/1997US5643056 Revolving drum polishing apparatus
07/01/1997US5643053 Chemical mechanical polishing apparatus with improved polishing control
07/01/1997US5643050 Chemical/mechanical polish (CMP) thickness monitor
07/01/1997US5643048 Endpoint regulator and method for regulating a change in wafer thickness in chemical-mechanical planarization of semiconductor wafers
07/01/1997US5643046 Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer
07/01/1997US5643044 Automatic chemical and mechanical polishing system for semiconductor wafers
06/1997
06/26/1997WO1997022442A1 Determining the coefficient of friction of a polishing pad
06/24/1997US5641345 Composition and method for refinishing compact disks
06/19/1997DE19547086C1 Device for flat machining of workpieces by grinding, polishing or lapping
06/19/1997DE19547085A1 Polishing machine for finishing workpiece
06/19/1997DE19546988A1 Semiconductor material treatment with grinding and ultrasonic cleaning
06/18/1997EP0779655A2 A method of chemically-mechanically polishing an electronic component
06/18/1997EP0779647A1 Method and apparatus for treatment of semiconductor material
06/18/1997EP0779624A1 Method and apparatus for lapping sliders
06/17/1997US5639388 Polishing endpoint detection method
06/17/1997US5639284 Binder containing hard abrasive grains
06/14/1997CA2191936A1 Method and apparatus for lapping sliders
06/12/1997WO1997020660A1 Substrate belt polisher
06/12/1997WO1997020658A1 Method of flattening surfaces of sheet material, and method of manufacturing sheet material on the basis of same
06/12/1997DE19545334A1 Rotary symmetrical valve seat manufacturing process
06/11/1997EP0706582A4 Improved compositions and methods for polishing
06/11/1997CN1151342A Polishing device having pad which has grooves and holes
06/10/1997US5637185 Chemical mechanical polishing slurry, electrochemical potential measuring means for measuring potential of slurry during polishing
06/10/1997US5637031 Electrochemical simulator for chemical-mechanical polishing (CMP)
06/05/1997WO1997020343A1 Semiconductor device manufacturing method, chemical-mechanical polishing method, and device used for the polishing method
06/04/1997EP0777266A1 Polishing method, semiconductor device fabrication method, and semiconductor fabrication apparatus
06/04/1997EP0777264A1 Semiconductor wafer alignment member and clamp ring
06/04/1997EP0776730A1 Workpiece retaining device and method for producing the same
06/03/1997US5635083 Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
05/1997
05/28/1997EP0776030A2 Apparatus and method for double-side polishing semiconductor wafers
05/28/1997DE19543847A1 Polishing machine for flat, mirror-like finish
05/27/1997US5632669 Interactive method for lapping transducers
05/27/1997US5632667 No coat backside wafer grinding process
05/21/1997EP0774776A2 Process for recovering substrates
05/21/1997EP0774323A2 Apparatus and method for polishing substrates
05/14/1997EP0773269A2 Polishing slurry
05/14/1997EP0773088A1 Hone and manufacturing of the same
05/14/1997CN1149849A Lapping machine
05/13/1997US5628862 Polishing pad for chemical-mechanical polishing of a semiconductor substrate
05/07/1997EP0771611A1 Method and apparatus for determining endpoint in polishing process
05/07/1997EP0771235A1 Apparatus and method for use in chemical-mechanical polishing procedures
05/02/1997EP0770455A1 A conditioner apparatus for a chemical mechanical polishing system
04/1997
04/29/1997US5624304 Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers
04/29/1997US5624303 Semiconductor wafer polishing pad comprising polymeric matrix having bonding molecules covalently bonded thereto, abrasive particles covalently bonded to bonding molecules in uniform distribution