Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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08/27/1997 | CN2260683Y Air-inflation polisher |
08/27/1997 | CN2260682Y Automatic grinding machine for drill bit |
08/26/1997 | US5660581 Grinding apparatus |
08/20/1997 | EP0790100A1 Apparatus for and method of polishing workpiece |
08/20/1997 | EP0701499A4 Improved polishing pads and methods for their use |
08/19/1997 | US5659492 For removing a film from a wafer |
08/19/1997 | US5658190 Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers |
08/19/1997 | US5658186 Jig for polishing the edge of a thin solid state array panel |
08/19/1997 | US5658185 Chemical-mechanical polishing apparatus with slurry removal system and method |
08/19/1997 | US5658183 System for real-time control of semiconductor wafer polishing including optical monitoring |
08/14/1997 | WO1997028925A1 Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers |
08/13/1997 | CN1156651A Method and apparatus for lapping sliders |
08/12/1997 | US5655954 Polishing apparatus |
08/12/1997 | US5655951 Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers |
08/12/1997 | US5655949 Method of polishing waxers using a vertically stacked planarization machine |
08/12/1997 | US5655475 Method of grinding thin-film magnetic heads using optical grinding markers |
08/06/1997 | EP0788146A1 Method of polishing semiconductor wafers |
08/06/1997 | EP0787562A1 Double side polishing machine and method of polishing opposite sides of a workpiece using the same |
08/06/1997 | CN1156326A Grinding method and method for producing semiconductor device and equipment for making semiconductor |
08/05/1997 | US5653624 Polishing apparatus with swinging structures |
08/05/1997 | US5653622 Chemical mechanical polishing system and method for optimization and control of film removal uniformity |
07/30/1997 | EP0786803A1 Backing pad and method for polishing semiconductor wafer therewith |
07/30/1997 | EP0786310A1 Wafer polishing head |
07/30/1997 | EP0758941A4 Semiconductor wafer polishing apparatus and method |
07/29/1997 | US5651725 Apparatus and method for polishing workpiece |
07/29/1997 | US5651724 Method and apparatus for polishing workpiece |
07/29/1997 | US5651720 Bore size correcting apparatus |
07/24/1997 | WO1997026114A1 A polishing pad and a method for making a polishing pad with covalently bonded particles |
07/23/1997 | EP0784517A1 Process and device for thoroughly cleaning surfaces |
07/22/1997 | US5650039 Chemical mechanical polishing apparatus with improved slurry distribution |
07/22/1997 | US5649855 For polishing a semiconductor substrate wafer |
07/22/1997 | US5649854 Polishing apparatus with indexing wafer processing stations |
07/22/1997 | US5649849 Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface |
07/17/1997 | WO1997025660A1 In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link |
07/17/1997 | DE4345408A1 Semiconductor wafer polishing appts. |
07/15/1997 | US5647952 Chemical/mechanical polish (CMP) endpoint method |
07/15/1997 | US5647792 Polishing apparatus |
07/15/1997 | US5647789 Polishing machine and a method of polishing a work |
07/09/1997 | EP0703847A4 Magnetorheological polishing devices and methods |
07/08/1997 | US5645736 Coating the surface a film forming binder with suspended particles, applying a wash to dissolve the film and release the particles for abrasion |
07/08/1997 | US5645682 Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers |
07/08/1997 | US5645675 Selective planarization apparatus |
07/08/1997 | US5645474 Workpiece retaining device and method for producing the same |
07/08/1997 | US5645473 Polishing apparatus |
07/08/1997 | US5645472 For a disc |
07/08/1997 | US5645470 Method of honing a knife blade |
07/08/1997 | US5645469 Polishing pad with radially extending tapered channels |
07/02/1997 | EP0782179A2 Method of manufacturing semiconductor mirror wafers |
07/02/1997 | EP0781822A2 Polishing composition |
07/02/1997 | EP0781628A1 Apparatus for polishing wafers |
07/01/1997 | US5644221 Endpoint detection for chemical mechanical polishing using frequency or amplitude mode |
07/01/1997 | US5643406 Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus |
07/01/1997 | US5643405 Both sides |
07/01/1997 | US5643067 Dressing apparatus and method |
07/01/1997 | US5643061 Pneumatic polishing head for CMP apparatus |
07/01/1997 | US5643060 System for real-time control of semiconductor wafer polishing including heater |
07/01/1997 | US5643056 Revolving drum polishing apparatus |
07/01/1997 | US5643053 Chemical mechanical polishing apparatus with improved polishing control |
07/01/1997 | US5643050 Chemical/mechanical polish (CMP) thickness monitor |
07/01/1997 | US5643048 Endpoint regulator and method for regulating a change in wafer thickness in chemical-mechanical planarization of semiconductor wafers |
07/01/1997 | US5643046 Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer |
07/01/1997 | US5643044 Automatic chemical and mechanical polishing system for semiconductor wafers |
06/26/1997 | WO1997022442A1 Determining the coefficient of friction of a polishing pad |
06/24/1997 | US5641345 Composition and method for refinishing compact disks |
06/19/1997 | DE19547086C1 Device for flat machining of workpieces by grinding, polishing or lapping |
06/19/1997 | DE19547085A1 Polishing machine for finishing workpiece |
06/19/1997 | DE19546988A1 Semiconductor material treatment with grinding and ultrasonic cleaning |
06/18/1997 | EP0779655A2 A method of chemically-mechanically polishing an electronic component |
06/18/1997 | EP0779647A1 Method and apparatus for treatment of semiconductor material |
06/18/1997 | EP0779624A1 Method and apparatus for lapping sliders |
06/17/1997 | US5639388 Polishing endpoint detection method |
06/17/1997 | US5639284 Binder containing hard abrasive grains |
06/14/1997 | CA2191936A1 Method and apparatus for lapping sliders |
06/12/1997 | WO1997020660A1 Substrate belt polisher |
06/12/1997 | WO1997020658A1 Method of flattening surfaces of sheet material, and method of manufacturing sheet material on the basis of same |
06/12/1997 | DE19545334A1 Rotary symmetrical valve seat manufacturing process |
06/11/1997 | EP0706582A4 Improved compositions and methods for polishing |
06/11/1997 | CN1151342A Polishing device having pad which has grooves and holes |
06/10/1997 | US5637185 Chemical mechanical polishing slurry, electrochemical potential measuring means for measuring potential of slurry during polishing |
06/10/1997 | US5637031 Electrochemical simulator for chemical-mechanical polishing (CMP) |
06/05/1997 | WO1997020343A1 Semiconductor device manufacturing method, chemical-mechanical polishing method, and device used for the polishing method |
06/04/1997 | EP0777266A1 Polishing method, semiconductor device fabrication method, and semiconductor fabrication apparatus |
06/04/1997 | EP0777264A1 Semiconductor wafer alignment member and clamp ring |
06/04/1997 | EP0776730A1 Workpiece retaining device and method for producing the same |
06/03/1997 | US5635083 Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate |
05/28/1997 | EP0776030A2 Apparatus and method for double-side polishing semiconductor wafers |
05/28/1997 | DE19543847A1 Polishing machine for flat, mirror-like finish |
05/27/1997 | US5632669 Interactive method for lapping transducers |
05/27/1997 | US5632667 No coat backside wafer grinding process |
05/21/1997 | EP0774776A2 Process for recovering substrates |
05/21/1997 | EP0774323A2 Apparatus and method for polishing substrates |
05/14/1997 | EP0773269A2 Polishing slurry |
05/14/1997 | EP0773088A1 Hone and manufacturing of the same |
05/14/1997 | CN1149849A Lapping machine |
05/13/1997 | US5628862 Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
05/07/1997 | EP0771611A1 Method and apparatus for determining endpoint in polishing process |
05/07/1997 | EP0771235A1 Apparatus and method for use in chemical-mechanical polishing procedures |
05/02/1997 | EP0770455A1 A conditioner apparatus for a chemical mechanical polishing system |
04/29/1997 | US5624304 Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers |
04/29/1997 | US5624303 Semiconductor wafer polishing pad comprising polymeric matrix having bonding molecules covalently bonded thereto, abrasive particles covalently bonded to bonding molecules in uniform distribution |