Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
03/1992
03/25/1992CN1015969B Method and device for crystal chip angle measuring and lapping
03/19/1992DE4029346A1 Machine for lapping faces of disks - has carrier plates with gear teeth offset and half plate thickness so that plates can be overlapped
03/18/1992EP0474768A1 Ultra-precision lapping apparatus
03/17/1992US5096854 Method for polishing a silicon wafer using a ceramic polishing surface having a maximum surface roughness less than 0.02 microns
03/17/1992US5095661 Apparatus for transporting wafer to and from polishing head
02/1992
02/19/1992EP0471389A2 Aluminum oxide/aluminum oxynitride/group IVB metal nitride abrasive particles derived from a sol-gel process
02/04/1992US5085009 Carrier for supporting workpiece to be polished
01/1992
01/28/1992US5083401 Method of polishing
01/22/1992CN2093718U Lapping device
01/21/1992US5081796 Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
01/21/1992US5081795 Polishing apparatus
01/15/1992EP0465868A2 Controlled compliance polishing pad
01/14/1992US5081421 In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
01/14/1992US5081051 Semiconductors, cutting grooves with serrated blade
01/08/1992EP0464864A2 Apparatus for transporting a wafer
12/1991
12/31/1991US5077464 Method and apparatus for endpoint detection in a semiconductor wafer etching system
12/31/1991US5076026 Microscopic grinding method and microscopic grinding device
12/31/1991US5076024 Disk polisher assembly
12/25/1991CN2091202U Hard ring and bracelets grinding device
12/18/1991EP0364514B1 Device for a twin-disk lapping machine
12/18/1991EP0304472A4 Biased grinding assembly
12/11/1991EP0460384A1 End point detector for polishing operations
12/03/1991US5069002 Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
11/1991
11/19/1991US5065550 Lapping of involute spiral scroll element
11/13/1991CN1056162A In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
11/06/1991EP0455455A2 In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
10/1991
10/30/1991EP0454362A2 Backing pad and method of forming the backing pad by precision surface machining
10/29/1991US5060424 Surface grinding apparatus
10/23/1991EP0452501A1 Electro-abrasive Polishing Process of the Inner Surface of Pipes to Extra-smooth Mirror Finish
10/17/1991DE4011993A1 Single-sided polished semiconductor disc mfg. system - uses upper and lower polishing surfaces for polishing opposing pairs of discs
10/16/1991EP0451471A2 Method and apparatus for polishing a semiconductor wafer
10/15/1991US5057152 Surface cleaner/polish compositions and a process for the preparation thereof
10/08/1991US5054244 Polishing apparatus
10/03/1991WO1991014538A1 Apparatus for interlayer planarization of semiconductor material
09/1991
09/17/1991US5048238 Non-contact machining of spherical surface
08/1991
08/28/1991EP0443285A1 Lapping machine, and lapping plate therefor with variable groove pitch
08/22/1991WO1991012113A1 System for controlling the force applied to a workpiece by a tool element
08/20/1991US5041173 Cast iron with increased concentration of fine graphite spheres
08/20/1991US5040336 Non-contact polishing
08/14/1991EP0441640A2 Sintered aluminous abrasive grains and method of producing the same
08/10/1991CA2036051A1 Sintered aluminous abrasive and method of producing same
08/06/1991US5036630 Radial uniformity control of semiconductor wafer polishing
08/06/1991US5036625 Lapping plate for a lapping and polishing machine
07/1991
07/31/1991EP0439124A2 Polishing pad with uniform abrasion
07/30/1991US5036015 Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
07/10/1991EP0436315A2 Injection moldable plastic laps
07/03/1991EP0435815A1 Lapping of involute spiral scroll element
07/02/1991US5028242 Lapping member and lapping tape
06/1991
06/27/1991WO1991008863A1 Methods of preparation of surfaces and applications thereof
06/26/1991EP0316451A4 Device for abrasive machining
06/18/1991US5023991 Electrical guide for tight tolerance machining
06/12/1991EP0431553A2 Microscopic grinding method and microscopic grinding device
06/11/1991US5022191 Polishing plate
06/06/1991DE3939362A1 Lapping machine for hard, brittle components - has opposed eccentrically running lapping rings with separate electrically controlled and synchronised drives
06/04/1991US5020283 Polishing pad with uniform abrasion
05/1991
05/21/1991US5016399 Planetary lap
05/02/1991WO1991006388A1 Method of super-mirror finishing with electrolytic grinding for internal surface of small-diameter tube
04/1991
04/23/1991US5010491 Automated system for machining parts to close tolerances
04/17/1991EP0383910A4 Method and cassette for abrasive machining of the surface of parts
04/17/1991EP0308519A4 Machine tool for abrasive machining of flat surfaces
04/02/1991US5003728 Machine for abrasive treatment
03/1991
03/27/1991CN2073790U Micrometer grinder
03/06/1991CN2072462U Plate abrading machine
03/05/1991US4998021 Method of detecting an end point of surface treatment
03/05/1991US4996798 Ultra-precision lapping apparatus
02/1991
02/13/1991EP0412537A2 Process and device for the treatment of chemico-mechanical publishing fabrics, particularly for semiconductor wafers
02/07/1991DE4022009A1 Grinding and polishing small spherical lenses - involves working lens surface against abrasive layer flowing over conical mouth of rapidly rotating tube
02/07/1991DE3925274A1 Supply and dispensing mechanism for lapping mixt.
02/06/1991EP0411643A2 Method of grinding a plate-like material and apparatus for carrying out the method
02/06/1991EP0411413A2 Method and composition for polishing metal surfaces
02/06/1991EP0411346A2 Precision grinding machine for lapping, precision grinding or polishing
02/06/1991EP0411345A2 Feeding and dosing equipment for the lapping mixture in polishing machines for lapping, grinding or polishing
01/1991
01/23/1991EP0185767B1 Film for machining wafers
01/10/1991DE3921509A1 Plane lapping machine with automatic loading and unloading - has workpiece carrier ring set eccentric to lapping wheel to provide load and unload sectors
01/01/1991US4980995 Method of faceting gemstones
12/1990
12/26/1990CN2068037U Hand air valve finishing unit
12/26/1990CN1047998A Integral method and device for angle calibration and grinding of crystal plate
12/19/1990EP0403287A2 Method of polishing semiconductor wafer
12/19/1990EP0402520A2 Automatic wafer adhering device
12/18/1990US4977707 Device for external magnetic abrasive machining of cylindrical components
12/13/1990WO1990014926A1 Ultra-precision lapping apparatus
12/04/1990US4974370 Lapping and polishing machine
11/1990
11/30/1990CA2017659A1 Ultra precision lapping apparatus
11/28/1990EP0399088A2 Lapping machine
11/20/1990CA1276469C Textured lapping plate and process for its manufacture
10/1990
10/24/1990EP0394213A1 Ceramic sintered bodies
10/24/1990EP0393615A1 Polishing apparatus
10/16/1990US4962616 Method and device for controlling the operation of honing machines
10/02/1990US4960485 Automatic wafer mounting device
09/1990
09/26/1990EP0388972A2 Apparatus for grinding semiconductor wafer
09/25/1990US4959113 Method and composition for polishing metal surfaces
09/25/1990US4958464 Lapping machine
09/20/1990DE4006307A1 Water sol. scouring powder - contg. powder or fine particles of water sol. inorganic cpd.
09/19/1990EP0387988A1 Buffing composition
09/04/1990US4954142 Abrasive, transition metal chelated salt, solvent
09/04/1990US4954141 Corrosion resistant fluoropolymer
09/04/1990US4953982 Method and apparatus for endpoint detection in a semiconductor wafer etching system
08/1990
08/29/1990EP0383910A1 Method and cassette for abrasive machining of the surface of parts
08/22/1990EP0383738A1 Lapping control system for magnetic transducers
07/1990
07/31/1990US4944119 Apparatus for transporting wafer to and from polishing head