Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
09/1999
09/14/1999US5951371 Multi-point bending of bars during fabrication of magnetic recording heads
09/14/1999US5951370 Method and apparatus for monitoring and controlling the flatness of a polishing pad
09/08/1999EP0940222A2 Method and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
09/08/1999EP0940221A2 Polishing machine
09/08/1999EP0940219A2 A wafer processing machine and a processing method thereby
09/08/1999CN2336916Y Steel ball lapping plate
09/07/1999US5949927 In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
09/07/1999US5948699 Wafer backing insert for free mount semiconductor polishing apparatus and process
09/07/1999US5948697 Catalytic acceleration and electrical bias control of CMP processing
09/07/1999US5948206 Apparatus for determining removed amount of wafer
09/07/1999US5948205 Polishing apparatus and method for planarizing layer on a semiconductor wafer
09/07/1999US5948204 Wafer carrier ring method and apparatus for chemical-mechanical planarization
09/07/1999US5948203 Optical dielectric thickness monitor for chemical-mechanical polishing process monitoring
09/07/1999US5947802 Wafer shuttle system
09/02/1999WO1999043465A1 Apparatus and method for the face-up surface treatment of wafers
09/02/1999WO1999026763A3 Polishing apparatus
09/01/1999EP0939431A1 Cerium oxide abrasive and method of abrading substrates
09/01/1999CN2335740Y Spring lapping machine
09/01/1999CN1227519A Abrasive construction for semiconductor wafer modification
09/01/1999CN1227152A Chemical mechanical polishing apparatus and method of chemical mechanical polishing
08/1999
08/31/1999US5945346 Chemical mechanical planarization system and method therefor
08/31/1999US5944593 Retainer ring for polishing head of chemical-mechanical polish machines
08/31/1999US5944591 Sure-seal rolling pin assembly
08/31/1999US5944590 Polishing apparatus having retainer ring rounded along outer periphery of lower surface and method of regulating retainer ring to appropriate configuration
08/31/1999US5944589 Abrasive pad and manufacturing method thereof and substrate polishing method using said abrasive pad
08/31/1999US5944588 Chemical mechanical polisher
08/31/1999US5944585 Use of abrasive tape conveying assemblies for conditioning polishing pads
08/31/1999US5944584 Apparatus and method for chamfering wafer with loose abrasive grains
08/31/1999US5944583 For polishing a semiconductor wafer
08/31/1999US5944582 Chemical mechanical polishing with a small polishing pad
08/31/1999US5944580 For a chemical mechanical polishing apparatus
08/26/1999WO1999042537A1 Optical polishing formulation
08/26/1999WO1999042200A1 Aerosol method and apparatus for making particulate products
08/26/1999DE19807948A1 Tool for surface preparation with adjustable working severity, especially for grinding, lapping and polishing of technical and optical functional surfaces
08/25/1999EP0937544A2 Surface treatment
08/24/1999US5941762 Method and apparatus for improved conditioning of polishing pads
08/24/1999US5941761 Shaping polishing pad to control material removal rate selectively
08/24/1999US5941759 Lapping method using upper and lower lapping turntables
08/24/1999US5941758 Method and apparatus for chemical-mechanical polishing
08/19/1999WO1999041039A1 Improved end effector for pad conditioning
08/19/1999WO1999041038A1 Groove cleaning device for chemical-mechanical polishing
08/19/1999WO1999041022A1 Accurate positioning of a wafer
08/19/1999WO1999033610A8 Magnetic float polishing of magnetic materials
08/18/1999CN2333488Y Portable valve grinder
08/17/1999US5938884 Apparatus for chemical mechanical polishing
08/17/1999US5938801 Polishing pad and a method for making a polishing pad with covalently bonded particles
08/17/1999US5938512 Wafer holding jig
08/17/1999US5938507 Linear conditioner apparatus for a chemical mechanical polishing system
08/17/1999US5938506 Methods and apparatus for conditioning grinding stones
08/17/1999US5938504 Substrate polishing apparatus
08/17/1999US5938502 Polishing method of substrate and polishing device therefor
08/11/1999EP0934801A2 Method and apparatus for polishing work
08/11/1999CN2332532Y Bicycle frame grinder
08/10/1999US5936733 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers
08/10/1999US5934984 Polishing apparatus
08/10/1999US5934981 Method for polishing thin plate and apparatus for polishing
08/10/1999US5934980 Method of chemical mechanical polishing
08/10/1999US5934979 Chemical mechanical polishing apparatus using multiple polishing pads
08/10/1999US5934977 Method of planarizing a workpiece
08/10/1999US5934974 In-situ monitoring of polishing pad wear
08/05/1999WO1999038651A1 Polishing apparatus and polishing table therefor
08/05/1999WO1999038650A1 Method and apparatus for polishing ophthalmic lenses
08/05/1999WO1999038649A1 Polishing apparatus with improved alignment of polishing plates
08/05/1999DE19903840A1 Poliervorrichtung mit verbesserter Ausrichtung der Polierplatten Polishing apparatus with improved alignment of the polishing plates
08/04/1999EP0933166A1 Abrasive and method for polishing semiconductor substrate
08/04/1999EP0879115A4 Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
08/04/1999CN1224647A Honing technology and equipment for cylinder sleeve of engine
08/03/1999US5932486 Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
08/03/1999US5931725 Wafer polishing machine
08/03/1999US5931724 Mechanical fastener to hold a polishing pad on a platen in a chemical mechanical polishing system
08/03/1999US5931722 Chemical mechanical polishing apparatus
08/03/1999US5931719 For polishing a surface of a semiconductor wafer
07/1999
07/29/1999WO1999037441A1 Polishing apparatus
07/28/1999EP0931624A2 Surface polishing apparatus with upper surface plate elevating mechanism
07/28/1999EP0931623A1 Automatic workpiece transport apparatus for double-side polishing machine
07/28/1999EP0931118A1 Composition and method for polishing a composite comprising titanium
07/28/1999EP0930978A1 Composition and method for polishing a composite
07/28/1999EP0930955A1 Polishing pad contour indicator for mechanical or chemical-mechanical planarization
07/27/1999US5928962 Process for forming a semiconductor device
07/27/1999US5928062 Vertical polishing device and method
07/22/1999WO1999036196A1 A cleaning/buffing apparatus for use in a wafer processing device
07/21/1999CN1223308A Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture
07/21/1999CN1223194A Apparatus for dispensing slurry
07/20/1999US5925576 Plugging selected perforations in a carrier assembly used for polishing semiconductor wafers; plug has pressure-resistant portion with leak resistant portion extending therefrom, designed to fit snugly into bottom portion
07/20/1999US5924916 Apparatus and method for polishing a semiconductor wafer
07/20/1999US5924154 Brush assembly apparatus
07/15/1999WO1999034958A1 Wafer polishing with improved end point detection
07/15/1999WO1999034957A1 Workpiece carrier with monopiece pressure plate and low gimbal point
07/15/1999WO1999034956A1 Economic supply and mixing method for multiple component cmp slurries
07/15/1999WO1999029505A8 Polishing solution feeder
07/14/1999EP0928662A2 Semiconductor wafer surface flattening apparatus
07/14/1999CN2328473Y High efficiency composite super precision working apparatus
07/14/1999CN2328472Y Grinding clip for air valve
07/14/1999CN1222429A Wafer carrier head with inflatable bladder and attack angle control for polishing
07/13/1999US5922620 Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
07/13/1999US5922135 Method of removing residual wax from silicon wafer polishing plate
07/13/1999US5921856 CVD diamond coated substrate for polishing pad conditioning head and method for making same
07/13/1999US5921855 Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
07/13/1999US5921853 Apparatus for polishing substrate using resin film or multilayer polishing pad
07/13/1999US5921852 Polishing apparatus having a cloth cartridge
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