Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
10/1998
10/29/1998WO1998047662A1 Polishing pad for a semiconductor substrate
10/29/1998WO1998047661A1 Chemicals supply system and its use
10/28/1998EP0874390A1 Grinding method of grinding device
10/28/1998EP0874036A1 Fine particulate polishing agent, method for producing the same and method for producing semiconductor devices.
10/28/1998EP0873544A1 In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
10/28/1998CN1197543A Method of modifying an exposed surface of semiconductor wafer
10/28/1998CN1197542A Grinding method of grinding device
10/27/1998US5827779 Method of manufacturing semiconductor mirror wafers
10/27/1998US5827395 Polishing pad used for polishing silicon wafers and polishing method using the same
10/27/1998US5827115 Polishing apparatus
10/27/1998US5827110 Polishing facility
10/22/1998WO1998046395A1 Slurry distribution system that continuously circulates slurry through a distribution loop
10/22/1998DE19715974A1 Versorgungssystem für Chemikalien und dessen Verwendung Supply system for chemicals and the use thereof
10/21/1998CN1196288A Polishing apparatus
10/20/1998US5823855 Polishing pad and a method for making a polishing pad with covalently bonded particles
10/20/1998US5823854 Chemical-mechanical polish (CMP) pad conditioner
10/20/1998US5823853 Apparatus for the in-process detection of workpieces with a monochromatic light source
10/20/1998US5823736 Substrate processing device and method for substrate from the substrate processing device
10/15/1998WO1998045399A1 Ethylenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process
10/15/1998WO1998045112A1 Polishing pads and methods relating thereto
10/15/1998WO1998045090A1 Polishing media magazine for improved polishing
10/15/1998WO1998045089A1 Manufacturing method, polishing method and polishing device for semiconductor devices
10/15/1998WO1998045087A1 Improved polishing pads and methods relating thereto
10/14/1998EP0870578A1 Superabrasive tool and method of its manufacture
10/14/1998EP0870577A2 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
10/14/1998EP0870576A2 Polishing Apparatus
10/14/1998CN1195840A Manufacturing method for magnetic heads
10/14/1998CN1195599A Automatic lapping method of thin film element and lapping apparatus using the same
10/14/1998CN1195598A Lapping apparatus
10/14/1998CN1195597A Automatic lapping method and lapping apparatus using the same
10/14/1998CN1195596A Lapping apparatus
10/14/1998CN1195595A Apparatus and method for polishing flat surface using belted polishing pad
10/13/1998US5821167 Method of manufacturing semiconductor mirror wafers
10/13/1998US5820449 For polishing planar faces of a structure
10/13/1998US5820448 Carrier head with a layer of conformable material for a chemical mechanical polishing system
10/07/1998EP0868977A2 Method and apparatus for adhesion of semiconductor substrate
10/07/1998EP0868976A2 Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
10/07/1998EP0868975A1 Polishing apparatus
10/07/1998EP0868974A2 Grinding method, surface grinder, work piece support mechanism, and work rest
10/07/1998EP0868543A1 Improved polishing slurries and methods for their use
10/07/1998EP0868258A1 Substrate belt polisher
10/06/1998US5817245 Method of and apparatus for tribochemically finishing ceramic workpiece
10/06/1998US5816900 Apparatus for polishing a substrate at radially varying polish rates
10/06/1998US5816899 Micro precise polishing apparatus
10/06/1998US5816891 Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput
10/06/1998US5816890 Electrical lap guide wiring configuration
09/1998
09/30/1998EP0846040A4 Polishing pads
09/30/1998CN2292633Y Three-purpose lapping machine
09/29/1998US5814409 Expanded fluorine type resin products and a preparation process thereof
09/29/1998US5814240 Method for polishing a semiconductor wafer
09/23/1998EP0865875A2 Precise polishing apparatus and method
09/23/1998EP0865874A2 Polishing apparatus and method
09/23/1998CN1193932A Polishing pads
09/22/1998US5810964 Chemical mechanical polishing device for a semiconductor wafer
09/17/1998WO1998040453A1 Alkanolamine semiconductor process residue removal composition and process
09/15/1998US5807165 Method of electrochemical mechanical planarization
09/11/1998WO1998039058A1 EXTRACORPOREAL WHOLE BODY HYPERTHERMIA USING ALPHA-STAT REGULATION OF BLOOD pH AND pC0¿2?
09/10/1998DE19708540A1 Crystal polishing holder
09/09/1998CN2290446Y Manual air valve grinder
09/09/1998CN1192710A Method and apparatus for optical polishing
09/08/1998US5804507 Radially oscillating carousel processing system for chemical mechanical polishing
09/08/1998US5803799 Wafer polishing head
09/08/1998US5803798 Dual column abrading machine
09/08/1998US5803599 Apparatus and method for mixing chemicals to be used in chemical-mechanical polishing procedures
09/02/1998EP0861706A1 Polishing apparatus
09/01/1998US5801066 Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
09/01/1998US5800577 Polishing composition for chemical mechanical polishing
09/01/1998US5800254 Automatic apparatus for grinding and polishing samples
09/01/1998US5800253 Disc streak pattern forming method and apparatus
09/01/1998US5800251 Apparatus and method of lapping works
09/01/1998US5800248 Control of chemical-mechanical polishing rate across a substrate surface
08/1998
08/27/1998WO1998037576A1 Method for manufacturing semiconductor device and system therefor
08/27/1998WO1998037166A1 Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same
08/27/1998WO1998037165A1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same
08/27/1998WO1998036888A1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
08/27/1998WO1998036887A1 Aerosol method and apparatus for making particulate products
08/26/1998EP0860239A2 Apparatus and method for polishing a flat surface using a belted polishing pad
08/26/1998EP0860238A2 Polishing apparatus
08/26/1998EP0860237A2 Surface planarization apparatus and work measuring method
08/25/1998US5797789 Polishing system
08/20/1998WO1998036442A2 Integrated pad and belt for chemical mechanical polishing
08/20/1998WO1998036045A1 Post clean treatment
08/20/1998WO1998035786A1 Intergrated pad and belt for chemical mechanical polishing
08/20/1998WO1998035785A1 Integrated pad and belt for chemical mechanical polishing
08/19/1998EP0859399A2 Semiconductor wafer polishing apparatus with a flexible carrier plate
08/18/1998US5795401 Method for scrubbing substrate
08/18/1998US5795218 Polishing pad with elongated microcolumns
08/13/1998WO1998034760A1 Method and apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing
08/13/1998DE19804750A1 Polishing machine for manufacturing semiconductor chips
08/12/1998EP0857542A1 Method of making a single side coated and final mirror polished wafer
08/12/1998EP0857541A2 Chemical and mechanical polishing apparatus
08/11/1998US5792709 High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers
08/11/1998US5792334 Method of surface finishing of metal moldings
08/11/1998US5791978 For engaging a workpiece against a polishing surface during polishing
08/11/1998US5791975 Backing pad
08/11/1998US5791973 Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
08/11/1998US5791970 Slurry recycling system for chemical-mechanical polishing apparatus
08/11/1998US5791969 System and method of automatically polishing semiconductor wafers
08/05/1998CN2287071Y Aerated reciprocal grinder
08/04/1998US5788560 Backing pad and method for polishing semiconductor wafer therewith
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