| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 06/28/2000 | EP1012876A2 Combined cmp and wafer cleaning apparatus and associated methods |
| 06/28/2000 | EP1011922A1 Polishing pad for a semiconductor substrate |
| 06/28/2000 | EP1011919A1 Improved polishing pads and methods relating thereto |
| 06/28/2000 | CN1258241A Polishing pad for semi-conductor substrate |
| 06/28/2000 | CN1053933C Improved compositions and method for polishing |
| 06/27/2000 | US6080673 Particle coagulation in the polishing slurry is minimized and the microelectronic device experiences minimal damage. |
| 06/27/2000 | US6080671 Process of chemical-mechanical polishing and manufacturing an integrated circuit |
| 06/27/2000 | US6080670 Method of detecting a polishing endpoint layer of a semiconductor wafer which includes a non-reactive reporting specie |
| 06/27/2000 | US6080050 Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
| 06/27/2000 | US6080049 Wafer polishing apparatus |
| 06/27/2000 | US6080048 Polishing machine |
| 06/27/2000 | US6080046 Underwater wafer storage and wafer picking for chemical mechanical polishing |
| 06/27/2000 | US6080042 Flatness and throughput of single side polishing of wafers |
| 06/27/2000 | US6080040 Wafer carrier head with inflatable bladder and attack angle control for polishing |
| 06/22/2000 | WO2000036637A1 Method of processing semiconductor wafers to build in back surface damage |
| 06/22/2000 | WO2000035630A1 Polishing carrier, surface polishing device, and surface polishing method |
| 06/22/2000 | WO2000035627A2 Multi-step chemical mechanical polishing |
| 06/21/2000 | EP1009589A1 Chemicals supply system and its use |
| 06/21/2000 | EP1009588A1 Polishing pad and method for making polishing pad with elongated microcolumns |
| 06/21/2000 | DE19942866A1 Automated polishing of arbitrarily shaped surfaces of metal or some other hard material involves use of brush with bundles of elastic and flexible filaments treated with abrasive particles |
| 06/21/2000 | CN1256992A Compositions and method for reducing hollow of patterned matel in chemical-mechanical polishing |
| 06/20/2000 | US6077785 Ultrasonic processing of chemical mechanical polishing slurries |
| 06/20/2000 | US6077783 Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer |
| 06/20/2000 | US6077581 Molded silica powder |
| 06/20/2000 | US6077437 Polishing agent recovery and reuse method and device for the same removes large impurities by a filtration device, concentrates by an ultrafiltration device, and continuously recovers polishing agent; used for semiconductor polishing |
| 06/20/2000 | US6077385 Polishing apparatus |
| 06/20/2000 | US6077155 Polishing device and correcting method therefor |
| 06/20/2000 | US6077153 Polishing pad and apparatus for polishing a semiconductor wafer |
| 06/20/2000 | US6077149 Method and apparatus for surface-grinding of workpiece |
| 06/20/2000 | US6077148 Spherical lapping method |
| 06/20/2000 | US6077147 Chemical-mechanical polishing station with end-point monitoring device |
| 06/20/2000 | US6076541 Dispensing system and method for dispensing an aqueous solution |
| 06/15/2000 | WO2000034994A1 Polishing platen rinse for controlled passivation of silicon/polysilicon surfaces |
| 06/15/2000 | WO2000034008A1 A polishing pad with a partial adhesive coating |
| 06/15/2000 | DE19957797A1 Surface polishing process for workpiece, involving rotating workpiece about its own axis and letting this run round a circumferential axis parallel to polishing plate axis |
| 06/15/2000 | CA2292172A1 Weightless manufacturing on earth |
| 06/14/2000 | EP1007308A4 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 06/14/2000 | EP1007308A1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 06/14/2000 | EP1007283A1 Mosaic polishing pads and methods relating thereto |
| 06/14/2000 | EP1007275A1 Cavitational polishing pad conditioner |
| 06/13/2000 | US6075606 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates |
| 06/13/2000 | US6074517 Method and apparatus for detecting an endpoint polishing layer by transmitting infrared light signals through a semiconductor wafer |
| 06/13/2000 | US6074291 Apparatus for preparing ultra-thin specimen |
| 06/13/2000 | US6074289 Apparatus for holding substrate to be polished |
| 06/13/2000 | US6074288 Modified carrier films to produce more uniformly polished substrate surfaces |
| 06/13/2000 | US6074287 Semiconductor wafer polishing apparatus |
| 06/13/2000 | US6074286 Wafer processing apparatus and method of processing a wafer utilizing a processing slurry |
| 06/13/2000 | US6074283 Lapping apparatus, lapping jig for use therein and workpiece mounting member attached to the lapping jig |
| 06/13/2000 | US6074277 Polishing apparatus |
| 06/13/2000 | US6074276 Polishing apparatus |
| 06/13/2000 | US6074275 Polishing system and method of control of same |
| 06/08/2000 | WO2000032356A1 Reverse linear polisher with loadable housing |
| 06/08/2000 | WO2000032353A2 A polishing machine and method |
| 06/07/2000 | EP1005626A1 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
| 06/06/2000 | US6071818 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material |
| 06/06/2000 | US6071179 Apparatus and method for grinding and polishing spherical bodies |
| 06/06/2000 | US6071178 Scored polishing pad and methods related thereto |
| 06/06/2000 | US6071177 Method and apparatus for determining end point in a polishing process |
| 06/06/2000 | CA2088282C Nano-sized alpha alumina particles |
| 06/02/2000 | WO2000030807A2 A carrier head with edge control for chemical mechanical polishing |
| 06/02/2000 | WO2000030806A1 Lapping and polishing device |
| 05/31/2000 | CN1255080A Mosaic polishing pads and method relating thereto |
| 05/31/2000 | CN1254922A Apparatus and method for machining slide blocks, and loading device and auxiliary for machining slide blocks |
| 05/31/2000 | CN1254633A Method for grinding glass substrate |
| 05/30/2000 | US6069771 Gimbal micropositioning device |
| 05/30/2000 | US6069083 Polishing substrate surface having a stop film underlying material to be polished away using slurry of abrasive particles composed of same material as stop film |
| 05/30/2000 | US6069080 Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
| 05/30/2000 | US6068787 Chemical mechanical polishing; mixture of catalyst and stabilizer |
| 05/30/2000 | US6068769 Tank of a kneader |
| 05/30/2000 | US6068549 Structure and method for three chamber CMP polishing head |
| 05/30/2000 | US6068548 Mechanically stabilized retaining ring for chemical mechanical polishing |
| 05/30/2000 | US6068545 Workpiece surface processing apparatus |
| 05/30/2000 | US6068544 Apparatus and method for calibrating a polishing head |
| 05/30/2000 | US6068542 Pad tape surface polishing method and apparatus |
| 05/30/2000 | US6068539 Wafer polishing device with movable window |
| 05/25/2000 | WO2000030159A1 Method to decrease dishing rate during cmp in metal semiconductor structures |
| 05/25/2000 | DE19853059A1 Polishing and grinding equipment workpiece holder e.g. for polishing semiconductor wafers |
| 05/24/2000 | EP1002626A2 A linear CMP tool design using in-situ slurry distribution and concurrent pad conditionning |
| 05/24/2000 | EP1002625A1 Cleaning device for surface plate correcting dresser |
| 05/24/2000 | EP1001865A1 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 05/24/2000 | EP1001864A1 A carrier head with local pressure control for a chemical mechanical polishing apparatus |
| 05/24/2000 | EP1001863A1 Method for producing a valve seat body for a fuel injection valve, and corresponding fuel injection valve |
| 05/24/2000 | CN2379246Y Multi-functional and combination type manual machine for lapping spiracle |
| 05/24/2000 | CN1254441A Method of planarizing upper surface of semiconductor wafer |
| 05/24/2000 | CN1254154A Crown forming method of flying head and its crown forming device |
| 05/23/2000 | US6066564 Indirect endpoint detection by chemical reaction |
| 05/23/2000 | US6066562 Method for fabricating silicon semiconductor discrete wafer |
| 05/23/2000 | US6066266 In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation |
| 05/23/2000 | US6066230 Planarization method, workpiece measuring method, and surface planarization apparatus having a measuring device |
| 05/23/2000 | US6066030 Electroetch and chemical mechanical polishing equipment |
| 05/23/2000 | US6066029 Method of flattening surfaces of sheet material, and method of manufacturing sheet material on the basis of same |
| 05/23/2000 | US6066028 Polishing of copper |
| 05/18/2000 | WO2000028586A2 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 05/18/2000 | WO2000028585A1 Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 05/18/2000 | WO2000027591A1 Chemical-mechanical-polishing system with continuous filtration |
| 05/18/2000 | WO2000027589A1 Polishing pad and polishing device |
| 05/18/2000 | WO2000027585A1 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 05/18/2000 | WO2000027584A1 Method and apparatus for improved semiconductor wafer polishing |
| 05/18/2000 | DE19953847A1 Wafer polishing device has a holder head for pressing the wafer against a rotating tensioning plate to polish the wafer |
| 05/17/2000 | EP1000995A1 Abrasive composition for the electronics industry |