Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/1999
11/10/1999EP0954407A2 Polishing apparatus
11/10/1999CN1234758A Multi-point bending of bars during fabrication of magnetic recording heads
11/10/1999CN1234603A Grinding method and method for producing grinding granules used in said grinding method
11/09/1999US5981454 Post clean treatment composition comprising an organic acid and hydroxylamine
11/09/1999US5981396 Positioning the stop-on feature semiconductor wafer against a layer of liquid solution on a planarizing surface of polishing pad, moving one pad or wafer with respect to other at low velocity, controlling temperature of platen
11/09/1999US5980685 Polishing apparatus
11/09/1999US5980368 Polishing tool having a sealed fluid chamber for support of polishing pad
11/09/1999US5980367 Semiconductor wafer polishing machine and method
11/09/1999US5980366 Methods and apparatus for polishing using an improved plate stabilizer
11/09/1999US5980363 Under-pad for chemical-mechanical planarization of semiconductor wafers
11/09/1999US5980361 Method and device for polishing semiconductor wafers
11/04/1999WO1999056189A1 Conductivity feedback control system for slurry blending
11/04/1999WO1999056078A1 Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection
11/04/1999WO1999055493A1 Polishing grinding wheel and substrate polishing method with this grinding wheel
11/04/1999WO1999055491A1 Chemical mechanical polishing with multiple polishing pads
11/03/1999EP0953409A2 Wafer surface machining apparatus
11/03/1999EP0953408A2 Carrier and polishing apparatus
11/02/1999US5976000 Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
11/02/1999US5975997 Method of double-side lapping a wafer and an apparatus therefor
11/02/1999US5975991 Method and apparatus for processing workpieces with multiple polishing elements
11/02/1999US5975986 Index table and drive mechanism for a chemical mechanical planarization machine
11/02/1999US5974679 Measuring the profile of a polishing pad in a chemical mechanical polishing system
10/1999
10/28/1999WO1999054088A1 A method of chemical mechanical polishing a metal layer
10/27/1999EP0951963A2 Wafer flattening process, wafer flattening system, and wafer
10/27/1999CN2345319Y Pneumatic grinding sander
10/26/1999US5972863 Applying a slurry containing silicon dioxide, aluminum oxide, aqueous solution comprising sodium hydroxide and deionized water
10/26/1999US5972792 Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
10/26/1999US5972787 CMP process using indicator areas to determine endpoint
10/26/1999US5972162 Wafer polishing with improved end point detection
10/26/1999US5972124 Method for cleaning a surface of a dielectric material
10/26/1999US5971836 Grinding machine
10/21/1999WO1999053121A1 Automated chemical process control system
10/20/1999EP0950468A2 Polishing apparatus
10/19/1999US5969521 Automatic measuring apparatus having a switching means to generate an output signal only when a sensor is positioned at a predetermined space
10/19/1999US5968841 Device and method for preventing settlement of particles on a chemical-mechanical polishing pad
10/19/1999US5967889 Fixture for mechanical grinding and inspection of failed or defective semiconductor devices
10/19/1999US5967885 Method of manufacturing an integrated circuit using chemical mechanical polishing
10/19/1999US5967882 Lapping apparatus and process with two opposed lapping platens
10/19/1999US5967881 Chemical mechanical planarization tool having a linear polishing roller
10/19/1999US5967880 Air bearing surface
10/19/1999US5967878 Lapping method and system for compensating for substrate bow
10/19/1999US5966766 Apparatus and method for cleaning semiconductor wafer
10/14/1999WO1999051398A1 Apparatus and methods for slurry removal in chemical mechanical polishing
10/14/1999WO1999051397A1 Polishing device
10/14/1999DE19907956A1 Vorrichtung und Verfahren zur Oberflächenbehandlung von aufwärts gewendeten Wafern Apparatus and method for surface treatment of upward-turned wafers
10/12/1999US5966485 Method of producing core protrusion relative to cladding in an optical fiber of a fiber optic connector
10/12/1999US5964978 Method and apparatus for adhesion of semiconductor substrate
10/12/1999US5964952 Method of cleaning surfaces with water and steam
10/12/1999US5964653 Carrier head with a flexible membrane for a chemical mechanical polishing system
10/12/1999US5964651 Apparatus for polishing planar substrates through rotating plates
10/12/1999US5964646 Grinding process and apparatus for planarizing sawed wafers
10/12/1999US5964643 Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
10/12/1999US5964413 Apparatus for dispensing slurry
10/07/1999WO1999050025A1 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
10/07/1999WO1999050023A1 Modular machine for polishing and planing substrates
10/06/1999EP0947300A2 An ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus
10/06/1999EP0947291A2 Slurry recycling system of CMP apparatus and method of same
10/06/1999EP0947289A1 Lapping machine
10/06/1999EP0947288A2 Carrier and CMP apparatus
10/06/1999EP0946979A1 Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
10/05/1999US5963821 Method of making semiconductor wafers
10/05/1999US5961378 Polishing apparatus
10/05/1999US5961373 Process for forming a semiconductor device
10/05/1999US5961372 Substrate belt polisher
10/05/1999US5961369 Methods for the in-process detection of workpieces with a monochromatic light source
10/05/1999US5961169 Apparatus for sensing the presence of a wafer
09/1999
09/29/1999EP0945219A1 A double sided processing machine
09/29/1999CN1230014A Improved method and apparatus for chemical mechanical planarization (CMP) of semiconductor wafer
09/29/1999CN1045317C Cylinder liner comprising supereutectic aluminium/silicon alloy and method of producing such a cylinder liner
09/28/1999US5958794 Method of modifying an exposed surface of a semiconductor wafer
09/28/1999US5958148 Method for cleaning workpiece surfaces and monitoring probes during workpiece processing
09/28/1999US5957764 Modular wafer polishing apparatus and method
09/28/1999US5957763 Polishing apparatus with support columns supporting multiple platform members
09/28/1999US5957759 Slurry distribution system that continuously circulates slurry through a distribution loop
09/28/1999US5957757 Conditioning CMP polishing pad using a high pressure fluid
09/28/1999US5957754 Cavitational polishing pad conditioner
09/28/1999US5957753 Magnetic float polishing of magnetic materials
09/28/1999US5957751 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
09/28/1999US5957750 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
09/28/1999US5957749 Apparatus for optical inspection of wafers during polishing
09/23/1999WO1999013498A8 Combined cmp and wafer cleaning apparatus and associated methods
09/22/1999EP0943398A2 Surface grinding machine and workpiece carrier used therefor
09/22/1999EP0943397A2 Platen of polishing apparatus and method of adhesion of polishing pad
09/21/1999US5954570 Conditioner for a polishing tool
09/16/1999WO1999046084A1 Polishing apparatus
09/16/1999WO1999046083A1 Cleaning device for surface plate correcting dresser
09/16/1999WO1999046081A1 Multi-step chemical mechanical polishing process and device
09/16/1999WO1999046063A1 Cleaning device
09/16/1999DE19833414A1 Planar etching of semiconductor component
09/15/1999EP0942535A1 Tri-state buffers
09/15/1999EP0941806A2 Wafer polishing device with moveable window
09/15/1999EP0941805A2 Workpiece surface processing apparatus
09/15/1999CN1228609A Method for planarization-etching semiconductor device
09/15/1999CN1228367A 晶片抛光装置和抛光方法 Wafer polishing apparatus and polishing method
09/14/1999US5952242 Method and device for removing a semiconductor wafer from a flat substrate
09/14/1999US5951724 Fine particulate polishing agent, method for producing the same and method for producing semiconductor devices
09/14/1999US5951382 Chemical mechanical polishing carrier fixture and system
09/14/1999US5951380 Polishing apparatus for a semiconductor wafer
09/14/1999US5951374 Method of polishing semiconductor wafers
09/14/1999US5951373 Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
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