| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 03/22/2000 | EP0987744A1 Method for optimizing the control of metal CMP processes |
| 03/22/2000 | EP0987307A2 Composition and method for reducing dishing in patterned metal during CMP process |
| 03/22/2000 | EP0987084A1 Polishing apparatus |
| 03/21/2000 | US6040245 IC mechanical planarization process incorporating two slurry compositions for faster material removal times |
| 03/21/2000 | US6040244 Polishing pad control method and apparatus |
| 03/21/2000 | US6039638 Work planarizing method and apparatus |
| 03/21/2000 | US6039635 Surface polishing apparatus including a dresser |
| 03/21/2000 | US6039633 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 03/21/2000 | US6039631 Polishing method, abrasive material, and polishing apparatus |
| 03/16/2000 | WO2000013854A1 Support for temporary fixation of a self-sticking abrasive and/or polishing sheet |
| 03/16/2000 | WO2000013852A1 Apparatuses and methods for polishing semiconductor wafers |
| 03/16/2000 | WO2000013851A1 A carrier head for chemical mechanical polishing a substrate |
| 03/15/2000 | EP0985007A1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 03/15/2000 | EP0984846A4 Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto |
| 03/15/2000 | EP0984846A1 Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto |
| 03/15/2000 | EP0701499B1 Improved polishing pads and methods for their use |
| 03/15/2000 | CN1247381A Equipment and method for transporting substrate mechanical polishing and grinding suspension |
| 03/15/2000 | CN1247380A Abrasive sheet |
| 03/15/2000 | CN1247118A Chemical and mechanical grinding bench |
| 03/14/2000 | US6036587 Carrier head with layer of conformable material for a chemical mechanical polishing system |
| 03/14/2000 | US6036586 Apparatus and method for reducing removal forces for CMP pads |
| 03/14/2000 | US6036583 Conditioner head in a substrate polisher and method |
| 03/14/2000 | US6036582 Polishing apparatus |
| 03/14/2000 | US6036579 Polymeric polishing pad having photolithographically induced surface patterns(s) and methods relating thereto |
| 03/14/2000 | US6036356 In-situ slurry mixing apparatus |
| 03/09/2000 | WO2000013218A1 Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 03/09/2000 | WO2000012647A1 Diamond abrasive particles and method for preparing the same |
| 03/09/2000 | WO2000012643A1 Wafer retainer and method for attaching/detaching the wafer retainer to/from polishing machine base plate |
| 03/09/2000 | WO2000012642A1 Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate |
| 03/09/2000 | WO2000012437A1 Glass powders, methods for producing glass powders and devices fabricated from same |
| 03/09/2000 | WO2000012264A1 Polishing pad having open area which varies with distance from initial pad surface |
| 03/09/2000 | WO2000012262A1 Polishing pad |
| 03/09/2000 | WO1999064205A8 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 03/08/2000 | EP0983822A1 Surface polishing apparatus |
| 03/08/2000 | CN1246505A Polishing composite |
| 03/08/2000 | CN1246402A Chemical-mechanical lapping bench |
| 03/07/2000 | US6033987 Method for mapping and adjusting pressure distribution of CMP processes |
| 03/07/2000 | US6033522 Surface treatment method and apparatus for rotatable disc |
| 03/07/2000 | US6033520 Apparatus for and method of polishing workpiece |
| 03/07/2000 | US6033449 Polishing tool |
| 03/07/2000 | US6033293 Apparatus for performing chemical-mechanical polishing |
| 03/07/2000 | US6033292 Wafer polishing apparatus with retainer ring |
| 03/07/2000 | US6033290 Chemical mechanical polishing conditioner |
| 03/02/2000 | WO2000010920A1 Aluminum oxide particles |
| 03/02/2000 | WO2000010771A1 Planetary gear system parallel planer |
| 03/01/2000 | EP0982766A1 Process for chemo-mechanical polishing of a copper-based material layer |
| 03/01/2000 | EP0982098A2 Polishing apparatus |
| 03/01/2000 | CN2366229Y Fibre-optical lapping machine |
| 02/29/2000 | US6030899 Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers |
| 02/29/2000 | US6030488 Chemical and mechanical polishing apparatus |
| 02/29/2000 | US6030487 Wafer carrier assembly |
| 02/29/2000 | US6030425 Slurry for chemical-mechanical polishing comprising high ph solution with particles of catalyst for accelerating polishing rate; catalyst is metal selected from platinum, silver, palladium, copper, rhodium, nickel, and iron |
| 02/29/2000 | US6030282 Method and apparatus for holding, grinding and polishing a packaged semiconductor die |
| 02/29/2000 | US6030280 Apparatus for holding workpieces during lapping, honing, and polishing |
| 02/29/2000 | US6030275 Variable control of carrier curvature with direct feedback loop |
| 02/23/2000 | EP0980741A1 Method and apparatus for abrasive slurry distribution in mechanical polishing of substrate |
| 02/23/2000 | CN2365012Y Lower-noise vibration lapping machine |
| 02/22/2000 | US6028006 Monitoring the ph of the polishing slurry circulating through wafer polishing apparatus, mixing an agent into the polishing slurry to adjust the ph of the polishing slurry as needed |
| 02/22/2000 | US6027997 An electroconductive layer, e.g. tungsten, deposited in a plug opening is chemomechanical polished using slurry comprising abrasive and copper sulfate or copper perchlorate to form plug |
| 02/22/2000 | US6027669 Polishing composition |
| 02/22/2000 | US6027659 Polishing pad conditioning surface having integral conditioning points |
| 02/22/2000 | US6027401 Headstock of a polishing machine |
| 02/22/2000 | US6027397 Dual element lapping guide system |
| 02/22/2000 | US6027240 Apparatus and method for precise mixing, delivery and transfer of chemicals |
| 02/17/2000 | WO2000007771A1 Polishing method and polishing device |
| 02/15/2000 | US6024829 Eliminating agglomerate particles in a polishing slurry used for polishing a semiconductor wafer |
| 02/15/2000 | US6024632 Grinding method using grit stuck to a tool having low hardness |
| 02/15/2000 | US6024630 Fluid-pressure regulated wafer polishing head |
| 02/15/2000 | US6024628 Method of determining real time removal rate for polishing |
| 02/10/2000 | WO2000007230A1 Method and apparatus for chemical mechanical polishing |
| 02/10/2000 | WO2000006352A1 Apparatus for sensing the presence of a wafer |
| 02/09/2000 | CN1244033A Method for polishing surface of copper boased material mechanically and chemically |
| 02/08/2000 | US6022807 Method for fabricating an integrated circuit |
| 02/08/2000 | US6022268 Polishing pads and methods relating thereto |
| 02/08/2000 | US6022266 In-situ pad conditioning process for CMP |
| 02/08/2000 | US6022265 Complementary material conditioning system for a chemical mechanical polishing machine |
| 02/08/2000 | US6022264 Polishing pad and methods relating thereto |
| 02/02/2000 | EP0976497A2 Cleaning apparatus |
| 02/02/2000 | EP0975731A1 Ethylenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
| 02/01/2000 | US6020264 Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing |
| 02/01/2000 | US6020262 Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer |
| 02/01/2000 | US6019868 Polishing apparatus |
| 02/01/2000 | US6019672 Grinding/polishing cover sheet for placing on a rotatable grinding/polishing disc |
| 02/01/2000 | US6019671 Carrier head for a chemical/mechanical polishing apparatus and method of polishing |
| 02/01/2000 | US6019670 Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
| 02/01/2000 | US6019667 Using grinding aid |
| 02/01/2000 | US6019666 Mosaic polishing pads and methods relating thereto |
| 02/01/2000 | US6019665 Controlled retention of slurry in chemical mechanical polishing |
| 02/01/2000 | US6019663 System for cleaning semiconductor device probe |
| 02/01/2000 | US6019250 Liquid dispensing apparatus and method |
| 01/26/2000 | CN1242729A Composition and slurry useful for metal CMP |
| 01/25/2000 | US6017265 Methods for using polishing pads |
| 01/25/2000 | US6017264 Deflection lapping apparatus and method for hydrodynamic bearing slider |
| 01/20/2000 | WO2000002708A1 Polishing pads for a semiconductor substrate |
| 01/20/2000 | WO2000002707A1 Polishing pad for a semiconductor substrate |
| 01/20/2000 | CA2337202A1 Polishing pads for a semiconductor substrate |
| 01/20/2000 | CA2336859A1 Polishing pad for a semiconductor substrate |
| 01/19/2000 | EP0972612A2 Polishing pad |
| 01/19/2000 | EP0971810A1 Method and apparatus for polishing ophthalmic lenses |
| 01/19/2000 | CN2359049Y Guartz sand grinder |