| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 08/22/2000 | US6106374 Acoustically agitated delivery |
| 08/22/2000 | US6106371 Effective pad conditioning |
| 08/22/2000 | US6106369 Polishing system |
| 08/17/2000 | WO2000047369A1 Method of polishing semiconductor wafers |
| 08/17/2000 | WO2000047368A1 Work holding disc for polishing, work polishing apparatus, and work polishing method |
| 08/16/2000 | EP1027576A1 Method and apparatus for modeling substrate reflectivity during chemical mechanical polishing |
| 08/15/2000 | US6103628 Reverse linear polisher with loadable housing |
| 08/15/2000 | US6102788 Semiconductor wafer carrier stage for chemical mechanical polishing apparatus |
| 08/15/2000 | US6102786 Polishing apparatus including turntable with polishing surface of different heights |
| 08/15/2000 | US6102784 Method and apparatus for improved gear cleaning assembly in polishing machines |
| 08/15/2000 | US6102782 System and apparatus for distributing flush fluid to processing equipment |
| 08/15/2000 | US6102780 Substrate polishing apparatus and method for polishing semiconductor substrate |
| 08/15/2000 | US6102779 Method and apparatus for improved semiconductor wafer polishing |
| 08/15/2000 | US6102778 Wafer lapping method capable of achieving a stable abrasion rate |
| 08/15/2000 | US6102777 Lapping apparatus and method for high speed lapping with a rotatable abrasive platen |
| 08/15/2000 | US6102776 Apparatus and method for controlling polishing of integrated circuit substrates |
| 08/15/2000 | US6102775 Film inspection method |
| 08/15/2000 | US6102057 Lifting and rinsing a wafer |
| 08/10/2000 | WO2000045993A1 Wafer holder and polishing device |
| 08/10/2000 | WO2000032353A3 A polishing machine and method |
| 08/09/2000 | EP1025955A2 Chemical mechanical polishing with a moving polishing sheet |
| 08/09/2000 | EP1025954A2 Apparatus and methods of substrate polishing |
| 08/09/2000 | CN1262639A Method and apparatus for polishing ophthalmic lenses |
| 08/08/2000 | US6099697 Removing residual charges from the support surface of an electrostatic chuck |
| 08/08/2000 | US6099394 Polishing system having a multi-phase polishing substrate and methods relating thereto |
| 08/08/2000 | US6099393 Polishing method for semiconductors and apparatus therefor |
| 08/08/2000 | US6099390 Polishing pad for semiconductor wafer and method for polishing semiconductor wafer |
| 08/08/2000 | US6099388 Method and apparatus for repairing a damaged compact disc |
| 08/08/2000 | US6099387 CMP of a circlet wafer using disc-like brake polish pads |
| 08/08/2000 | US6099386 Control device for maintaining a chemical mechanical polishing machine in a wet mode |
| 08/08/2000 | US6098901 Apparatus for dispensing slurry |
| 08/08/2000 | US6098638 Polishing a surface of a semiconductor substrate using polishing cloth by supplying a slurry onto the surface of the substrate, polishing until substrate gets a thickness, causing zeta potential on the abrasive particles |
| 08/03/2000 | WO2000044527A2 High quality optically polished aluminum mirror and process for producing |
| 08/03/2000 | DE19853060A1 Cutting or grinding jig especially for preparing and polishing silicon wafers |
| 08/02/2000 | CN1055037C Scraping method for fixed binding surface in position of grinding point |
| 08/01/2000 | US6096162 Chemical mechanical polishing machine |
| 08/01/2000 | US6096143 Wear resistance |
| 08/01/2000 | US6095905 Polishing fixture and method |
| 08/01/2000 | US6095904 Orbital motion chemical-mechanical polishing method and apparatus |
| 08/01/2000 | US6095902 For polishing silicon semiconductor substrates |
| 08/01/2000 | US6095898 Process and device for polishing semiconductor wafers |
| 07/27/2000 | WO2000043159A1 Improved polishing pads and methods relating thereto |
| 07/27/2000 | DE19955387A1 Polishing agent feed to semiconductor disc polisher based on chemical-mechanical polishing (CMP) for flattening intermediate insulation foil |
| 07/27/2000 | DE19902804A1 Lifetime self-indicate polishing pad for chemical mechanical polisher comprises a pad with body having multicolored indicate layers with a top surface |
| 07/26/2000 | EP1022778A1 Method of dividing a wafer and method of manufacturing a semiconductor device |
| 07/26/2000 | EP1022093A2 Endpoint detection with light beams of different wavelenghts |
| 07/25/2000 | US6093651 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| 07/25/2000 | US6093335 Method of surface finishes for eliminating surface irregularities and defects |
| 07/25/2000 | US6093280 Chemical-mechanical polishing pad conditioning systems |
| 07/25/2000 | US6093091 Holder for flat subjects in particular semiconductor wafers |
| 07/25/2000 | US6093088 Surface polishing machine |
| 07/25/2000 | US6093087 Wafer processing machine and a processing method thereby |
| 07/25/2000 | US6093086 Polishing head release mechanism |
| 07/25/2000 | US6093085 Apparatuses and methods for polishing semiconductor wafers |
| 07/25/2000 | US6093083 Row carrier for precision lapping of disk drive heads and for handling of heads during the slider fab operation |
| 07/25/2000 | US6093082 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| 07/25/2000 | US6093081 Polishing method and polishing apparatus using the same |
| 07/20/2000 | DE19901749A1 Chemical-mechanical wafer polishing pad has angle and depth of curved grooves, which are calculated by boundary layer effect of streamlined groove function, used to design optimum structure for polishing pad |
| 07/19/2000 | EP1020506A2 Water-laden solid matter of vapor-phase processed inorganic oxide particles and slurry for polishing and manufacturing method of semiconductor devices |
| 07/19/2000 | EP1020500A1 Polishing slurry |
| 07/19/2000 | EP1020254A1 Polishing method and polishing device |
| 07/19/2000 | EP1020253A2 Polishing method for wafer and holding plate |
| 07/19/2000 | EP1019949A1 Apparatus and method for cleaning semiconductor wafer |
| 07/18/2000 | US6090475 Polishing pads useful in determining an end to the useful wear life thereof through different color layers |
| 07/18/2000 | US6090239 Method of single step damascene process for deposition and global planarization |
| 07/18/2000 | US6089966 Surface polishing pad |
| 07/18/2000 | US6089965 Polishing pad |
| 07/18/2000 | US6089961 Wafer polishing carrier and ring extension therefor |
| 07/18/2000 | US6089960 Semiconductor wafer polishing mechanism |
| 07/18/2000 | US6089959 Polishing method and polishing apparatus |
| 07/13/2000 | DE10000240A1 Lapping tool has platform and shaft connected together via a rotatable connection, electrically conducting path extending from shaft to lower working surface of platform |
| 07/12/2000 | EP1018400A2 Planarization apparatus and method |
| 07/12/2000 | EP1017540A1 An abrasive means and a grinding process |
| 07/12/2000 | CN2386919Y Polisher |
| 07/11/2000 | US6086464 CMP platen plug |
| 07/11/2000 | US6086460 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 07/11/2000 | US6086457 Washing transfer station in a system for chemical mechanical polishing |
| 07/11/2000 | US6086456 Polishing method using a hydrostatic fluid bearing support having fluctuating fluid flow |
| 07/11/2000 | US6086454 Method of fabricating a semiconductor device using a CMP process |
| 07/06/2000 | WO2000039844A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
| 07/06/2000 | WO2000039843A1 Cmp abrasive, liquid additive for cmp abrasive and method for polishing substrate |
| 07/06/2000 | WO2000039841A1 Method for storing carrier for polishing wafer |
| 07/06/2000 | WO2000021715A3 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| 07/05/2000 | EP1017090A1 Semiconductor wafer polishing device |
| 07/05/2000 | EP1016133A1 Method of planarizing the upper surface of a semiconductor wafer |
| 07/05/2000 | EP1015177A1 Polishing media magazine for improved polishing |
| 07/05/2000 | EP1015176A1 Improved polishing pads and methods relating thereto |
| 07/05/2000 | EP1015175A1 Abrasive articles comprising a fluorochemical agent for wafer surface modification |
| 07/05/2000 | CN2385844Y Gem lapping machine |
| 07/04/2000 | US6083839 Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control |
| 07/04/2000 | US6083419 Polishing composition including an inhibitor of tungsten etching |
| 07/04/2000 | US6083090 Polishing apparatus for semiconductor wafers |
| 07/04/2000 | US6083089 Method and apparatus for chemical mechanical polishing |
| 07/04/2000 | US6083085 Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media |
| 07/04/2000 | US6083083 Separation type grinding surface plate and grinding apparatus using same |
| 07/04/2000 | US6083082 Spindle assembly for force controlled polishing |
| 07/04/2000 | US6083081 Lapping control sensor for magnetoresistive effect head, lapping control method using the sensor and manufacturing method of the sensor |
| 06/29/2000 | WO2000038223A1 Combination cmp-etch method for forming a thin planar layer over the surface of a device |
| 06/29/2000 | WO2000037578A1 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry |
| 06/29/2000 | DE19860090A1 Chemical-mechanical polishing unit for semiconductor elements, comprises a polishing table, a polishing plate with inner and outer ring sections, a wafer carrier, and a sludge supply tube |