| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/27/2000 | EP1038635A2 Polishing apparatus |
| 09/27/2000 | EP1038328A1 Apparatus and method for treating a cathode material provided on a thin-film substrate |
| 09/27/2000 | CN1267903A Uniformity for improving chemical-mechanically polishing |
| 09/26/2000 | US6124207 Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries |
| 09/26/2000 | US6123609 Polishing machine with improved polishing pad structure |
| 09/26/2000 | US6123608 Crown forming apparatus for forming crown floating type magnetic head |
| 09/26/2000 | US6123607 Method and apparatus for improved conditioning of polishing pads |
| 09/26/2000 | US6123602 Portable slurry distribution system |
| 09/21/2000 | WO2000054935A1 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 09/21/2000 | WO2000054934A1 The endpoint of a chemical-mechanical polishing operation |
| 09/21/2000 | WO2000054933A2 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 09/20/2000 | EP1036631A1 Apparatus and method for polishing a semiconductor wafer |
| 09/20/2000 | EP1035945A1 Manufacturing a memory disk or semiconductor device using an abrasive polishing system, and polishing pad |
| 09/19/2000 | US6121217 Removal of process residue from substrate of titanium (metal, alloy, or compound) with aqueous solution of alkanolamine, gallic acid or catechol chelating agent, hydroxylamine |
| 09/19/2000 | US6121147 Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance |
| 09/19/2000 | US6121144 Low temperature chemical mechanical polishing of dielectric materials |
| 09/19/2000 | US6121143 Abrasive articles comprising a fluorochemical agent for wafer surface modification |
| 09/19/2000 | US6121142 Magnetic frictionless gimbal for a polishing apparatus |
| 09/19/2000 | US6120366 Chemical-mechanical polishing pad |
| 09/19/2000 | US6120354 Method of chemical mechanical polishing |
| 09/19/2000 | US6120353 Polishing method for semiconductor wafer and polishing pad used therein |
| 09/19/2000 | US6120352 Lapping apparatus and lapping method using abrasive sheets |
| 09/19/2000 | US6120350 Process for reconditioning polishing pads |
| 09/19/2000 | US6120349 Polishing system |
| 09/19/2000 | US6120348 Polishing system |
| 09/19/2000 | US6120347 System for real-time control of semiconductor wafer polishing |
| 09/19/2000 | US6119295 Brush assembly apparatus |
| 09/14/2000 | WO2000054325A1 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects |
| 09/14/2000 | WO2000053371A1 Secondary dual purpose station for workpiece polishing machine |
| 09/14/2000 | WO2000053370A2 Method and apparatus for non-abrasive conditioning of polishing pads |
| 09/14/2000 | WO2000021714A9 A carrier head with a flexible membrane for chemical mechanical polishing |
| 09/14/2000 | WO2000020167A9 Method and apparatus for automatically polishing magnetic disks and other substrates |
| 09/13/2000 | EP1034888A2 Wafer holding head and wafer polishing apparatus, and method for manufacturing wafers |
| 09/13/2000 | EP1034887A2 Polishing apparatus |
| 09/13/2000 | EP1034885A2 Polishing apparatus including attitude controller for turntable and/or wafer carrier |
| 09/12/2000 | US6117780 Chemical mechanical polishing method with in-line thickness detection |
| 09/12/2000 | US6117779 Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint |
| 09/12/2000 | US6117777 Chemical mechanical polish (CMP) endpoint detection by colorimetry |
| 09/12/2000 | US6117776 Wafer holder and method of producing a semiconductor wafer |
| 09/12/2000 | US6117775 Polishing method |
| 09/12/2000 | US6117000 Polishing pad for a semiconductor substrate |
| 09/12/2000 | US6116997 Single side work polishing apparatus |
| 09/12/2000 | US6116994 Polishing apparatus |
| 09/12/2000 | US6116992 Substrate retaining ring |
| 09/12/2000 | US6116991 Installation for improving chemical-mechanical polishing operation |
| 09/12/2000 | US6116990 Adjustable low profile gimbal system for chemical mechanical polishing |
| 09/12/2000 | US6116988 Method of processing a wafer utilizing a processing slurry |
| 09/12/2000 | US6116986 Drainage structure in polishing plant and method of polishing using structure |
| 09/08/2000 | WO2000051783A1 Method for conditioning a pad used for polishing a for copper-based semiconductor wafer |
| 09/08/2000 | WO2000051782A1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system |
| 09/07/2000 | DE10004595A1 Waferpoliervorrichtung und Waferherstellungsverfahren Wafer polishing apparatus and wafer manufacturing technology |
| 09/06/2000 | EP1033203A2 Spherical lapping method |
| 09/06/2000 | EP1032485A1 Wafer polishing machine |
| 09/06/2000 | CN1265618A Improved polishing pads and methods relating thereto |
| 09/05/2000 | US6114706 Method and apparatus for predicting process characteristics of polyurethane pads |
| 09/05/2000 | US6114249 Chemical mechanical polishing of multiple material substrates and slurry having improved selectivity |
| 09/05/2000 | US6114248 Process to reduce localized polish stop erosion |
| 09/05/2000 | US6114247 Polishing cloth for use in a CMP process and a surface treatment thereof |
| 09/05/2000 | US6113490 Work unloading method and surface polishing apparatus with work unloading mechanism |
| 09/05/2000 | US6113489 Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus |
| 09/05/2000 | US6113478 Polishing apparatus with improved alignment of polishing plates |
| 09/05/2000 | US6113468 Wafer planarization carrier having floating pad load ring |
| 09/05/2000 | US6113467 Polishing machine and polishing method |
| 09/05/2000 | US6113465 Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context |
| 08/31/2000 | WO2000050223A1 Microelectronic workpiece support and apparatus using the support |
| 08/31/2000 | DE19905737A1 New double-sided polished semiconductor wafer has extremely low front face site front surface-referenced least squares ratio planarity values varying insignificantly between the wafer edge and central regions |
| 08/30/2000 | EP1031398A2 Polishing media stabilizer |
| 08/30/2000 | EP1031166A1 Method and apparatus for chemical mechanical polishing |
| 08/30/2000 | CN1265131A Polishing agent for semiconductor substrates |
| 08/30/2000 | CN1264636A Mechanical chemical polishing method for aluminium or aluminium alloy conducting layer |
| 08/29/2000 | US6111634 Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing |
| 08/29/2000 | US6110881 That remove etching residue from substrates; nucleophilic amine compound of given formula having oxidation and reduction potentials, alkanolamine(s), water, and stabilizing chelating agent that prevents resettling of residue |
| 08/29/2000 | US6110305 Method for production of high-strength low-expansion cast iron |
| 08/29/2000 | US6110294 Apparatus and method for cleaning semiconductor wafer |
| 08/29/2000 | US6110026 Carrier and polishing apparatus |
| 08/29/2000 | US6110025 Containment ring for substrate carrier apparatus |
| 08/29/2000 | US6110024 Polishing apparatus |
| 08/29/2000 | US6110014 Method and apparatus polishing wafer for extended effective area of wafer |
| 08/29/2000 | US6110013 End-face polishing and cleaning apparatus |
| 08/29/2000 | US6110012 Chemical-mechanical polishing apparatus and method |
| 08/29/2000 | US6110008 Polishing system |
| 08/24/2000 | WO2000049111A1 A cutting and lubricating composition for use with a wire cutting apparatus |
| 08/24/2000 | WO2000048788A1 Polishing pad and process for forming same |
| 08/24/2000 | WO2000048787A1 Improved arrangements for wafer polishing |
| 08/24/2000 | CA2329216A1 A cutting and lubricating composition for use with a wire cutting apparatus |
| 08/23/2000 | EP1029907A1 Process for mechanical chemical polishing of a layer of aluminium or aluminium alloy conducting material |
| 08/23/2000 | EP1029633A1 Carrier head with controllable pressure and loading area for chemical mechanical polishing |
| 08/23/2000 | EP1029632A2 Abrasive machine |
| 08/23/2000 | EP1029600A1 Cleaning device |
| 08/23/2000 | CN1263923A 抛光组合物 The polishing composition |
| 08/22/2000 | US6108092 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
| 08/22/2000 | US6108091 Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
| 08/22/2000 | US6107203 Chemical mechanical polishing system and method therefor |
| 08/22/2000 | US6106754 The use of sintered thermoplastic particles to enhance polishing performance. |
| 08/22/2000 | US6106728 Slurry recycling system and method for CMP apparatus |
| 08/22/2000 | US6106662 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 08/22/2000 | US6106661 Polishing pad having a wear level indicator and system using the same |
| 08/22/2000 | US6106379 Semiconductor wafer carrier with automatic ring extension |
| 08/22/2000 | US6106378 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 08/22/2000 | US6106375 Apparatus for processing waste liquid and waste gas in polishing device |