Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2000
11/08/2000EP1050369A2 Method and apparatus for polishing workpieces
11/08/2000CN1272519A Composite for mechanochemical polishing polymer insulating material layer with low dielectric constant
11/07/2000US6143127 Carrier head with a retaining ring for a chemical mechanical polishing system
11/07/2000US6143123 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
11/07/2000US6142859 Polishing apparatus
11/07/2000US6142857 Wafer polishing with improved backing arrangement
11/07/2000US6142855 Polishing apparatus and polishing method
11/07/2000US6142853 Method and apparatus for holding laser wafers during a fabrication process to minimize breakage
11/02/2000WO2000064822A1 Apparatus and process for separation and recovery of liquid and slurry abrasives used for polishing
11/02/2000EP1049146A2 Method and apparatus for forming an inlaid capacitor in a semiconductor wafer
11/02/2000EP1048409A1 Planetary gear system parallel planer
11/02/2000EP1048408A2 Carrier head with a compressible film
11/02/2000EP1048406A2 A carrier head for chemical mechanical polishing a substrate
11/02/2000EP1048404A2 Method and apparatus for optical polishing
11/02/2000EP1048063A1 Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
11/02/2000EP1011919A4 Improved polishing pads and methods relating thereto
11/02/2000EP0808231B1 Chemical-mechanical polishing using curved carriers
11/02/2000DE10020347A1 Grinding apparatus for shaping spherical objects e.g. of semiconductor material conveys objects in holes on endless belt past grinding belt
11/01/2000CN1272221A Polishing composition including inhibitor of tungsten etching
10/2000
10/31/2000US6140287 Cleaning compositions for removing etching residue and method of using
10/31/2000US6139953 Adhesive tape, base material for adhesive tape and their manufacturing methods
10/31/2000US6139680 Exhaust line of chemical-mechanical polisher
10/31/2000US6139428 Conditioning ring for use in a chemical mechanical polishing machine
10/31/2000US6139409 Wafer polishing apparatus and backing pad for wafer polishing
10/31/2000US6139408 Surface grinding machine and carrier used therefor
10/31/2000US6139406 Combined slurry dispenser and rinse arm and method of operation
10/31/2000US6139404 Apparatus and a method for conditioning a semiconductor wafer polishing pad
10/31/2000US6139402 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
10/31/2000US6139400 Polishing system and method with polishing pad pressure adjustment
10/26/2000WO2000063963A1 Non-abrasive conditioning for polishing pads
10/26/2000WO2000062977A1 Method of conditioning wafer polishing pads
10/26/2000DE19913365A1 Vorrichtung und Verfahren zur Detektion eines Werkstückes in einer automatischen Bearbeitungsvorrichtung Apparatus and method for detecting a workpiece in an automatic processing apparatus
10/25/2000EP1046690A1 Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant
10/25/2000EP1046466A2 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
10/25/2000EP1046464A1 Substrate carrier
10/25/2000EP1046462A2 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same.
10/25/2000EP1045741A1 A carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
10/25/2000EP1045740A1 A carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
10/24/2000US6136715 Circumferentially oscillating carousel apparatus for sequentially polishing substrates
10/24/2000US6136711 Polishing composition including an inhibitor of tungsten etching
10/24/2000US6136710 Chemical mechanical polishing apparatus with improved substrate carrier head and method of use
10/24/2000US6136138 Method and apparatus for chemical mechanical polishing of a semiconductor wafer
10/24/2000US6136043 Forming an elastomeric material into a polishing pad having a planar surface; and dyeing pad with at least one dye to color the elastomeric material with a color that extends from the planar surface to a pad depth; use in determining wear life
10/24/2000US6135868 Groove cleaning device for chemical-mechanical polishing
10/24/2000US6135865 CMP apparatus with built-in slurry distribution and removal
10/24/2000US6135864 Solid phase water scrub for defect removal
10/24/2000US6135863 Method of conditioning wafer polishing pads
10/24/2000US6135860 Fixture for mechanical grinding and inspection of failed or defective semiconductor devices
10/24/2000US6135859 Chemical mechanical polishing with a polishing sheet and a support sheet
10/24/2000US6135858 Substrate holding device and polishing method and polishing apparatus using the same
10/24/2000US6135856 Apparatus and method for semiconductor planarization
10/24/2000US6135855 Translation mechanism for a chemical mechanical planarization system and method therefor
10/24/2000US6135854 Automatic workpiece transport apparatus for double-side polishing machine
10/19/2000WO2000060917A2 Bi-modal abrasive slurries for planarization
10/19/2000WO2000025980A9 Method and apparatus for grinding wafer
10/18/2000EP1044765A2 Double side polishing device
10/17/2000US6132298 Carrier head with edge control for chemical mechanical polishing
10/17/2000US6132294 Method of enhancing semiconductor wafer release
10/17/2000US6132292 Chemical mechanical polishing method suitable for highly accurate planarization
10/17/2000US6132290 Automatic lapping method of a thin film element and a lapping apparatus using the same
10/17/2000US6132289 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
10/17/2000US6132078 Slurry providing system
10/17/2000US6131589 Accurate positioning of a wafer
10/12/2000WO2000060650A1 Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
10/12/2000WO2000059682A1 Method and apparatus for plating and polishing a semiconductor substrate
10/12/2000WO2000059681A1 Cmp pad conditioner arrangement and method therefor
10/12/2000WO2000059680A1 Polishing body, polisher, polishing method, and method for producing semiconductor device
10/12/2000WO2000059644A1 Modular controlled platen preparation system and method
10/12/2000WO2000028586A3 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
10/12/2000WO2000026443A3 Method and apparatus for electrochemical mechanical deposition
10/12/2000DE10007390A1 Dual disc polishing apparatus for semiconductor wafer, has support base which is connected with drive shaft and support disc, so that inclination of upper and lower grinding discs are equal
10/11/2000EP1043379A1 Abrasive, method of polishing wafer, and method of producing semiconductor device
10/11/2000EP1043123A2 Buffer station on CMP system
10/11/2000EP1043122A2 Apparatus and method for continuous delivery and conditioning of a polishing slurry
10/11/2000EP1042105A1 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
10/10/2000US6130163 Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by adjustment of PH of deionized water
10/10/2000US6129613 Semiconductor manufacturing apparatus and method for measuring in-situ pressure across a wafer
10/10/2000US6129610 Polish pressure modulation in CMP to preferentially polish raised features
10/05/2000WO2000058716A1 Optical endpoint detection system for rotational chemical mechanical polishing
10/05/2000WO2000058055A1 Method and apparatus for pad removal and replacement
10/05/2000WO2000058054A1 A method and apparatus for stabilizing the process temperature during chemical mechanical polishing
10/05/2000WO2000058053A1 Apparatus and process for reconditioning polishing pads
10/04/2000CN2399159Y Bench grinder
10/04/2000CN2399158Y Grinder for stop valve
10/04/2000CN2399157Y Suspension swinging crankshaft grinder
10/03/2000US6126848 Indirect endpoint detection by chemical reaction and chemiluminescence
10/03/2000US6126532 A polishing pad containing sintered polyurethane polishing pad substrate, a bottom surface including skin layer, a backing sheet, and an adhesive used for the grinding, lapping, shaping and polishing of semiconductor wafers
10/03/2000US6126531 Used to restores the state of agglomeration of the abrasive grains to the initial state to enable reuse of the slurry and thereby reduces the cost of polishing work and improves operating rate of mechanical chemical polishing apparatus
10/03/2000US6126530 Cleaning device for surface plate correcting dresser
10/03/2000US6126527 Seal for polishing belt center support having a single movable sealed cavity
10/03/2000US6126518 Chemical mechanical polishing process for layers of semiconductor or isolating materials
10/03/2000US6126517 System for chemical mechanical polishing having multiple polishing stations
10/03/2000US6126515 Liquid slurry containing polyhedral monocrystalline alumina
10/03/2000US6126514 Polishing slurry and polishing method using the same
10/03/2000US6126512 Robust belt tracking and control system for hostile environment
10/03/2000US6126511 Polishing device and correcting method therefor
10/03/2000US6125876 Apparatus and process for delivering an abrasive suspension for the mechanical polishing of a substrate
09/2000
09/28/2000WO2000057251A1 Device and method for detecting a workpiece in an automatic processing device
09/28/2000WO2000056502A1 Lapping machine, lapping method, and method of fabricating magnetic head
09/27/2000EP1038636A2 A carrier head for providing a polishing slurry
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