Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 37 - Lapping machines or devices; Accessories
Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
12/2000
12/21/2000WO2000077107A1 Abrasive solution and method for chemically-mechanically polishing a precious metal surface
12/21/2000WO2000076920A1 Improved ceria powder
12/21/2000WO2000076725A1 Optical view port for chemical mechanical planarization endpoint detection
12/21/2000WO2000076723A1 Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer
12/21/2000DE10029032A1 Grinding and etching system for plate-shaped objects has clamping table, grinder for grinding plate-shaped objects fixed on table, object washing device and dry etching device
12/20/2000EP1061558A2 Edge contact loadcup
12/20/2000EP1060836A2 Wafer tranfer station for a chemical mechanical polisher
12/20/2000EP1060221A1 Optical polishing formulation
12/20/2000CN1277572A Manufacturing a memory disk or semiconductor device using an abrasive polishing system, and polishing pad
12/19/2000US6162368 Technique for chemical mechanical polishing silicon
12/19/2000US6162268 Mixture; controlling particle size
12/19/2000US6162116 Carrier head for chemical mechanical polishing
12/19/2000US6162112 Chemical-mechanical polishing apparatus and method
12/14/2000WO2000074896A1 Method of modifying a surface of a structured wafer
12/14/2000CA2374004A1 Method of modifying a surface of a structured wafer
12/13/2000EP1059142A2 Carrier head to apply pressure to and retain a substrate
12/12/2000US6159088 Polishing pad, polishing apparatus and polishing method
12/12/2000US6159087 End effector for pad conditioning
12/12/2000US6159083 Polishing head for a chemical mechanical polishing apparatus
12/12/2000US6159082 Slurry circulation type surface polishing machine
12/12/2000US6159080 Chemical mechanical polishing with a small polishing pad
12/12/2000US6159079 Carrier head for chemical mechanical polishing a substrate
12/12/2000US6159077 Colloidal silica polishing abrasive
12/12/2000US6159076 A slurry for polishing a surface comprising a liquid phase, an abrasive comprising silica and a ligand of an element contained in the surface which is bonded with ion or atom of the element to form chelate compound
12/12/2000US6159075 Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process
12/12/2000US6159073 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
12/12/2000US6159071 Semiconductor wafer grinding apparatus
12/07/2000WO2000073396A1 Slurry composition and method of chemical mechanical polishing using same
12/07/2000WO2000073021A1 Method and system for cleaning a chemical mechanical polishing pad
12/07/2000WO2000073020A1 Abrasive processing apparatus and method employing encoded abrasive product
12/07/2000DE19925696A1 Removal of impurities from chemical-mechanical polishing slurry in manufacture of semiconductor materials includes using a magnetic filter to remove magnetic particles and then removing non-magnetic particles
12/06/2000EP1057853A1 Urethane molded product for polishing pad and method for making same
12/06/2000EP1057591A2 Selective damascene chemical mechanical polishing
12/06/2000EP1056816A1 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
12/06/2000EP1056549A1 A cleaning/buffing apparatus for use in a wafer processing device
12/06/2000EP1015176A4 Improved polishing pads and methods relating thereto
12/06/2000CN1059219C Polymeric substrate containing polymeric microelements and method of making and using the same
12/05/2000US6156661 Post clean treatment
12/05/2000US6156659 Linear CMP tool design with closed loop slurry distribution
12/05/2000US6156124 Wafer transfer station for a chemical mechanical polisher
12/05/2000US6155915 System and method for independent air bearing zoning for semiconductor polishing device
12/05/2000US6155913 Double polishing head
12/05/2000US6155908 Work-loading method and surface-grinding apparatus with work position deviation-adjusting mechanism
11/2000
11/30/2000WO2000071971A1 Optical techniques for measuring layer thicknesses
11/30/2000WO2000071297A1 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
11/30/2000WO2000059681B1 Cmp pad conditioner arrangement and method therefor
11/30/2000DE19960458A1 Vorrichtung zum Polieren von Scheiben An apparatus for polishing wafers
11/29/2000EP1055903A1 Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers
11/29/2000CN1274949A System for transfering polishing liquid when semiconductor wafer is chemimechanical polished
11/28/2000US6153123 For flat panel display devices such as liquid crystal displays, plasma displays, thick film and thin film electroluminescent displays and field emission displays; narrow particle size distribution, spherical morphology
11/28/2000US6153116 Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation
11/28/2000US6153043 Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing
11/28/2000US6152813 Dresser and dressing apparatus
11/28/2000US6152808 Microelectronic substrate polishing systems, semiconductor wafer polishing systems, methods of polishing microelectronic substrates, and methods of polishing wafers
11/28/2000US6152806 Concentric platens
11/28/2000US6152805 Polishing machine
11/23/2000WO2000069597A1 Method and device for polishing double sides
11/23/2000WO2000030807A3 A carrier head with edge control for chemical mechanical polishing
11/22/2000EP1053830A2 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
11/22/2000EP1053076A1 Polishing apparatus and polishing table therefor
11/22/2000CN1274171A Correction for metal inlaid wiring form
11/21/2000US6150271 Differential temperature control in chemical mechanical polishing processes
11/21/2000US6149830 Composition and method for reducing dishing in patterned metal during CMP process
11/21/2000US6149696 Abrasive blasting with colloidal silica
11/21/2000US6149512 Linear pad conditioning apparatus
11/21/2000US6149508 Chemical mechanical planarization system
11/21/2000US6149507 Wafer polishing apparatus having measurement device and polishing method
11/21/2000US6149506 Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
11/21/2000US6149505 Cavitational polishing pad conditioner
11/21/2000US6149500 Precision polishing method using hermetically sealed chambers
11/21/2000US6149499 Polishing apparatus and polishing method
11/21/2000US6149078 Slurry nozzle
11/16/2000WO2000067951A1 Optical endpoint detection during chemical mechanical planarization
11/16/2000WO2000067950A1 Method and device for simultaneously grinding double surfaces, and method and device for simultaneously lapping double surfaces
11/16/2000WO2000067948A1 Method of and device for machining flat parts
11/16/2000DE19949976C1 In-situ end-point detection process, for chemical-mechanical polishing of semiconductor wafer layers, uses an ion-selective electrode to monitor ion concentration changes in a polishing slurry and reagent solution mixture
11/15/2000EP1052064A2 Chemical mechanical polishing with friction-based control
11/15/2000EP1052063A1 System for chemical mechanical planarization
11/15/2000EP1052062A1 Pré-conditioning fixed abrasive articles
11/15/2000EP1052061A2 System for chemical mechanical planarization
11/15/2000EP1052060A2 Method for chemical mechanical planarization
11/15/2000EP1052059A2 Method for chemical mechanical planarization
11/15/2000EP0868258A4 Substrate belt polisher
11/14/2000US6147764 Optical interference profiler having shadow compensation
11/14/2000US6146260 Polishing machine
11/14/2000US6146259 Carrier head with local pressure control for a chemical mechanical polishing apparatus
11/14/2000US6146256 Clamping wafer holder for chemical-mechanical planarization machines and method for using it
11/14/2000US6146251 Polishing method, method of manufacturing an optical device, and a liquid suspension used for polishing
11/14/2000US6146250 Process for forming a semiconductor device
11/14/2000US6146249 Apparatus and method for polishing a flat surface using a belted polishing pad
11/14/2000US6146248 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
11/14/2000US6146246 Method for supplying flush fluid
11/14/2000US6146245 Method of and device for machining flat parts
11/14/2000US6146244 Substrate produced by using alumina particles as an abrasive
11/14/2000US6146242 Optical view port for chemical mechanical planarization endpoint detection
11/14/2000US6146241 Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation
11/09/2000WO2000035627A3 Multi-step chemical mechanical polishing
11/09/2000DE19919108A1 Suspension abrasive agent feeder for polishing workpieces
11/08/2000EP1050568A1 Polishing slurry
11/08/2000EP1050374A2 Apparatus for polishing a substrate and a rotatable platen assembly therefor
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