| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/06/2001 | US6183351 Method of supplying a chemical mechanical polishing liquid and apparatus therefor |
| 02/06/2001 | US6183350 Chemical-mechanical polish machines and fabrication process using the same |
| 02/06/2001 | US6183345 Polishing apparatus and method |
| 02/06/2001 | US6183341 Slurry pump control system |
| 02/01/2001 | WO2001007208A1 Cmp polishing head with three chambers and method for using the same |
| 01/31/2001 | EP1072666A2 Colloidal polishing of fused silica |
| 01/31/2001 | EP1072665A2 Colloidal silica polishing abrasive |
| 01/31/2001 | EP1072359A2 Semiconductor wafer polishing apparatus |
| 01/31/2001 | CN1282362A Abrasive, method of polishing wafer, and method of producing semiconductor device |
| 01/31/2001 | CN1282103A Technological process for making different gate medium thicknesses by using polysilicon mask and chemical mechanical process |
| 01/30/2001 | US6181165 Reduced voltage input/reduced voltage output tri-state buffers |
| 01/30/2001 | US6180527 Method and apparatus for thinning article, and article |
| 01/30/2001 | US6180525 Method of minimizing repetitive chemical-mechanical polishing scratch marks and of processing a semiconductor wafer outer surface |
| 01/30/2001 | US6180423 Method for wafer polishing and method for polishing pad dressing |
| 01/30/2001 | US6180422 Endpoint detection by chemical reaction |
| 01/30/2001 | US6180029 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 01/30/2001 | US6180020 Polishing method and apparatus |
| 01/30/2001 | US6179956 Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
| 01/30/2001 | US6179950 Polishing pad and process for forming same |
| 01/30/2001 | US6179709 In-situ monitoring of linear substrate polishing operations |
| 01/30/2001 | US6179699 Shape memory alloy-controlled slurry dispense system for CMP processing |
| 01/30/2001 | US6179695 Chemical mechanical polishing apparatus and method |
| 01/30/2001 | US6179694 Extended guide rings with built-in slurry supply line |
| 01/30/2001 | US6179693 In-situ/self-propelled polishing pad conditioner and cleaner |
| 01/30/2001 | US6179691 Method for endpoint detection for copper CMP |
| 01/30/2001 | US6179690 Substrate polishing apparatus |
| 01/30/2001 | US6179689 Spherical mirror surface processing method and device |
| 01/30/2001 | US6179688 Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation |
| 01/25/2001 | WO2001006553A1 Polishing mixture and process for reducing the incorporation of copper into silicon wafers |
| 01/25/2001 | WO2001005555A1 Methods and apparatuses for planarizing microelectronic substrate assemblies |
| 01/25/2001 | WO2000054933A3 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 01/25/2001 | DE19932829A1 Two step chemical mechanical polishing method for e.g. semiconductor wafer, involves providing two different slurries containing different lapping powder in two step polishing |
| 01/25/2001 | DE19929929A1 Chemical-mechanical polishing of semiconductor wafers involves applying pulsed acoustic oscillations to emery powder emulsion container and second of three pipelines |
| 01/24/2001 | EP1071121A1 Process for the formation of a collar oxide in a trench in a semiconductor substrate |
| 01/24/2001 | EP1069972A1 Apparatus and methods for slurry removal in chemical mechanical polishing |
| 01/24/2001 | CN2416282Y Telescopic pulley improved structure |
| 01/23/2001 | US6177026 CMP slurry containing a solid catalyst |
| 01/23/2001 | US6176992 Method and apparatus for electro-chemical mechanical deposition |
| 01/23/2001 | US6176765 Accumulator for slurry sampling |
| 01/23/2001 | US6176764 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks |
| 01/23/2001 | US6176763 Method and apparatus for uniformly planarizing a microelectronic substrate |
| 01/18/2001 | WO2001004226A2 Cmp composition containing silane modified abrasive particles |
| 01/18/2001 | WO2001003886A1 Method and apparatus for eliminating wear and grooving of workpiece carrier retaining element |
| 01/18/2001 | DE19927286A1 Schleiflösung und Verfahren zum chemisch-mechanischen Polieren einer Edelmetall-Oberfläche Grinding solution and method for chemical mechanical polishing a noble metal surface |
| 01/18/2001 | CA2378492A1 Cmp composition containing silane modified abrasive particles |
| 01/17/2001 | EP1068928A2 Chemical mechanical polishing processes and components |
| 01/17/2001 | EP1068373A1 Automated chemical process control system |
| 01/17/2001 | EP1068047A1 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit |
| 01/17/2001 | CN1280049A Conducting real time control to chemical mechanical polishing process of measuring shaft deformation |
| 01/16/2001 | US6174227 A polishing pad with a surface having vickers hardness of 2.5 to 40, comprising an epoxy resin selected from bisphenol a or bisphenol f epoxy resin, novolac epoxy resin, denatured epoxy resin, aromatic anhydride or amine or imidazole curing agent |
| 01/16/2001 | US6174221 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks |
| 01/11/2001 | WO2001002136A1 A polishing pad having a water-repellant film thereon and a method for manufacturing the same |
| 01/11/2001 | WO2001002135A1 Apparatus and method for the restoration of optical storage media |
| 01/11/2001 | WO2001002134A1 Improved chemical mechanical polishing slurries for metal |
| 01/11/2001 | WO2000060917A3 Bi-modal abrasive slurries for planarization |
| 01/11/2001 | DE10032425A1 Wafer suction pad is mounted on transport arm of transport device, holds wafer by suction on pad body with suction surface with number of annular apertures in concentric arrangement |
| 01/11/2001 | CA2375728A1 Apparatus and method for the restoration of optical storage media |
| 01/10/2001 | EP1066928A2 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| 01/10/2001 | EP1066926A1 Method of polishing at least one face of a silicium based workpiece |
| 01/10/2001 | EP1066925A2 Closed loop control of wafer polishing in a chemical mechanical polishing system |
| 01/10/2001 | EP1066924A2 Carrier head with a flexible membrane and an edge load ring |
| 01/10/2001 | EP1066923A2 Carrier head with a modified flexible membrane |
| 01/10/2001 | EP1066922A2 Carrier head with pressurizable bladder |
| 01/10/2001 | CN1279506A Flat grinding device |
| 01/09/2001 | US6172756 Rapid and accurate end point detection in a noisy environment |
| 01/09/2001 | US6171513 Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier |
| 01/09/2001 | US6171467 Silicon wafers in electrolytic baths, applying voltage and planarizing |
| 01/09/2001 | US6171436 Apparatus for removing slurry particles |
| 01/09/2001 | US6171352 Comprising 70-95% by weight aqueous medium, 1-25% by weight abrasive, 0.1-20% by weight abrasion accelerator, wherein abrasion accelerator comprises monocarboxy group- or an amido group-containing compound |
| 01/09/2001 | US6171181 Molded polishing pad having integral window |
| 01/09/2001 | US6171175 Method of polishing uniform or free-form metal surfaces |
| 01/09/2001 | US6171174 System and method for controlling a multi-arm polishing tool |
| 01/04/2001 | WO2001000907A1 Polishing of fluoride crystal optical lenses and preforms using cerium oxide for microlithography |
| 01/04/2001 | DE19928949A1 Production of a semiconductor wafer used as the base material for a semiconductor component comprises removing the semiconductor from a single crystal, processing by ductile chip removal, and polishing and cleaning the surface |
| 01/03/2001 | EP1065251A1 Polishing composition |
| 01/03/2001 | EP1065030A2 Determining when to replace a retaining ring used in substrate polishing operations |
| 01/02/2001 | US6169931 Method and system for modeling, predicting and optimizing chemical mechanical polishing pad wear and extending pad life |
| 01/02/2001 | US6168684 Wafer polishing apparatus and polishing method |
| 01/02/2001 | US6168683 Apparatus and method for the face-up surface treatment of wafers |
| 01/02/2001 | US6168508 Polishing pad surface for improved process control |
| 01/02/2001 | US6168506 Apparatus for polishing using improved plate supports |
| 01/02/2001 | US6168504 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks |
| 01/02/2001 | US6168502 Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus |
| 01/02/2001 | US6168501 Grinding method of microelectronic device |
| 01/02/2001 | US6168499 Grinding apparatus for semiconductor wafers |
| 12/28/2000 | WO2000079577A1 Abrasive compound for cmp, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive compound |
| 12/28/2000 | WO2000078504A1 Method and apparatus for increasing the lifetime of a workpiece retaining structure and conditioning a polishing surface |
| 12/28/2000 | DE10012420A1 Wafer polishing head for polishing semiconductor wafers relying upon a chemical-mechanical polishing (CMP) method, has wafer carrier being moved relative to retainer ring and to body portion |
| 12/28/2000 | DE10009656A1 Production of a semiconductor wafer sucking a test wafer with known topology with its reverse side against the film of the support and measuring a front side of the test wafer topologically |
| 12/27/2000 | EP1063055A2 Apparatus and method for chemical mechanical polishing |
| 12/27/2000 | CN1278201A Abrasive articles comprising fluorochemical agent for wafer surface modification |
| 12/26/2000 | US6166885 Magnetic recording medium and method for producing the same |
| 12/26/2000 | US6165904 Polishing pad for use in the chemical/mechanical polishing of a semiconductor substrate and method of polishing the substrate using the pad |
| 12/26/2000 | US6165247 Methods for producing platinum powders |
| 12/26/2000 | US6165058 Carrier head for chemical mechanical polishing |
| 12/26/2000 | US6165057 Apparatus for localized planarization of semiconductor wafer surface |
| 12/26/2000 | US6165056 Polishing machine for flattening substrate surface |
| 12/26/2000 | US6165052 Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation |
| 12/26/2000 | US6165050 Method of manufacturing semiconductor device using precision polishing apparatus with detecting means |
| 12/26/2000 | US6165048 Chemical-mechanical-polishing system with continuous filtration |