| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 03/20/2001 | US6203408 Variable pressure plate CMP carrier |
| 03/20/2001 | US6203407 Method and apparatus for increasing-chemical-polishing selectivity |
| 03/20/2001 | US6203404 Chemical mechanical polishing methods |
| 03/15/2001 | WO2001017725A1 Polishing pad |
| 03/15/2001 | DE19941903A1 Semiconductor wafers polishing method e.g. for manufacture of microelectronic devices, allows individual treatment of wafers by independent adjustment of pressure of polishing chambers |
| 03/14/2001 | EP1083249A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
| 03/14/2001 | CN1287469A Electro-deposition copper foil through surface processing and its producing method and use |
| 03/14/2001 | CN1287042A Translating revoluting grinding head |
| 03/14/2001 | CN1287041A Double-translating grinding mechanism with revoluting grinding head |
| 03/13/2001 | US6201253 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system |
| 03/13/2001 | US6200834 Process for fabricating two different gate dielectric thicknesses using a polysilicon mask and chemical mechanical polishing (CMP) planarization |
| 03/13/2001 | US6200414 Circulation system for supplying chemical for manufacturing semiconductor devices and circulating method thereof |
| 03/13/2001 | US6200205 Lapping tool |
| 03/13/2001 | US6200202 System and method for supplying slurry to a semiconductor processing machine |
| 03/13/2001 | US6200201 Cleaning/buffer apparatus for use in a wafer processing device |
| 03/13/2001 | US6200196 Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes |
| 03/08/2001 | WO2001015867A1 Unsupported polishing belt for chemical mechanical polishing |
| 03/08/2001 | WO2001015865A1 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 03/08/2001 | WO2001015864A1 Stacked polishing pad having sealed edge |
| 03/08/2001 | WO2001015863A1 Windowless belt and method for in-situ wafer monitoring |
| 03/08/2001 | WO2001015862A1 Spindle assembly for force controlled polishing |
| 03/08/2001 | WO2001015861A1 Polishing pad and polisher |
| 03/08/2001 | WO2001015860A1 Method and device for polishing semiconductor wafer |
| 03/08/2001 | WO2001015856A1 Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
| 03/08/2001 | WO2001015855A1 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
| 03/08/2001 | DE19939258A1 Werkzeug und Verfahren zum abrasiven Bearbeiten einer im wesentlichen ebenen Fläche A method for abrasive machining tool and a substantially flat surface |
| 03/07/2001 | EP1081200A1 Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devices |
| 03/07/2001 | EP1080842A1 Method and apparatus for grinding wafer |
| 03/07/2001 | EP1080841A2 Carrier head, polishing apparatus using the carrier head, and method for sensing polished surface state |
| 03/07/2001 | EP1080797A2 Method and apparatus for cleaning workpiece |
| 03/07/2001 | CN1286158A Abrasive tool having metal bound phase |
| 03/06/2001 | US6197692 Semiconductor wafer planarizing device and method for planarizing a surface of semiconductor wafer by polishing it |
| 03/06/2001 | US6197218 Phosphor spherical particles of yttrium-gadolinium borate, zinc silicate, barium magnesium aluminate and barium aluminate in a liquid vehicle to be applied to a substrate; flat panel displays, e.g. plasma type; fluorescent lighting elements |
| 03/06/2001 | US6196907 Slurry delivery system for a metal polisher |
| 03/06/2001 | US6196906 Surface polishing apparatus and method of taking out workpiece |
| 03/06/2001 | US6196905 Wafer polishing apparatus with retainer ring |
| 03/06/2001 | US6196904 Polishing apparatus |
| 03/06/2001 | US6196903 Workpiece carrier and polishing apparatus having workpiece carrier |
| 03/06/2001 | US6196901 Method of double-side lapping a wafer and an apparatus therefor |
| 03/06/2001 | US6196899 Polishing apparatus |
| 03/06/2001 | US6196897 Automatic lapping method and a lapping apparatus using the same |
| 03/01/2001 | WO2001014496A1 Compositions for insulator and metal cmp and methods relating thereto |
| 03/01/2001 | WO2000054933B1 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 02/28/2001 | EP1077790A1 A carrier head with a retaining ring for a chemical mechanical polishing system |
| 02/28/2001 | EP1077789A1 Substrate retainer |
| 02/28/2001 | EP0909311A4 Post clean treatment |
| 02/28/2001 | CN1285384A Process for preparation of metal oxide slurry adaptable to chemical-mechanical polishing of semiconductor |
| 02/27/2001 | US6194231 Method for monitoring polishing pad used in chemical-mechanical planarization process |
| 02/27/2001 | US6194230 Endpoint detection by chemical reaction and light scattering |
| 02/27/2001 | US6193908 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 02/27/2001 | US6193588 Method and apparatus for planarizing and cleaning microelectronic substrates |
| 02/27/2001 | US6193587 Apparatus and method for cleansing a polishing pad |
| 02/27/2001 | US6193586 Method and apparatus for grinding wafers using a grind chuck having high elastic modulus |
| 02/27/2001 | US6193585 Method of polishing a hard material-coated wafer |
| 02/27/2001 | US6193584 Apparatus and method of device stripe height control |
| 02/22/2001 | WO2001013416A1 Method and apparatus for depositing and controlling the texture of a thin film |
| 02/22/2001 | WO2001012741A1 Polishing system with stopping compound and method of its use |
| 02/22/2001 | WO2001012740A1 Polishing system and method of its use |
| 02/22/2001 | WO2001012739A1 Chemical mechanical polishing systems and methods for their use |
| 02/22/2001 | WO2001012387A1 Molded polishing pad having integral window |
| 02/22/2001 | WO2001012385A1 Workpiece carrier with segmented and floating retaining elements |
| 02/22/2001 | DE19937784A1 Zweischeiben-Feinschleifmaschine Two slices of fine grinding |
| 02/22/2001 | CA2378793A1 Polishing system with stopping compound and method of its use |
| 02/22/2001 | CA2378790A1 Polishing system and method of its use |
| 02/22/2001 | CA2378771A1 Chemical mechanical polishing systems and methods for their use |
| 02/21/2001 | EP1077241A2 Composition for use in a chemical-mechanical planarization process |
| 02/21/2001 | EP1077111A1 Method and tool for abrasive machining of a substantially flat surface |
| 02/21/2001 | EP1076681A1 A cutting and lubricating composition for use with a wire cutting apparatus |
| 02/21/2001 | CN2420099Y 多头气门研磨机 Long valve grinding machine |
| 02/20/2001 | US6191864 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
| 02/20/2001 | US6191038 Apparatus and method for chemical/mechanical polishing |
| 02/20/2001 | US6191037 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 02/20/2001 | US6190746 Polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine |
| 02/20/2001 | US6190494 Method and apparatus for electrically endpointing a chemical-mechanical planarization process |
| 02/20/2001 | US6190443 Polishing composition |
| 02/20/2001 | US6190236 Method and system for vacuum removal of chemical mechanical polishing by-products |
| 02/20/2001 | US6190234 Endpoint detection with light beams of different wavelengths |
| 02/20/2001 | US6189816 Method for producing a valve-seat body for a fuel injection valve, and corresponding fuel injection valve |
| 02/20/2001 | US6189680 Rotary conveyor |
| 02/15/2001 | WO2001010599A1 Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing |
| 02/15/2001 | WO2001010595A1 Method for manufacturing a magnetic disk comprising a glass substrate |
| 02/15/2001 | WO2000044527A3 High quality optically polished aluminum mirror and process for producing |
| 02/15/2001 | DE19938340C1 Production of semiconductor wafer comprises simultaneously polishing the front and rear sides of wafer between rotating polishing plates using an alkaline polishing sol and then an alcohol, cleaning, drying and applying an epitaxial layer |
| 02/14/2001 | EP1075897A1 Lapping machine with two plates |
| 02/14/2001 | EP1075675A1 Conductivity feedback control system for slurry blending |
| 02/14/2001 | EP1075351A1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system |
| 02/13/2001 | US6187730 Hydroxylamine-gallic compound composition and process |
| 02/13/2001 | US6187681 Method and apparatus for planarization of a substrate |
| 02/13/2001 | US6186880 Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
| 02/13/2001 | US6186872 Polisher |
| 02/13/2001 | US6186870 Variable abrasive polishing pad for mechanical and chemical-mechanical planarization |
| 02/13/2001 | US6186865 Apparatus and method for performing end point detection on a linear planarization tool |
| 02/07/2001 | EP1074343A1 Polishing method and apparatus |
| 02/07/2001 | EP1073877A1 Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection |
| 02/07/2001 | EP1073542A1 Chemical mechanical polishing with multiple polishing pads |
| 02/07/2001 | EP0975731A4 Ethylenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
| 02/06/2001 | US6184571 Method and apparatus for endpointing planarization of a microelectronic substrate |
| 02/06/2001 | US6184139 Oscillating orbital polisher and method |
| 02/06/2001 | US6183354 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 02/06/2001 | US6183352 Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique |