| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/24/2001 | US6220930 Wafer polishing head |
| 04/19/2001 | WO2001027990A1 A method and system for polishing semiconductor wafers |
| 04/19/2001 | WO2001027350A1 Optimal offset, pad size and pad shape for cmp buffing and polishing |
| 04/19/2001 | WO2000025984A9 Chemical mechanical polishing a substrate having a filler layer and a stop layer |
| 04/18/2001 | EP1092505A2 Method of controlling a polishing machine |
| 04/18/2001 | EP1092504A1 Apparatus and method for polishing workpiece |
| 04/18/2001 | EP1091831A1 Improved polishing pad with reduced moisture absorption |
| 04/18/2001 | EP1091829A2 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 04/18/2001 | EP1084001A4 Accurate positioning of a wafer |
| 04/18/2001 | CN1291630A Polishing composition used for manufacturing storage hard disk and polishing method |
| 04/17/2001 | US6218306 Method of chemical mechanical polishing a metal layer |
| 04/17/2001 | US6217434 Polishing pads and methods relating thereto |
| 04/17/2001 | US6217430 Pad conditioner cleaning apparatus |
| 04/17/2001 | US6217429 Polishing pad conditioner |
| 04/17/2001 | US6217427 Mobius strip belt for linear CMP tools |
| 04/17/2001 | US6217426 CMP polishing pad |
| 04/17/2001 | US6217425 Apparatus and method for lapping magnetic heads |
| 04/17/2001 | US6217422 Light energy cleaning of polishing pads |
| 04/17/2001 | US6217419 Chemical-mechanical polisher |
| 04/17/2001 | US6217418 Polishing pad and method for polishing porous materials |
| 04/17/2001 | US6217417 Method for polishing thin plate and plate for holding thin plate |
| 04/17/2001 | US6217412 Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad |
| 04/17/2001 | US6217411 Polishing apparatus |
| 04/17/2001 | US6217410 Apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing |
| 04/12/2001 | WO2001025505A1 Cemented carbide wear part and lapping method |
| 04/12/2001 | WO2001025366A1 Cmp products |
| 04/12/2001 | WO2001024969A2 Fluid dispensing fixed abrasive polishing pad |
| 04/12/2001 | WO2000053370A3 Method and apparatus for non-abrasive conditioning of polishing pads |
| 04/12/2001 | CA2383656A1 Cemented carbide wear part and lapping method |
| 04/11/2001 | EP1090334A1 System and method for controlling a multi-arm polishing tool |
| 04/11/2001 | EP1090082A1 Cmp slurry containing a solid catalyst |
| 04/11/2001 | EP1089851A1 Wafer edge polishing method and apparatus |
| 04/11/2001 | EP1089801A1 Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization |
| 04/10/2001 | US6214734 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection |
| 04/10/2001 | US6214732 Chemical mechanical polishing endpoint detection by monitoring component activity in effluent slurry |
| 04/10/2001 | US6214704 Method of processing semiconductor wafers to build in back surface damage |
| 04/10/2001 | US6213858 Belts for polishing semiconductors |
| 04/10/2001 | US6213855 Self-powered carrier for polishing or planarizing wafers |
| 04/10/2001 | US6213853 Integral machine for polishing, cleaning, rinsing and drying workpieces |
| 04/10/2001 | US6213848 Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer |
| 04/10/2001 | US6213846 Real-time control of chemical-mechanical polishing processes using a shaft distortion measurement |
| 04/10/2001 | US6213845 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| 04/10/2001 | US6213844 Method for obtaining a desired film thickness using chemical mechanical polishing |
| 04/05/2001 | WO2001024241A1 Method for chemical mechanical polishing |
| 04/05/2001 | WO2001023486A1 Compositions for and methods of reducing/eliminating scratches and defects in silicon dioxide cmp process |
| 04/05/2001 | WO2001023485A1 Polishing composition and method |
| 04/05/2001 | WO2001023141A1 Polishing pad |
| 04/05/2001 | WO2001023139A1 Polishing pad treatment for surface conditioning |
| 04/05/2001 | WO2001023138A1 Wafer grinder |
| 04/05/2001 | WO2001023135A2 Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
| 04/05/2001 | US20010000166 Apparatus and method for feeding slurry |
| 04/05/2001 | DE19945335A1 Al¶2¶O¶3¶/SiC-Nanokomposit-Schleifkörner, Verfahren zu ihrer Herstellung sowie ihre Verwendung Al¶2¶O¶3¶ / SiC nanocomposite abrasive grains, processes for their preparation and their use |
| 04/04/2001 | EP1088869A1 Aqueous dispersion for chemical mechanical polishing |
| 04/04/2001 | EP1088622A2 Platen with web release apparatus |
| 04/04/2001 | CN2425898Y Circulation rotary bucket for working bearing race |
| 04/04/2001 | CN2425897Y Reciprocative feeding bucket for working bearing race |
| 04/04/2001 | CN1290289A Optical polishing formulation |
| 04/04/2001 | CN1290202A Polishing carrier, surface polishing device, and surface polishing method |
| 04/04/2001 | CN1289811A Polishing compositions |
| 04/04/2001 | CN1289810A Polishing composition and method for manufacturing rigid memory disks |
| 04/04/2001 | CN1289628A Filter and using method thereof |
| 04/03/2001 | US6210604 For x-ray image intensifiers |
| 04/03/2001 | US6210525 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 04/03/2001 | US6210260 Carrier and CMP apparatus |
| 04/03/2001 | US6210257 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates |
| 04/03/2001 | US6210256 Continuous pad feeding method for chemical-mechanical polishing |
| 04/03/2001 | US6210255 Carrier head for chemical mechanical polishing a substrate |
| 04/03/2001 | US6210254 Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern(s) |
| 03/29/2001 | WO2001021724A1 Slurry solution for polishing copper or tungsten |
| 03/29/2001 | WO2000074896A8 Method of modifying a surface of a structured wafer |
| 03/29/2001 | WO2000034008A9 A polishing pad with a partial adhesive coating |
| 03/28/2001 | CN2424875Y Lapping mechanism of lapping machine |
| 03/28/2001 | CN1288920A 抛光组合物 The polishing composition |
| 03/27/2001 | US6208425 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers |
| 03/27/2001 | US6207572 Reverse linear chemical mechanical polisher with loadable housing |
| 03/27/2001 | US6206770 Wafer carrier head for prevention of unintentional semiconductor wafer rotation |
| 03/27/2001 | US6206769 Method and apparatus for stopping mechanical and chemical mechanical planarization of substrates at desired endpoints |
| 03/27/2001 | US6206768 Adjustable and extended guide rings |
| 03/27/2001 | US6206767 Planetary gear system parallel planer |
| 03/27/2001 | US6206765 Non-rotational dresser for grinding stones |
| 03/27/2001 | US6206760 Method and apparatus for preventing particle contamination in a polishing machine |
| 03/27/2001 | US6206759 Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines |
| 03/27/2001 | US6206758 Method for increasing working life of retaining ring in chemical-mechanical polishing machine |
| 03/27/2001 | US6206757 Polishing systems, methods of polishing substrates, and methods of preparing liquids for semiconductor fabrication processes |
| 03/27/2001 | US6206756 Using an acidic solution containing a tungsten oxidizing component, also contains a complexing agent to complex tungsten or oxidation product thereof. |
| 03/27/2001 | US6206754 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 03/27/2001 | US6205658 Method for formation of metal wiring |
| 03/22/2001 | WO2001020304A2 Self-clearing optical measurement apparatus and methods of use |
| 03/22/2001 | WO2001019935A1 Slurry for forming insoluble silicate during chemical-mechanical polishing |
| 03/22/2001 | WO2001019568A1 Drive device for a grinding, lapping or buffing-tool body |
| 03/22/2001 | WO2001019567A1 Method and system for chemical mechanical polishing with a cylindrical polishing pad |
| 03/22/2001 | DE19944551A1 Workpiece chuck for chemical-mechanical polishing of semiconductor disc has fluid film between seating and surface of semiconductor disc held in seating |
| 03/21/2001 | EP1085067A1 Polishing composition and polishing process |
| 03/21/2001 | EP1084009A1 Cmp pad conditioner arrangement and method therefor |
| 03/21/2001 | EP1084001A1 Accurate positioning of a wafer |
| 03/21/2001 | CN1288252A Piezoelectric actuated chemical mechanical polishing tray |
| 03/20/2001 | US6203417 Chemical mechanical polishing tool components with improved corrosion resistance |
| 03/20/2001 | US6203414 Polishing apparatus |
| 03/20/2001 | US6203413 Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 03/20/2001 | US6203412 Submerge chemical-mechanical polishing |