| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 05/31/2001 | DE10057998A1 Polishing method involves inclining tool at defined angle in direction perpendicular to holding surface and in tool displacement direction, then in direction to reduce elastic deformation |
| 05/30/2001 | EP1103346A2 Method and apparatus for electrochemical-mechanical planarization |
| 05/29/2001 | US6239188 Mixing expanded microballoons having a size of 10 to 50 mum and expanded microballoons having a size of 80 to 100 mum with the prepolymer and active hydrogen-containing compound and curing the mixture. |
| 05/29/2001 | US6238590 Tribochemical polishing of ceramics and metals |
| 05/29/2001 | US6238450 Milling slurry of agglomerated ceria at an alkaline ph to increase the bet surface area to that suitable for optical and chemo-mechanical polishing processes |
| 05/29/2001 | US6238279 Magnetic filtration for slurry used in chemical mechanical polishing of semiconductor wafers |
| 05/29/2001 | US6238276 Sizing lapping apparatus |
| 05/29/2001 | US6238274 Polishing method for a device |
| 05/29/2001 | US6238273 Methods for predicting polishing parameters of polishing pads and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 05/29/2001 | US6238271 Methods and apparatus for improved polishing of workpieces |
| 05/29/2001 | US6238270 Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers |
| 05/25/2001 | WO2001036555A1 Composition and method for planarizing surfaces |
| 05/25/2001 | WO2001036554A1 Composition and method for planarizing surfaces |
| 05/25/2001 | WO2001036138A1 Combined electrolytic polishing and abrasive super-finishing process |
| 05/25/2001 | WO2000051782B1 Apparatus and method for chemical-mechanical polishing (cmp) using a head having direct pneumatic wafer polishing pressure system |
| 05/24/2001 | US20010001756 Chemical mechanical polishing with multiple polishing pads |
| 05/24/2001 | US20010001755 System for real-time control of semiconductor wafer polishing |
| 05/24/2001 | US20010001738 Preconditioning polishing pads for chemical-mechanical polishing |
| 05/23/2001 | EP1101566A2 Workpiece carrier and polishing apparatus having workpiece carrier |
| 05/23/2001 | DE19954355A1 Polishing plate for lapping, grinding or polishing disc-shaped workpieces, e.g. silicon or silicon carbide substrate wafers, has its upper layer cut through by a cooling labyrinth |
| 05/23/2001 | CN1296434A Modular machine tool for polishing and planting substrates |
| 05/23/2001 | CN1296177A Optimizing chemical-mechanical planing process by testing oxide/nitride interface |
| 05/23/2001 | CN1296049A Compositions for chemical-mechanical polishing |
| 05/22/2001 | US6236542 Substrate independent superpolishing process and slurry |
| 05/22/2001 | US6235635 Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning |
| 05/22/2001 | US6235425 Apparatus and method for treating a cathode material provided on a thin-film substrate |
| 05/22/2001 | US6234883 Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishing |
| 05/22/2001 | US6234879 Method and apparatus for wafer chamfer polishing |
| 05/22/2001 | US6234878 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 05/22/2001 | US6234877 Method of chemical mechanical polishing |
| 05/22/2001 | US6234876 Chemical-mechanical polish machines and fabrication process using the same |
| 05/22/2001 | US6234875 Method of modifying a surface |
| 05/22/2001 | US6234874 Wafer processing apparatus |
| 05/22/2001 | US6234870 Serial intelligent electro-chemical-mechanical wafer processor |
| 05/22/2001 | US6234868 Apparatus and method for conditioning a polishing pad |
| 05/17/2001 | WO2001034346A1 Chemical mechanical polishing apparatus components with enhanced corrosion resistance |
| 05/17/2001 | DE19956250C1 Production of a number of semiconductor wafers comprise simultaneously polishing a front side and a rear side of each wafer and evaluating each wafer for further processing according to quality criteria |
| 05/16/2001 | EP1099471A1 Apparatus and method for precise mixing, delivery and transfer of chemicals |
| 05/15/2001 | US6232043 Rule to determine CMP polish time |
| 05/15/2001 | US6231673 Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device |
| 05/15/2001 | US6231434 Polishing pads and methods relating thereto |
| 05/15/2001 | US6231428 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| 05/15/2001 | US6231427 Linear polisher and method for semiconductor wafer planarization |
| 05/15/2001 | US6230389 Method for fabricating a magnetoresistive (MR) stripe height lapping monitor with improved linearity |
| 05/10/2001 | WO2001032794A1 A ta barrier slurry containing an organic additive |
| 05/10/2001 | WO2001032793A2 Use of cesium hydroxide in a dielectric cmp slurry |
| 05/10/2001 | WO2001032362A1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 05/10/2001 | WO2001032361A1 Method and apparatus for lapping of workpieces |
| 05/10/2001 | US20010001053 Apparatus and method for treating a cathode material provided on a thin-film substrate |
| 05/10/2001 | DE19962564C1 Polishing cloth for semiconductor substrate discs has upper and lower layers provided with segments spaced via separation channels and intermediate porous layer for uniform distribution of polishing medium |
| 05/10/2001 | DE10007389A1 Semiconductor disk removal device in double-sided polishing machine, having rotary drive for suction head, and drive and lift drive for arm, on which suction head is arranged |
| 05/09/2001 | EP1097026A1 Polishing pads for a semiconductor substrate |
| 05/09/2001 | EP0931118A4 Composition and method for polishing a composite comprising titanium |
| 05/09/2001 | CN2429299Y Hand grinder for sealing surface of valve |
| 05/08/2001 | US6228771 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
| 05/08/2001 | US6227956 Pad quick release device for chemical mechanical polishing |
| 05/08/2001 | US6227955 Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 05/08/2001 | US6227950 Dual purpose handoff station for workpiece polishing machine |
| 05/08/2001 | US6227949 Two-slurry CMP polishing with different particle size abrasives |
| 05/08/2001 | US6227948 Polishing pad reconditioning via polishing pad material as conditioner |
| 05/08/2001 | US6227947 Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer |
| 05/08/2001 | US6227946 Robot assisted method of polishing, cleaning and drying workpieces |
| 05/08/2001 | US6227939 Temperature controlled chemical mechanical polishing method and apparatus |
| 05/03/2001 | WO2001030538A1 Work polishing method and work polishing device |
| 05/03/2001 | US20010000775 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 05/03/2001 | US20010000774 Polishing head with removable subcarrier |
| 05/03/2001 | US20010000773 Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer |
| 05/03/2001 | US20010000772 Method and apparatus for uniformly planarizing a microelectronic substrate |
| 05/03/2001 | US20010000770 Wafer polishing head |
| 05/03/2001 | US20010000753 Apparatus and method for chemical/mechanical polishing |
| 05/03/2001 | US20010000586 Chemical mechanically polishing the silicon layer with an oxide polishing slurry, then the silicon layer is chemical mechanically polished with a silicon-polishing slurry until the substrate is planarized |
| 05/02/2001 | EP1095992A2 CMP slurry for planarizing metals |
| 05/02/2001 | EP1095734A1 Polishing device |
| 05/02/2001 | EP0930978A4 Composition and method for polishing a composite |
| 05/02/2001 | EP0706582B1 Improved compositions and methods for polishing |
| 05/02/2001 | CN2428260Y LD disc grinding and repairing machine |
| 05/02/2001 | CN1065164C Cover operating device and its grinding groove and grinding device |
| 05/01/2001 | US6225224 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
| 05/01/2001 | US6224712 Polishing apparatus |
| 05/01/2001 | US6224472 Retaining ring for chemical mechanical polishing |
| 05/01/2001 | US6224470 Pad cleaning brush for chemical mechanical polishing apparatus and method of making the same |
| 05/01/2001 | US6224465 Methods and apparatus for chemical mechanical planarization using a microreplicated surface |
| 05/01/2001 | US6224464 Polishing method and polisher used in the method |
| 05/01/2001 | US6224461 Method and apparatus for stabilizing the process temperature during chemical mechanical polishing |
| 05/01/2001 | US6224460 Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process |
| 04/26/2001 | WO2001029145A1 Improved cmp products |
| 04/26/2001 | WO2001028739A1 Device for polishing outer peripheral edge of semiconductor wafer |
| 04/26/2001 | US20010000497 Using a buffing pad having a geometrically optimized shape along with optimizing the buff head diameter, offset and overlays for chemical and mechanical polishing of semiconductor wafer |
| 04/26/2001 | US20010000490 Rotating a polishing pad affixed to a platen at a first rotational speed, supplying an abrasive material over a surface of polishing pad, pressing the wafer against pad surface while at the same time rotating wafer at second speed |
| 04/26/2001 | DE10012840A1 Production of semiconductor wafers comprises simultaneously polishing front and rear sides of each wafer between polishing plates covered with cloth, evaluating and then re-polishing |
| 04/26/2001 | CA2383504A1 Improved cmp products |
| 04/25/2001 | EP1093666A1 A technique for chemical mechanical polishing silicon |
| 04/24/2001 | US6221818 Hydroxylamine-gallic compound composition and process |
| 04/24/2001 | US6221199 Apparatus and method for removing an adhesive bonded pad |
| 04/24/2001 | US6221118 Cerium oxide abrasive and method of polishing substrates |
| 04/24/2001 | US6220944 Carrier head to apply pressure to and retain a substrate |
| 04/24/2001 | US6220942 CMP platen with patterned surface |
| 04/24/2001 | US6220941 Method of post CMP defect stability improvement |
| 04/24/2001 | US6220936 In-site roller dresser |
| 04/24/2001 | US6220934 Method for controlling pH during planarization and cleaning of microelectronic substrates |