| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/03/2001 | US6254469 Wafer for cleaning semiconductor device probe |
| 07/03/2001 | US6254461 Process of dressing glass disk polishing pads using diamond-coated dressing disks |
| 07/03/2001 | US6254460 Fixed abrasive polishing pad |
| 07/03/2001 | US6254459 Wafer polishing device with movable window |
| 07/03/2001 | US6254457 Process for polishing wafers of integrated circuits |
| 07/03/2001 | US6254456 Modifying contact areas of a polishing pad to promote uniform removal rates |
| 07/03/2001 | US6254454 Reference thickness endpoint techniques for polishing operations |
| 07/03/2001 | US6254453 Optimization of chemical mechanical process by detection of oxide/nitride interface using CLD system |
| 06/28/2001 | WO2001047007A1 Slurry-less chemical-mechanical polishing of oxide materials |
| 06/28/2001 | WO2001046684A1 In-situ metalization monitoring using eddy current measurements and optical measurements |
| 06/28/2001 | WO2001045901A1 Apparatus for performing chemical-mechanical planarization |
| 06/28/2001 | WO2001045900A1 Self-leveling pads and methods relating thereto |
| 06/28/2001 | WO2001045899A1 Polishing pad, and method and apparatus for polishing |
| 06/28/2001 | WO2001045888A1 Compound mixer and filter for lapping machine |
| 06/28/2001 | WO1999066546A9 Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context |
| 06/28/2001 | US20010005667 CMP platen with patterned surface |
| 06/28/2001 | US20010005666 Chemical mechanical polishing methods |
| 06/28/2001 | US20010005665 Dual purpose handoff station for workpiece polishing machine |
| 06/28/2001 | US20010005265 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus |
| 06/28/2001 | US20010005009 A slurry for chemical mechanical polishing a copper-containing metal film, comprising theta -alumina mainly comprising secondary particles made of aggregated primary particles as polishing grains, an oxidizer and an organic acid |
| 06/27/2001 | EP1111665A2 Method of planarizing a substrate surface |
| 06/27/2001 | EP1111659A2 Apparatus and methods of chemical mechanical polishing |
| 06/27/2001 | EP1111023A2 Neutral slurry of colloidal silica |
| 06/27/2001 | EP1110668A2 Wafer holding unit for polishing machine |
| 06/27/2001 | CN2436269Y Crankshaft lapping machine |
| 06/27/2001 | CN1300662A In-line cleaning method after polishing |
| 06/27/2001 | CN1300659A Clamp for machining |
| 06/26/2001 | US6251787 Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing |
| 06/26/2001 | US6251784 Real-time control of chemical-mechanical polishing processing by monitoring ionization current |
| 06/26/2001 | US6251215 Carrier head with a multilayer retaining ring for chemical mechanical polishing |
| 06/26/2001 | US6251150 Provide the desired level of planarization and selectivity for both metal and oxide surfaces without causing undesirable scratching of the surface. |
| 06/26/2001 | US6251001 Substrate polishing with reduced contamination |
| 06/26/2001 | US6251000 Substrate holder, method for polishing substrate, and method for fabricating semiconductor device |
| 06/26/2001 | US6250998 Hand-held cutting tool for cutting fiber |
| 06/26/2001 | US6250997 Processing machine |
| 06/26/2001 | US6250994 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 06/26/2001 | US6250991 Bearing substitute for wafer polishing arm |
| 06/21/2001 | WO2001044402A1 Method of polishing or planarizing a substrate |
| 06/21/2001 | WO2001044396A1 Polishing compositions for noble metals |
| 06/21/2001 | WO2001044395A1 Polishing compositions for semiconductor substrates |
| 06/21/2001 | WO2001043920A1 Method of manufacturing a polymer or polymer composite polishing pad |
| 06/21/2001 | US20010004538 Computer readable medium is provided bearing instructions to control polishing system to polish substrate surface at a first removal rate on a first platen and then polish at a second removal rate less than the first rate |
| 06/21/2001 | US20010003883 Abrasive machine |
| 06/20/2001 | EP1108979A2 Method and apparatus for substrate film thickness measurement and substrate processing |
| 06/20/2001 | EP1108501A2 Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations |
| 06/20/2001 | EP1108500A1 Polishing pad |
| 06/20/2001 | CN1067414C Fluororesin foam and proces sfor producing the same |
| 06/19/2001 | US6248667 Chemical mechanical polishing method using double polishing stop layer |
| 06/19/2001 | US6248395 Abrading substrate with slurry including diamond and cerium dioxide particles, said diamond mechanically abrading said substrate but not causing chemical-mechanical polishing, said cerium dioxide causing chemical-mechanical polishing |
| 06/19/2001 | US6248144 Process for producing polishing composition |
| 06/19/2001 | US6248009 Apparatus for cleaning substrate |
| 06/19/2001 | US6248006 CMP uniformity |
| 06/19/2001 | US6248002 Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish |
| 06/19/2001 | US6248001 Semiconductor die de-processing using a die holder and chemical mechanical polishing |
| 06/19/2001 | US6248000 Polishing pad thinning to optically access a semiconductor wafer surface |
| 06/19/2001 | US6247998 Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
| 06/14/2001 | WO2001042866A1 Method and system for endpoint detection |
| 06/14/2001 | WO2001041973A2 Chemical-mechanical polishing method |
| 06/14/2001 | US20010003700 CMP slurry recycling apparatus and method for recycling CMP slurry |
| 06/14/2001 | US20010003698 Polishing machine having a plurality of abrasive pads |
| 06/13/2001 | EP1107300A2 Preconditioning abrasive articles for use in chemical-mechanical polishing |
| 06/13/2001 | EP1107289A2 Planarization apparatus |
| 06/13/2001 | EP1106663A1 Slurry for chemical mechanical polishing silicon dioxide |
| 06/13/2001 | CN2434097Y Improved pneumatic grinding polisher |
| 06/12/2001 | US6245680 Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning |
| 06/12/2001 | US6245679 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 06/12/2001 | US6245677 Backside chemical etching and polishing |
| 06/12/2001 | US6245406 Abrasive shaped article, abrasive disc and polishing method |
| 06/12/2001 | US6245193 Chemical mechanical polishing apparatus improved substrate carrier head and method of use |
| 06/12/2001 | US6244946 Polishing head with removable subcarrier |
| 06/12/2001 | US6244945 Polishing system including a hydrostatic fluid bearing support |
| 06/12/2001 | US6244944 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates |
| 06/12/2001 | US6244942 Carrier head with a flexible membrane and adjustable edge pressure |
| 06/12/2001 | US6244941 Method and apparatus for pad removal and replacement |
| 06/12/2001 | US6244935 Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
| 06/12/2001 | US6244932 Method for detecting the presence of a substrate in a carrier head |
| 06/12/2001 | US6244931 Buffer station on CMP system |
| 06/12/2001 | US6244929 Chemical-mechanical-polishing system with continuous filtration |
| 06/07/2001 | WO2001024969A3 Fluid dispensing fixed abrasive polishing pad |
| 06/07/2001 | US20010003084 Method and system for endpoint detection |
| 06/05/2001 | US6242353 Wafer holding head and wafer polishing apparatus, and method for manufacturing wafers |
| 06/05/2001 | US6242352 Method of preventing micro-scratches on the surface of a semiconductor wafer when performing a CMP process |
| 06/05/2001 | US6241847 Polishing semiconductor wafers with slurry that allows an infrared spectrum to be emitted through detects rate of change of intensity level and generates control signal |
| 06/05/2001 | US6241596 Method and apparatus for chemical mechanical polishing using a patterned pad |
| 06/05/2001 | US6241593 Carrier head with pressurizable bladder |
| 06/05/2001 | US6241592 Polishing apparatus |
| 06/05/2001 | US6241591 Apparatus and method for polishing a substrate |
| 06/05/2001 | US6241588 Cavitational polishing pad conditioner |
| 06/05/2001 | US6241586 CMP polishing slurry dewatering and reconstitution |
| 06/05/2001 | US6241585 Apparatus and method for chemical mechanical polishing |
| 06/05/2001 | US6241583 Chemical mechanical polishing with a plurality of polishing sheets |
| 06/05/2001 | US6241582 Chemical mechanical polish machines and fabrication process using the same |
| 06/05/2001 | US6241581 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus |
| 06/05/2001 | US6241578 Carrier device in polishing apparatus and method for controlling carrier device |
| 06/05/2001 | US6241226 Vacuum system coupled to a wafer chuck for holding wet wafers |
| 05/31/2001 | WO2001039260A1 Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics |
| 05/31/2001 | US20010002361 Polishing liquid supply apparatus |
| 05/31/2001 | US20010002359 Polishing apparatus |
| 05/31/2001 | US20010002358 Dual purpose handoff station for workpiece polishing machine |
| 05/31/2001 | DE19946493A1 Process for partially removing layers during semiconductor production e.g. planarizing comprises applying an auxiliary layer before applying the layer to be removed |