| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/26/2001 | WO2001053039A1 Dissolution of metal particles produced by polishing |
| 07/26/2001 | US20010009841 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 07/26/2001 | US20010009840 Non-aqueous solvent and at least one acetylene glycol compound such as the ethylene oxide adduct of 2,4,7,9-tetramethyl-5-decyn-4,7-diol; finish grinding thin film type magnetic head |
| 07/26/2001 | US20010009838 Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process |
| 07/26/2001 | US20010009811 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 07/26/2001 | DE10004578C1 Production of a semiconductor wafer comprises polishing the edges of the wafer with a cloth with the continuous introduction of an alkaline polishing agent using polishing plates, wetting with a film and cleaning and drying |
| 07/25/2001 | EP1118432A2 Substrate polishing pad |
| 07/25/2001 | EP1118431A2 Method and apparatus for detecting polishing endpoint with optical monitoring |
| 07/25/2001 | EP1118429A1 Method and device for simultaneously grinding double surfaces, and method and device for simultaneously lapping double surfaces |
| 07/25/2001 | EP1117506A1 Cmp polishing head with three chambers and method for using the same |
| 07/25/2001 | CN1305393A Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization |
| 07/25/2001 | CN1068815C Abrasive construction for semiconductor wafer modification |
| 07/25/2001 | CN1068814C Polishing pads |
| 07/24/2001 | US6265314 Wafer edge polish |
| 07/24/2001 | US6264789 System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
| 07/24/2001 | US6264540 Method and apparatus for disposable bladder carrier assembly |
| 07/24/2001 | US6264536 Reducing polish platen corrosion during integrated circuit fabrication |
| 07/24/2001 | US6264533 Abrasive processing apparatus and method employing encoded abrasive product |
| 07/24/2001 | US6264532 Ultrasonic methods and apparatus for the in-situ detection of workpiece loss |
| 07/24/2001 | US6263605 Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor |
| 07/19/2001 | WO2001052307A2 Semiconductor workpiece proximity plating methods and apparatus |
| 07/19/2001 | US20010008830 CMP polishing pad |
| 07/19/2001 | US20010008827 Polishing apparatus |
| 07/19/2001 | US20010008826 Apparatus and method for processing thin-film magnetic head material |
| 07/19/2001 | US20010008801 A small amount of single-side lapping is repeated alternately on the two surfaces of a semiconductor silicon single crystal wafer to get to a predetermined total lapping stock removal |
| 07/18/2001 | EP1116552A2 Polishing apparatus with thickness measuring means |
| 07/18/2001 | EP1115806A1 Workpiece retainer and method for attaching/detaching workpiece by using the same |
| 07/18/2001 | EP1115805A1 Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate |
| 07/18/2001 | EP1115804A1 Polishing liquid for polishing components, preferably wafers, especially for chemically-mechanically polishing components of this type |
| 07/18/2001 | EP1115803A1 Oxidizing polishing slurries for low dielectric constant materials |
| 07/18/2001 | EP1115643A1 Apparatus for sensing the presence of a wafer |
| 07/18/2001 | CN1303758A Process of grinding, electron component and variable capacitor |
| 07/18/2001 | CN1303757A Clamping tool for working |
| 07/17/2001 | US6261959 Method and apparatus for chemically-mechanically polishing semiconductor wafers |
| 07/17/2001 | US6261958 Method for performing chemical-mechanical polishing |
| 07/17/2001 | US6261851 Optimization of CMP process by detecting of oxide/nitride interface using IR system |
| 07/17/2001 | US6261476 Hybrid polishing slurry |
| 07/17/2001 | US6261168 Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
| 07/17/2001 | US6261165 Row carrier for precision lapping of disk drive heads and for handling of heads during the slider fab operation |
| 07/17/2001 | US6261163 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies |
| 07/17/2001 | US6261162 Polishing apparatus and method of manufacturing grinding plate |
| 07/17/2001 | US6261159 Apparatus and method for the restoration of optical storage media |
| 07/17/2001 | US6261158 Multi-step chemical mechanical polishing |
| 07/17/2001 | US6261157 Selective damascene chemical mechanical polishing |
| 07/17/2001 | US6261155 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
| 07/17/2001 | US6261152 Heterdoyne Thickness Monitoring System |
| 07/17/2001 | US6261151 System for real-time control of semiconductor wafer polishing |
| 07/17/2001 | US6260709 Membrane filter element for chemical-mechanical polishing slurries |
| 07/12/2001 | WO2001049454A1 Apparatus for polishing magnetic head and polishing method |
| 07/12/2001 | WO2001049453A1 Method and apparatus for conditioning a polishing pad |
| 07/12/2001 | WO2001049452A1 Method and apparatus for determining metal cmp endpoint using integrated polishing pad electrodes |
| 07/12/2001 | WO2001049449A2 Flexible polishing pad having reduced surface stress |
| 07/12/2001 | US20010007810 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| 07/12/2001 | US20010007795 Method for polishing surface of semicon-ductor device substrate |
| 07/12/2001 | US20010007772 Catalytic converter; light sensor |
| 07/11/2001 | EP1114855A1 Diamond abrasive particles and method for preparing the same |
| 07/11/2001 | EP1114697A2 Apparatus and method for controlled delivery of slurry to a region of a polishing device |
| 07/11/2001 | EP1114695A2 Chemical mechanical planarization system |
| 07/11/2001 | EP1114110A1 Wafer retainer and method for attaching/detaching the wafer retainer to/from polishing machine base plate |
| 07/10/2001 | US6258711 Sacrificial deposit to improve damascene pattern planarization in semiconductor wafers |
| 07/10/2001 | US6258205 Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material |
| 07/10/2001 | US6258177 Apparatus for cleaning the grooves of lapping plates |
| 07/10/2001 | US6258140 Polishing composition |
| 07/10/2001 | US6258137 CMP products |
| 07/10/2001 | US6258136 Fixed abrasives for optical polishing |
| 07/10/2001 | US6257966 Wafer surface machining apparatus |
| 07/10/2001 | US6257961 Rotational speed adjustment for wafer polishing method |
| 07/10/2001 | US6257960 Lapping method and method for manufacturing lapping particles for use in the lapping method |
| 07/10/2001 | US6257959 Apparatus and method for processing slider, load applying apparatus and auxiliary device for processing slider |
| 07/10/2001 | US6257958 Method for cleaning semiconductor device probe |
| 07/10/2001 | US6257955 Apparatus and method for heating a liquid or viscous polishing agent, and device for polishing wafers |
| 07/10/2001 | US6257953 Method and apparatus for controlled polishing |
| 07/05/2001 | WO2001048801A1 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device |
| 07/05/2001 | WO2001048800A1 Semiconductor wafer processing apparatus and processing method |
| 07/05/2001 | WO2001048114A1 Composition for polishing magnetic disk substrate and polishing method, and magnetic disk substrate polished thereby |
| 07/05/2001 | WO2001047667A1 Method and apparatus for controlling abrasive flow machining |
| 07/05/2001 | WO2001047666A1 Work piece carrier head for plating and polishing |
| 07/05/2001 | WO2001047664A1 Wafer polishing method and wafer polishing device |
| 07/05/2001 | US20010006936 Removing photoresist residue; does not corrode or attack titanium or other metallurgy, oxide or nitride layers on the substrate |
| 07/05/2001 | US20010006882 Supply system for chemicals and its use |
| 07/05/2001 | US20010006881 Polishing apparatus |
| 07/05/2001 | US20010006879 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates |
| 07/05/2001 | US20010006878 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates |
| 07/05/2001 | US20010006877 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates |
| 07/05/2001 | US20010006875 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 07/05/2001 | US20010006874 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006873 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006872 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006871 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006870 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/05/2001 | US20010006841 Process for forming a metal interconnect |
| 07/05/2001 | US20010006225 A slurry used for chemical mechanical polishing of a substrate having a copper-containing film at the surface, which contains and abrasive, an oxidizer, and adhesive-inhibitor preventing adhesion of polishing product to |
| 07/05/2001 | US20010006224 A slurry for chemical mechanical polishing of a substrate containing tantalum or tantalum nitride comprising a silica polishing grain and an inorganic salt to prevent dishing and erosion |
| 07/05/2001 | US20010006031 Chemical meachanical polishing slurry for polishing copper metal or alloy film formed on tantalum or tantalum nitride film comprising an oxidizer, an organic acid and an alkanolamine |
| 07/05/2001 | DE19961106A1 Device for holding a plane plate comprises a bearing surface whose diameter corresponds to the plate diameter, and a holding ring whose vertical protrusion corresponds to the plate thickness |
| 07/04/2001 | EP1112816A2 Polishing pad and method of manufacture |
| 07/04/2001 | EP1112147A1 Support for temporary fixation of a self-sticking abrasive and/or polishing sheet |
| 07/04/2001 | EP1112145A1 Polishing pad for a semiconductor substrate |
| 07/04/2001 | CN1301992A Leveling method |
| 07/03/2001 | US6254718 Combined CMP and plasma etching wafer flattening system |