| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 08/22/2001 | CN1309167A Grinding oil composition for polishing |
| 08/22/2001 | CN1309160A Abrasive composition for polishing magnetic recording disk matrix |
| 08/21/2001 | US6277236 Light sensitive chemical-mechanical polishing apparatus and method |
| 08/21/2001 | US6277169 Method for making silver-containing particles |
| 08/21/2001 | US6277015 Polishing pad and system |
| 08/21/2001 | US6277014 Carrier head with a flexible membrane for chemical mechanical polishing |
| 08/21/2001 | US6277010 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 08/21/2001 | US6277009 Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
| 08/21/2001 | US6277008 Polishing apparatus |
| 08/21/2001 | US6277000 Polishing chucks, semiconductor wafer polishing chucks, abrading method, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks |
| 08/21/2001 | US6276999 Apparatus, backing plate, backing film and method for chemical mechanical polishing |
| 08/21/2001 | US6276998 Padless substrate carrier |
| 08/21/2001 | US6276996 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 08/21/2001 | US6276991 Crown forming method of forming crown on floating type magnetic head |
| 08/21/2001 | US6276989 Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing |
| 08/21/2001 | US6276987 Chemical mechanical polishing endpoint process control |
| 08/21/2001 | US6276372 Process using hydroxylamine-gallic acid composition |
| 08/16/2001 | WO2001058771A1 Package with multiple chambers and valves |
| 08/16/2001 | WO2001058643A1 Modified plating solution for plating and planarization and process utilizing same |
| 08/16/2001 | WO2000013852A8 Apparatuses and methods for polishing semiconductor wafers |
| 08/16/2001 | US20010014573 Method for preparing glass substrates for magnetic recording mediums |
| 08/16/2001 | US20010014572 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 08/16/2001 | US20010014571 Method and apparatus for increasing chemical-mechanical-polishing selectivity |
| 08/16/2001 | US20010014570 Process for producing a semiconductor wafer with polished edge |
| 08/16/2001 | US20010014537 Method and apparatus for planarization of a substrate |
| 08/16/2001 | US20010014498 Method and apparatus for forming an inlaid capacitor in a semiconductor wafer |
| 08/16/2001 | US20010013523 Multiple dispensing valve closure with threaded attachment to a container and with a twist-open spout |
| 08/16/2001 | US20010013503 Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 08/16/2001 | EP1123776A1 Surfaces machining apparatus |
| 08/16/2001 | CA2399613A1 Package with multiple chambers and valves |
| 08/15/2001 | CN1308314A Film magnetic-head material processing equipment and method |
| 08/14/2001 | US6273806 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| 08/14/2001 | US6273804 Apparatus for polishing wafers |
| 08/14/2001 | US6273803 Carriers and polishing apparatus |
| 08/14/2001 | US6273802 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 08/14/2001 | US6273800 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates |
| 08/14/2001 | US6273798 Pre-conditioning polishing pads for chemical-mechanical polishing |
| 08/14/2001 | US6273797 In-situ automated CMP wedge conditioner |
| 08/14/2001 | US6273796 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 08/14/2001 | US6273792 Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing |
| 08/14/2001 | US6273791 Method of producing semiconductor wafer |
| 08/14/2001 | US6273786 Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 08/14/2001 | US6273784 Surface treatment method and apparatus for support of lithographic plate |
| 08/14/2001 | US6272902 Method and apparatus for off-line testing a polishing head |
| 08/09/2001 | WO2001057150A1 Polishing composition |
| 08/09/2001 | WO2001056744A1 Endpoint monitoring with polishing rate change |
| 08/09/2001 | WO2001056743A1 Interface assembly for lapping control feedback |
| 08/09/2001 | WO2001056742A1 Polishing device and method |
| 08/09/2001 | US20010012751 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
| 08/09/2001 | US20010012750 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic-substrate assemblies |
| 08/09/2001 | US20010012748 Method and apparatus for polishing, and lapping jig |
| 08/09/2001 | DE10104777A1 Verfahren zum Bestimmen optimaler Schleifbedingungen A method for determining optimum grinding conditions |
| 08/08/2001 | EP1121222A1 Oscillating orbital polisher and method |
| 08/08/2001 | EP0713897B1 Fluororesin foam and process for producing the same |
| 08/08/2001 | CN1307079A 抛光组合物 The polishing composition |
| 08/07/2001 | US6271140 Coaxial dressing for chemical mechanical polishing |
| 08/07/2001 | US6271139 Smoothness of emission display grid using fine silica colloids |
| 08/07/2001 | US6271047 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| 08/07/2001 | US6270688 Chemical polishing of barium strontium titanate |
| 08/07/2001 | US6270397 Chemical mechanical polishing device with a pressure mechanism |
| 08/07/2001 | US6270395 Oxidizing polishing slurries for low dielectric constant materials |
| 08/07/2001 | US6270392 Polishing apparatus and method with constant polishing pressure |
| 08/07/2001 | US6270246 Apparatus and method for precise mixing, delivery and transfer of chemicals |
| 08/02/2001 | WO2001056070A1 Planarization process to achieve improved uniformity across semiconductor wafers |
| 08/02/2001 | WO2001056068A1 Monitor, method of monitoring, polishing device, and method of manufacturing semiconductor wafer |
| 08/02/2001 | WO2001056032A2 Reduced voltage input/reduced voltage output repeaters for high resistance or high capacitance signal lines and methods therefor |
| 08/02/2001 | WO2001056031A2 Full swing voltage input/full swing voltage output bi-directional repeaters for high resistance or high capacitance bi-directional signal lines and methods therefor |
| 08/02/2001 | WO2001054862A1 System and method for controlled polishing and planarization of semiconductor wafers |
| 08/02/2001 | WO2001032793A3 Use of cesium hydroxide in a dielectric cmp slurry |
| 08/02/2001 | US20010011003 Structure of polishing head of polishing apparatus |
| 08/02/2001 | US20010011002 Wafer processing machine |
| 08/02/2001 | US20010011000 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 08/02/2001 | US20010010999 Wafer polishing apparatus |
| 08/02/2001 | US20010010997 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 08/02/2001 | US20010010996 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 08/02/2001 | US20010010972 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 08/02/2001 | US20010010305 Precision polishing method and apparatus of substrate |
| 08/02/2001 | US20010010112 Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device |
| 08/02/2001 | DE10018338C1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 08/01/2001 | EP1120694A2 Adaptive endpoint detection for chemical mechanical polishing |
| 08/01/2001 | EP1120194A2 Optical monitoring in a two-step chemical mechanical polishing process |
| 08/01/2001 | EP1120193A1 Unpolished work holding board and production method thereof and work polishing method and device |
| 08/01/2001 | EP1120191A2 Wafer processing machine |
| 08/01/2001 | CN2440621Y Valve grinder |
| 08/01/2001 | CN2440620Y Portable multifunctional valve grinder |
| 08/01/2001 | CN1306560A CMP slurry contg. solid catalyst |
| 07/31/2001 | US6267659 Stacked polish pad |
| 07/31/2001 | US6267656 Carrier head for a chemical mechanical polishing apparatus |
| 07/31/2001 | US6267655 Retaining ring for wafer polishing |
| 07/31/2001 | US6267654 Pad backer for polishing head of chemical mechanical polishing machine |
| 07/31/2001 | US6267650 Apparatus and methods for substantial planarization of solder bumps |
| 07/31/2001 | US6267649 Edge and bevel CMP of copper wafer |
| 07/31/2001 | US6267646 Polishing machine |
| 07/31/2001 | US6267644 Fixed abrasive finishing element having aids finishing method |
| 07/31/2001 | US6267643 Slotted retaining ring for polishing head and method of using |
| 07/31/2001 | US6267642 Sensing the presence of a wafer |
| 07/31/2001 | US6267641 Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor |
| 07/26/2001 | WO2001054179A1 Method and apparatus for reclaiming a metal from a cmp process for use in an electroplating process |
| 07/26/2001 | WO2001053042A1 Polishing pad with release layer |
| 07/26/2001 | WO2001053040A1 Printing of polishing pads |