| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/18/2001 | US6290579 Fixed abrasive polishing pad |
| 09/18/2001 | US6290578 Method for chemical mechanical polishing using synergistic geometric patterns |
| 09/18/2001 | US6290577 Fluid pressure regulated wafer polishing head |
| 09/18/2001 | US6290576 Semiconductor processors, sensors, and semiconductor processing systems |
| 09/18/2001 | US6290572 Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 09/13/2001 | US20010021628 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 09/13/2001 | US20010021627 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates |
| 09/13/2001 | US20010021622 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system |
| 09/13/2001 | US20010020348 Particle with a functional group capable of trapping a metal ion, an oxidizing agent and water for chemical mechanical polishing of a copper-based metal |
| 09/13/2001 | DE10010287A1 Mixer arrangement, used in production of suspensions for chemical-mechanical polishing of wafers, comprises mixing container connected to one end of liquid pump, and feed and circulating systems |
| 09/12/2001 | EP1131186A1 Lapping and polishing device |
| 09/12/2001 | CN1312747A Waffer edge polishing method and apparatus |
| 09/12/2001 | CN1312545A Method for polishing magnetic-head floating block |
| 09/11/2001 | US6288648 Apparatus and method for determining a need to change a polishing pad conditioning wheel |
| 09/11/2001 | US6287879 Endpoint stabilization for polishing process |
| 09/11/2001 | US6287192 Slurry supply system for chemical mechanical polishing process having sonic wave generator |
| 09/11/2001 | US6287185 Polishing pads and methods relating thereto |
| 09/11/2001 | US6287178 Wafer carrier rinsing mechanism |
| 09/11/2001 | US6287175 Method of mirror-finishing a glass substrate |
| 09/11/2001 | US6287174 Polishing pad and method of use thereof |
| 09/11/2001 | US6287173 Longer lifetime warm-up wafers for polishing systems |
| 09/11/2001 | US6287172 Method for improvement of tungsten chemical-mechanical polishing process |
| 09/11/2001 | US6287171 System and method for detecting CMP endpoint via direct chemical monitoring of reactions |
| 09/11/2001 | US6287170 Multipoint bending apparatus for lapping heads of a data storage device |
| 09/07/2001 | WO2001064396A1 Polishing pad surface texture formed by solid phase droplets |
| 09/07/2001 | WO2001064395A2 A modular control system and method for a cmp tool |
| 09/07/2001 | WO2001064391A2 Planarization system with a wafer transfer corridor and multiple polishing modules |
| 09/06/2001 | US20010019940 Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines |
| 09/06/2001 | US20010019939 Abrasive machine |
| 09/06/2001 | US20010019938 Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 09/06/2001 | US20010019937 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates |
| 09/06/2001 | US20010019934 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using |
| 09/06/2001 | US20010019895 Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
| 09/06/2001 | US20010018790 Preventive maintenance apparatus for CMP top-ring's backing-film and the method thereof |
| 09/05/2001 | EP1129821A1 Method and device for polishing semiconductor wafer |
| 09/05/2001 | EP1129816A2 Method for polishing ceramics |
| 09/05/2001 | EP1129237A2 Method and apparatus for electrochemical mechanical deposition |
| 09/05/2001 | EP1129035A1 Aluminum oxide particles |
| 09/05/2001 | EP1128934A1 Chemical-mechanical-polishing system with continuous filtration |
| 09/05/2001 | EP1128932A1 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 09/05/2001 | CN2445855Y Large diameter valve grinder |
| 09/05/2001 | CN2445854Y Balance weight structure of rotary abrasive tool |
| 09/05/2001 | CN2445853Y Rotary grinding disk base |
| 09/04/2001 | US6285035 Apparatus for detecting an endpoint polishing layer of a semiconductor wafer having a wafer carrier with independent concentric sub-carriers and associated method |
| 09/04/2001 | US6284114 Immersing electrodes in particulate bath;controlling electrical conditions; generating bubbles to make polishing pad |
| 09/04/2001 | US6284092 CMP slurry atomization slurry dispense system |
| 09/04/2001 | US6284091 Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control |
| 09/04/2001 | US6283840 Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus |
| 09/04/2001 | US6283836 Non-abrasive conditioning for polishing pads |
| 09/04/2001 | US6283834 Diaphragm-support disc for a polishing machine and method of operating a polishing machine |
| 09/04/2001 | US6283829 In situ friction detector method for finishing semiconductor wafers |
| 09/04/2001 | US6283828 Wafer polishing apparatus |
| 09/04/2001 | US6283827 Non-contacting support for a wafer |
| 09/04/2001 | US6283822 Polishing apparatus |
| 08/30/2001 | WO2001063655A1 Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method |
| 08/30/2001 | WO2001063019A1 Pad designs and structures with improved fluid distribution |
| 08/30/2001 | WO2001063018A1 Pad designs and structures for a versatile materials processing apparatus |
| 08/30/2001 | WO2001062441A1 Mixing device and mixing method |
| 08/30/2001 | WO2001062440A1 Polishing pad with a transparent portion |
| 08/30/2001 | WO2001062436A1 Method and apparatus for polishing outer peripheral chamfered part of wafer |
| 08/30/2001 | US20010018322 Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members |
| 08/30/2001 | US20010018318 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 08/30/2001 | US20010018270 Comprising silica abrasive and polycarboxylic acid to polish substrate of tantulum-containing metal film formed on dielectric film; accuracy |
| 08/30/2001 | US20010017401 Method and apparatus for endpointing planarization of a microelectronic substrate |
| 08/30/2001 | US20010017007 Polishing composition |
| 08/29/2001 | EP1127658A2 Apparatus for mixing slurry |
| 08/29/2001 | EP1126952A1 Belt for polishing semiconductors |
| 08/29/2001 | EP1126950A1 Apparatuses and methods for polishing semiconductor wafers |
| 08/29/2001 | CN2444710Y Steel ball fine grinding plate |
| 08/29/2001 | CN1310657A CMP pad conditioner arrangement and method therefor |
| 08/28/2001 | US6281129 Corrosion-resistant polishing pad conditioner |
| 08/28/2001 | US6281128 Wafer carrier modification for reduced extraction force |
| 08/28/2001 | US6280490 Polishing composition and method for producing a memory hard disk |
| 08/28/2001 | US6280308 Wafer suction pad |
| 08/28/2001 | US6280306 Wafer polishing apparatus and wafer manufacturing method |
| 08/28/2001 | US6280304 Abrasive machine |
| 08/28/2001 | US6280300 Filter apparatus |
| 08/28/2001 | US6280299 Combined slurry dispenser and rinse arm |
| 08/28/2001 | US6280297 Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
| 08/28/2001 | US6280296 Surface polishing method and apparatus wherein axis of autorotation of workpiece is revolved about an axis within circumscribed circle of the workpiece |
| 08/28/2001 | US6280295 Apparatus and method to polish a wafer using abrasive flow machining |
| 08/28/2001 | US6280292 Polishing apparatus |
| 08/28/2001 | US6280290 Method of forming a transparent window in a polishing pad |
| 08/28/2001 | US6280289 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
| 08/28/2001 | US6280288 Process for determining optimum grinding conditions |
| 08/28/2001 | US6280079 Method of mixing slurries |
| 08/23/2001 | WO2001061746A2 Test structure for metal cmp process control |
| 08/23/2001 | WO2001060567A1 Process for reducing surface variations for polished wafer |
| 08/23/2001 | WO2001060242A2 Test structure for metal cmp process control |
| 08/23/2001 | US20010016470 Polishing apparatus and polishing method |
| 08/23/2001 | US20010016469 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 08/23/2001 | US20010016468 Lapping method and method for manufacturing lapping particles for use in the lapping method |
| 08/23/2001 | US20010016466 System for real-time control of semiconductor wafer polishing |
| 08/23/2001 | US20010015811 Test structure for metal CMP process control |
| 08/23/2001 | US20010015801 Polishing pad surface condition evaluation method and an apparatus thereof and a method of producing a semiconductor device |
| 08/22/2001 | EP1125999A1 Polishing composition |
| 08/22/2001 | EP1125688A1 Polishing apparatus and a semiconductor manufacturing method using the same |
| 08/22/2001 | EP1125686A1 Work holding disc for polishing, work polishing apparatus, and work polishing method |
| 08/22/2001 | EP1124912A1 A chemical mechanical polishing slurry system having an activator solution |
| 08/22/2001 | EP1124666A1 Use of zeta potential during chemical mechanical polishing for end point detection |