| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 10/04/2001 | WO2001073831A1 Production method for silicon wafer and soi wafer, and soi wafer |
| 10/04/2001 | WO2001073259A1 Tubing hanger with annulus bore |
| 10/04/2001 | WO2001073257A1 Tubing head seal assembly |
| 10/04/2001 | WO2001072473A2 Carrier head with controllable edge pressure |
| 10/04/2001 | WO2001072472A2 Carrier head with a flexible membrane having parts made with different elastomers |
| 10/04/2001 | WO2001072471A1 Work holding panel for polishing, and device and method for polishing |
| 10/04/2001 | WO2001072470A1 Process end point detection apparatus and method, polishing apparatus, semiconductor device manufacturing method, and recording medium recorded with signal processing program |
| 10/04/2001 | WO2001032793A8 Use of cesium hydroxide in a dielectric cmp slurry |
| 10/04/2001 | WO2001020304A3 Self-clearing optical measurement apparatus and methods of use |
| 10/04/2001 | US20010027082 Cluster tool systems and methods for in fab wafer processing |
| 10/04/2001 | US20010027081 Polishing apparatus and method thereof |
| 10/04/2001 | US20010027080 Method and apparatus for determining polishing endpoint with multiple light sources |
| 10/04/2001 | US20010027018 Polishing; using mixture of oxidizer and copper compound |
| 10/04/2001 | US20010026998 Methods of treating surfaces of substrates |
| 10/04/2001 | US20010026948 Method for appraising the condition of a semiconductor polishing cloth |
| 10/04/2001 | US20010026364 Test structure for metal CMP process control |
| 10/04/2001 | EP1139406A2 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
| 10/04/2001 | EP1138734A2 Aqueous dispersion for chemical mechanical polishing of metal films |
| 10/04/2001 | EP1138733A2 Aqueous dispersion for chemical mechanical polishing of insulating films |
| 10/04/2001 | EP1138439A2 Method and apparatus for recycling abrasive grain slurry |
| 10/04/2001 | EP1138438A1 Polishing pad and polishing device |
| 10/04/2001 | EP1138071A1 A method and system for polishing semiconductor wafers |
| 10/04/2001 | EP1138069A2 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 10/04/2001 | EP1138068A1 Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| 10/04/2001 | EP1137514A1 Modular machine for polishing and planing substrates |
| 10/04/2001 | EP0985007A4 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 10/04/2001 | DE10108358A1 Poliervorrichtung Polishing apparatus |
| 10/03/2001 | CN1315989A Chemical mechanical polishing slurry and method for using same |
| 10/03/2001 | CN1315898A 抛光垫 Polishing pad |
| 10/03/2001 | CN1315235A Magnetically grinding method for machining micro hole or micro part |
| 10/03/2001 | CN1315232A Regenerating treater for waste liquid of inorganic abradant |
| 10/02/2001 | US6297159 Method and apparatus for chemical polishing using field responsive materials |
| 10/02/2001 | US6296717 Regeneration of chemical mechanical polishing pads in-situ |
| 10/02/2001 | US6296557 Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 10/02/2001 | US6296554 Non-circular workpiece carrier |
| 10/02/2001 | US6296553 Grinding method, surface grinder, workpiece support, mechanism and work rest |
| 10/02/2001 | US6296551 Polishing apparatus and polishing method |
| 10/02/2001 | US6296550 Scalable multi-pad design for improved CMP process |
| 10/02/2001 | US6296548 Method and apparatus for optical monitoring in chemical mechanical polishing |
| 10/02/2001 | US6296547 Method and system for manufacturing a photocathode |
| 10/02/2001 | US6296546 Index table and drive mechanism for a chemical mechanical planarization machine |
| 09/27/2001 | WO2001071796A2 Method for electrochemical polishing of a conductive material |
| 09/27/2001 | WO2001070462A1 A method for chemical-mechanical-polishing a substrate |
| 09/27/2001 | WO2001070457A1 Grind polish cluster and double side polishing of substrates |
| 09/27/2001 | WO2001070454A1 Cluster tool systems and methods for processing wafers |
| 09/27/2001 | US20010024940 Polishing pads and methods relating thereto |
| 09/27/2001 | US20010024939 Wafer polishing apparatus |
| 09/27/2001 | US20010024938 Wafer polishing apparatus |
| 09/27/2001 | US20010024937 Polishing apparatus |
| 09/27/2001 | US20010024936 Wafer surface machining apparatus |
| 09/27/2001 | US20010024935 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 09/27/2001 | US20010024928 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
| 09/27/2001 | US20010024882 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024881 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024880 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/27/2001 | US20010024878 Flat soft magnetic powder with strain removed and binder which includes chlorinated polyethylene and a vinyl chloride resin; electromagnetic interference supression; reducing permeability of radiation noise |
| 09/27/2001 | US20010024877 Cluster tool systems and methods for processing wafers |
| 09/27/2001 | US20010024691 Semiconductor substrate processing apparatus and method |
| 09/27/2001 | DE10004331C1 Eccentric CD, CD-ROM or DVD polishing device has disc to be polished supported by inside surface of cover fitted to polishing liquid container with eccentric drive for polishing disc |
| 09/26/2001 | EP1136534A1 Hybrid polishing slurry |
| 09/26/2001 | EP1135236A1 Reverse linear polisher with loadable housing |
| 09/26/2001 | CN1314444A Mixed polishing paste |
| 09/25/2001 | US6294472 Dual slurry particle sizes for reducing microscratching of wafers |
| 09/25/2001 | US6294106 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles |
| 09/25/2001 | US6293858 Polishing device |
| 09/25/2001 | US6293855 Polishing apparatus |
| 09/25/2001 | US6293853 Conditioner apparatus for chemical mechanical polishing |
| 09/25/2001 | US6293852 Polishing pads and methods relating thereto |
| 09/25/2001 | US6293851 Fixed abrasive finishing method using lubricants |
| 09/25/2001 | US6293850 Chemical-mechanical polish machines and fabrication process using the same |
| 09/25/2001 | US6293849 Polishing solution supply system |
| 09/25/2001 | US6293847 Apparatus for chemical mechanical polishing endpoint detection using a hydrogen sensor |
| 09/25/2001 | US6293846 Polishing apparatus |
| 09/25/2001 | US6293845 System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current |
| 09/20/2001 | WO2001068322A1 Window portion with an adjusted rate of wear |
| 09/20/2001 | WO2001068321A1 Polishing head for wafer, and method for polishing |
| 09/20/2001 | US20010023167 Polishing apparatus |
| 09/20/2001 | US20010023166 Wafer carrier rinsing mechanism |
| 09/20/2001 | US20010023162 Slider processing apparatus, load applying apparatus and auxiliary device for processing slider |
| 09/20/2001 | US20010023117 Methods of treating surfaces of substrates |
| 09/20/2001 | US20010023079 Methods of treating surfaces of substrates |
| 09/20/2001 | US20010022214 Apparatus for processing semicondutor wafers |
| 09/19/2001 | EP1133380A2 A carrier head with edge control for chemical mechanical polishing |
| 09/19/2001 | EP1133378A2 Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| 09/19/2001 | CN1071172C Chemical mechanical polishing method and apparatus thereof |
| 09/19/2001 | CN1071171C Honing technology and equipment for cylinder sleeve of engine |
| 09/18/2001 | US6292265 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects |
| 09/18/2001 | US6291373 Thermosetting epoxy resin prepreg nonwoven fibers, impregnation |
| 09/18/2001 | US6291351 Endpoint detection in chemical-mechanical polishing of cloisonne structures |
| 09/18/2001 | US6291350 Method of polishing semiconductor wafer |
| 09/18/2001 | US6291349 Abrasive finishing with partial organic boundary layer |
| 09/18/2001 | US6291253 Feedback control of deposition thickness based on polish planarization |
| 09/18/2001 | US6290883 Method for making porous CMP article |
| 09/18/2001 | US6290808 Chemical mechanical polishing machine with ultrasonic vibration and method |
| 09/18/2001 | US6290736 In chemical mechanical polishing (cmp) in planarization of noble metals, and the formation of noble metal damascene electrode structures |
| 09/18/2001 | US6290589 Polishing pad with a partial adhesive coating |
| 09/18/2001 | US6290585 Polishing machine |
| 09/18/2001 | US6290584 Workpiece carrier with segmented and floating retaining elements |
| 09/18/2001 | US6290583 Apparatus for holding workpiece |
| 09/18/2001 | US6290580 Polishing method for silicon wafers which uses a polishing compound which reduces stains |