| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 10/30/2001 | US6309480 Cylinder liner comprising a supereutectic aluminum/silicon alloy for sealing into a crankcase of a reciprocating piston engine |
| 10/30/2001 | US6309434 Polishing composition and method for producing a memory hard disks |
| 10/30/2001 | US6309290 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| 10/30/2001 | US6309282 Variable abrasive polishing pad for mechanical and chemical-mechanical planarization |
| 10/30/2001 | US6309279 Arrangements for wafer polishing |
| 10/30/2001 | US6309277 System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning |
| 10/30/2001 | US6309276 Endpoint monitoring with polishing rate change |
| 10/30/2001 | CA2033360C Injection moldable plastic laps |
| 10/25/2001 | WO2001079377A1 Composition for use in polishing magnetic disk substrate and method for preparing the same |
| 10/25/2001 | WO2001078945A1 Method and apparatus for in-situ endpoint detection using electrical sensors |
| 10/25/2001 | US20010034199 Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer |
| 10/25/2001 | US20010034198 Polishing apparatus |
| 10/25/2001 | US20010034197 Polishing silicon wafers |
| 10/25/2001 | US20010034192 Apparatus, backing plate, backing film and method for chemical mechanical polishing |
| 10/25/2001 | US20010034191 Polishing method and polisher used in the method |
| 10/25/2001 | US20010034186 Polishing apparatus |
| 10/25/2001 | US20010034134 Cmp uniformity |
| 10/25/2001 | US20010033975 Transforming a pattern of multi-project mask to semiconductor wafer by photolithography, then chemical mechanical polishing and etching; dies are separated into dummy and main patterns by scribing lines, edges protected from damage |
| 10/25/2001 | DE10019680A1 Cooking plate for cooking system transmitting contact heat has surface microstructure rounded off microscopically in region of profiled points, especially in region of groove combs and/or pore edges. |
| 10/24/2001 | EP1148538A1 Cmp abrasive, liquid additive for cmp abrasive and method for polishing substrate |
| 10/24/2001 | EP1147855A2 Polishing carrier head |
| 10/24/2001 | EP1147546A1 Method to decrease dishing rate during cmp in metal semiconductor structures |
| 10/24/2001 | CN2455442Y Site finishing machine |
| 10/23/2001 | US6307628 Method and apparatus for CMP end point detection using confocal optics |
| 10/23/2001 | US6307397 Reduced voltage input/reduced voltage output repeaters for high capacitance signal lines and methods therefor |
| 10/23/2001 | US6306768 Method for planarizing microelectronic substrates having apertures |
| 10/23/2001 | US6306022 Chemical-mechanical polishing device |
| 10/23/2001 | US6306021 Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers |
| 10/23/2001 | US6306020 Multi-stage slurry system used for grinding and polishing materials |
| 10/23/2001 | US6306019 Method and apparatus for conditioning a polishing pad |
| 10/23/2001 | US6306014 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies |
| 10/23/2001 | US6306012 Methods and apparatuses for planarizing microelectronic substrate assemblies |
| 10/23/2001 | US6306009 System for real-time control of semiconductor wafer polishing |
| 10/23/2001 | US6306008 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 10/23/2001 | US6305062 Preventive maintenance apparatus for CMP top-ring's backing-film and the method thereof |
| 10/18/2001 | WO2001078125A1 Method for producing semiconductor wafer and semiconductor wafer |
| 10/18/2001 | WO2001078116A2 System for the preferential removal of silicon oxide |
| 10/18/2001 | WO2001076819A1 Integrated chemical-mechanical polishing |
| 10/18/2001 | WO2001076818A1 A polishing apparatus and a method of detecting an end point of polishing |
| 10/18/2001 | US20010031615 Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
| 10/18/2001 | US20010031612 Retention of a polishing pad on a platen |
| 10/18/2001 | US20010031610 Polishing pad with a transparent portion |
| 10/18/2001 | US20010031608 Apparatus for optical inspection of wafers during polishing |
| 10/18/2001 | US20010031558 Elimination of pad glazing for al cmp |
| 10/18/2001 | US20010031550 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 10/18/2001 | US20010030152 Compound mixer and filter for lapping machine |
| 10/18/2001 | DE10054166A1 Method of machine polishing of semiconductor wafers, involves rotatably embedding the carriers for the wafers in recesses of a base plate with the carriers and base plate turning about own axes |
| 10/17/2001 | EP1144527A2 Chemical mechanical polishing slurry and method for using same |
| 10/17/2001 | CN1072998C Polishing machine with improved polishing pad structure |
| 10/16/2001 | US6303507 In-situ feedback system for localized CMP thickness control |
| 10/16/2001 | US6303506 Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process |
| 10/16/2001 | US6303049 Chemical mechanical abrasive composition for use in semiconductor processing |
| 10/16/2001 | US6302772 Apparatus and method for dressing a wafer polishing pad |
| 10/16/2001 | US6302771 CMP pad conditioner arrangement and method therefor |
| 10/16/2001 | US6302770 In-situ pad conditioning for CMP polisher |
| 10/16/2001 | US6302768 Method for polishing surface of vapor-phase synthesized thin diamond film |
| 10/16/2001 | US6302767 Chemical mechanical polishing with a polishing sheet and a support sheet |
| 10/16/2001 | US6302766 System for cleaning a surface of a dielectric material |
| 10/16/2001 | US6302765 Process for mechanical chemical polishing of a layer in a copper-based material |
| 10/16/2001 | US6302762 Wafer polishing apparatus |
| 10/11/2001 | WO2001074959A2 Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 10/11/2001 | WO2001074958A2 Polishing agent and method for producing planar layers |
| 10/11/2001 | WO2001074537A1 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path |
| 10/11/2001 | WO2001074536A2 Carrier head providing uniform upward and downward force on a wafer |
| 10/11/2001 | WO2001074535A1 Fixed abrasive linear polishing belt and system using the same |
| 10/11/2001 | WO2001074534A2 A workpiece carrier with adjustable pressure zones and barriers |
| 10/11/2001 | WO2001074533A2 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers |
| 10/11/2001 | WO2001074532A1 Method of polishing wafers |
| 10/11/2001 | US20010029161 Polishing apparatus and method of manufacturing grinding plate |
| 10/11/2001 | US20010029158 Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head |
| 10/11/2001 | US20010029157 Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
| 10/11/2001 | US20010029156 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus |
| 10/11/2001 | US20010029155 Multi-step conditioning process |
| 10/11/2001 | US20010029154 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates |
| 10/11/2001 | US20010029151 Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
| 10/11/2001 | US20010029150 Polishing apparatus and method |
| 10/11/2001 | US20010028052 Light sensitive chemical-mechanical polishing aggregate |
| 10/11/2001 | US20010027798 Ozone as oxidizing agent |
| 10/11/2001 | DE10106678A1 Waferpoliervorrichtung Wafer polishing apparatus |
| 10/11/2001 | DE10106676A1 Waferpoliervorrichtung Wafer polishing apparatus |
| 10/10/2001 | EP1142672A1 Grinding slurry recycling apparatus |
| 10/10/2001 | EP1142003A1 Method for storing carrier for polishing wafer |
| 10/10/2001 | EP1141154A1 Polishing composition and method |
| 10/10/2001 | CN1316940A Polishing pad for semiconductor substrate |
| 10/10/2001 | CN1316939A Polishing pad for semiconductor substrate |
| 10/10/2001 | CN1316768A Control for supplying level of semiconductor chip polishing size |
| 10/10/2001 | CN1072699C 抛光剂 Polishes |
| 10/10/2001 | CN1072544C Lapping machine |
| 10/09/2001 | US6301009 In-situ metrology system and method |
| 10/09/2001 | US6301006 Endpoint detector and method for measuring a change in wafer thickness |
| 10/09/2001 | US6300248 On-chip pad conditioning for chemical mechanical polishing |
| 10/09/2001 | US6300247 Preconditioning polishing pads for chemical-mechanical polishing |
| 10/09/2001 | US6300246 Method for chemical mechanical polishing of semiconductor wafer |
| 10/09/2001 | US6299795 Polishing slurry |
| 10/09/2001 | US6299519 Apparatus and method for removing a polishing pad from a platen |
| 10/09/2001 | US6299516 Substrate polishing article |
| 10/09/2001 | US6299515 CMP apparatus with built-in slurry distribution and removal |
| 10/09/2001 | US6299514 Double-disk polishing machine, particularly for tooling semiconductor wafers |
| 10/09/2001 | US6299511 Chemical mechanical polishing conditioner |
| 10/09/2001 | US6299506 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using |