B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2001
11/15/2001	US20010041526 Carrier head with a flexible membrane for a chemical mechanical polishing system
11/15/2001	US20010041522 Fluid-pressure regulated wafer polishing head
11/15/2001	US20010041521 Adjustable and extended guide rings
11/15/2001	US20010041519 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
11/15/2001	US20010041518 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041517 High pressure cleaning
11/15/2001	US20010041516 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041515 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041511 Printing of polishing pads
11/15/2001	US20010041510 Grinding method, electronic component, and variable capacitor
11/15/2001	US20010041508 Method and apparatuses for planarizing microelectronic substrate assemblies
11/15/2001	US20010041506 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041505 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041504 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041503 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041501 System for real-time control of semiconductor wafer polishing
11/15/2001	US20010041319 Prcocessing jig
11/15/2001	US20010039946 Recycling system of wire saw abrasive grain slurry and centrifugal separators therefor
11/15/2001	DE10022649A1 Polishing liquid used for removing and/or structuring metal oxides, especially iridium oxide during chemical-mechanical polishing contains water, abrasive particles, and an additive selected from the group of phase-transfer catalysts
11/14/2001	EP1152865A1 Polishing pad and process for forming same
11/14/2001	CN1322374A Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
11/14/2001	CN1322185A Aluminium oxide particles
11/13/2001	US6316365 Chemical-mechanical polishing method
11/13/2001	US6316363 Deadhesion method and mechanism for wafer processing
11/13/2001	US6316276 Apparatus and method of planarizing a semiconductor wafer that includes a first reflective substance and a second reflective substance
11/13/2001	US6316100 Nickel powders, methods for producing powders and devices fabricated from same
11/13/2001	US6315917 Using ARL to decrease EPD noise in CMP process
11/13/2001	US6315857 Polishing pad shaping and patterning
11/13/2001	US6315803 Polishing composition and polishing process
11/13/2001	US6315651 Easy on/off cover for a pad conditioning assembly
11/13/2001	US6315645 Patterned polishing pad for use in chemical mechanical polishing of semiconductor wafers
11/13/2001	US6315644 Apparatus and process for supplying abrasives for use in the manufacture of semiconductors
11/13/2001	US6315643 Polishing apparatus and method
11/13/2001	US6315641 Method and apparatus for chemical mechanical polishing
11/13/2001	US6315637 Photoresist removal using a polishing tool
11/13/2001	US6315636 Lapping machine, row tool, and lapping method
11/13/2001	US6315635 Method and apparatus for slurry temperature control in a polishing process
11/13/2001	US6315634 Method of optimizing chemical mechanical planarization process
11/13/2001	US6315633 Processing jig
11/08/2001	WO2001084621A1 Rotation holding device and semiconductor substrate processing device
11/08/2001	WO2001084613A1 Method of modifying the surface of a semiconductor wafer
11/08/2001	WO2001083167A1 Polishing pad with a seam which is reinforced with caulking material
11/08/2001	WO2001061746A9 Test structure for metal cmp process control
11/08/2001	US20010039176 Polishing pad release liner system
11/08/2001	US20010039175 Polishing pad surface on hollow posts
11/08/2001	US20010039173 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
11/08/2001	US20010039172 Polishing apparatus
11/08/2001	US20010039171 In-situ pad conditoning apparatus for CMP polisher
11/08/2001	US20010039170 Low temperature chemical mechanical polishing of dielectric materials
11/08/2001	US20010039169 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
11/08/2001	US20010039168 Method of transporting a semiconductor wafer in a wafer polishing system
11/08/2001	US20010039167 Sample polishing apparatus and sample polishing method
11/08/2001	US20010039166 Dissolution of metal particles produced by polishing
11/08/2001	US20010039165 Apparatus and methods for substantial planarization of solder bumps
11/08/2001	US20010039164 Apparatus and methods for substantial planarization of solder bumps
11/08/2001	US20010039163 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization
11/08/2001	US20010039064 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
11/08/2001	US20010037863 Semiconductor die de-processing using a die holder and chemical mechanical polishing
11/08/2001	US20010037821 Integrated chemical-mechanical polishing
11/08/2001	CA2407300A1 Method of modifying the surface of a semiconductor wafer
11/07/2001	EP1151824A1 Apparatus for and method of polishing workpiece
11/06/2001	US6313663 Full swing voltage input/full swing output bi-directional repeaters for high resistance or high capacitance bi-directional signal lines and methods therefor
11/06/2001	US6313038 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
11/06/2001	US6312558 Method and apparatus for planarization of a substrate
11/06/2001	US6312487 Polishing compound and an edge polishing method thereby
11/06/2001	US6312324 Superabrasive tool and method of manufacturing the same
11/06/2001	US6312321 Polishing apparatus
11/06/2001	US6312319 Polishing media magazine for improved polishing
11/06/2001	US6312316 Chemical mechanical polishing apparatus and method
11/06/2001	US6312313 Non-linear transducer lay-out of thin film head wafer for fabrication of high camber and crown sliders
11/06/2001	US6312312 Polishing apparatus
11/01/2001	WO2001082356A2 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
11/01/2001	WO2001082354A1 Method of manufacturing semiconductor wafer
11/01/2001	WO2001081902A1 Apparatus and methods for detecting killer particles during chemical mechanical polishing
11/01/2001	WO2001081496A1 Polishing compound and method for preparation thereof, and polishing method
11/01/2001	WO2001081490A2 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
11/01/2001	WO2001081043A1 Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate and layer structure made thereby
11/01/2001	WO2001081042A1 Polishing method using a rehydrated dry particulate polishing composition
11/01/2001	US20010036805 Forming a transparent window in a polishing pad for a chemical mehcanical polishing apparatus
11/01/2001	US20010036804 CMP polishing pad including a solid catalyst
11/01/2001	US20010036799 Method of polishing silicon wafer
11/01/2001	US20010036798 Methods for chemical-mechanical polishing of semiconductor wafers
11/01/2001	US20010036797 Process for producing a semiconductor wafer
11/01/2001	US20010036796 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method
11/01/2001	US20010036795 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method
11/01/2001	US20010036793 Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
11/01/2001	US20010036792 Method and apparatus for polishing semiconductor wafers
11/01/2001	US20010036746 Methods of producing and polishing semiconductor device and polishing apparatus
11/01/2001	US20010036738 Semiconductor device manufacturing method
11/01/2001	US20010036676 Semiconductor wafer polishing endpoint detecting system and method therefor
11/01/2001	CA2406958A1 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
10/2001
10/31/2001	EP1150341A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
10/31/2001	EP1149410A1 Method of processing semiconductor wafers to build in back surface damage
10/31/2001	EP1148976A1 Method and apparatus for deposition on and polishing of a semiconductor surface
10/31/2001	CN1074035C Chemical mechanical polishing slurry for metal layers
10/31/2001	CN1073912C Improved polishing pads and methods for their use
10/31/2001	CN1073911C Apparatus for polishing dielectric layer formed on substrate
10/31/2001	CN1073909C Chemical mechanical polishing method suitable for highly accurate panarization
10/31/2001	CN1073907C Semiconductor wafer polishing apparatus and method
10/30/2001	US6309555 Method for determining thickness of material layer and chemical mechanical polishing endpoint

1 ... 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 ... 209