| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 12/11/2001 | US6328641 Method and apparatus for polishing an outer edge ring on a semiconductor wafer |
| 12/11/2001 | US6328637 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
| 12/11/2001 | US6328634 Finishing semiconductor wafer; provide pad, scruc semicomponent wafer with pad, evaluate surace of semiconductor |
| 12/11/2001 | US6328633 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method |
| 12/11/2001 | US6328632 Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
| 12/11/2001 | US6328629 Method and apparatus for polishing workpiece |
| 12/06/2001 | WO2001091975A1 Abrasive material |
| 12/06/2001 | WO2001091974A1 Method and apparatus for conditioning a polish pad and for dispensing slurry |
| 12/06/2001 | WO2001091973A1 Method and apparatus for dispensing slurry at the point of polish |
| 12/06/2001 | WO2001091972A1 Grooved polishing pads for chemical mechanical planarization |
| 12/06/2001 | WO2001091971A1 Polishing pads for chemical mechanical planarization |
| 12/06/2001 | WO2001091970A1 Method of polishing semiconductor wafers by using double-sided polisher |
| 12/06/2001 | WO2001091969A2 Polishing methods and apparatus for semiconductor and integrated circuit manufacture |
| 12/06/2001 | WO2001052307A3 Semiconductor workpiece proximity plating methods and apparatus |
| 12/06/2001 | US20010049259 Surface treatment |
| 12/06/2001 | US20010049254 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 12/06/2001 | US20010049251 Interface assembly for lapping control feedback |
| 12/06/2001 | US20010048874 Microelectronic workpiece support and apparatus using the support |
| 12/06/2001 | US20010048161 Fixed abrasive chemical-mechanical planarization of titanium nitride |
| 12/06/2001 | DE10124741A1 Slurry used for the chemical-mechanical polishing of semiconductor components comprises water, grinding grains and a polymer additive having hydrophilic as well as hydrophobic groups |
| 12/05/2001 | EP1160300A2 Aqueous dispersion for chemical mechanical polishing |
| 12/05/2001 | EP1159107A1 Method and apparatus for controlling abrasive flow machining |
| 12/05/2001 | EP0971810B1 Method and apparatus for polishing ophthalmic lenses |
| 12/05/2001 | EP0758941B1 Semiconductor wafer polishing apparatus and method |
| 12/05/2001 | CN2463115Y Regulating device for lapping and fixing stroking face of golf club head (wooden club head) (2) |
| 12/05/2001 | CN1324906A Polishing liquid for structurizing treatment of metal and metal oxide and method thereof |
| 12/05/2001 | CN1324709A Grinding method and grinding apparatus |
| 12/04/2001 | US6326309 Semiconductor device manufacturing method |
| 12/04/2001 | US6325709 Rounded surface for the pad conditioner using high temperature brazing |
| 12/04/2001 | US6325706 Use of zeta potential during chemical mechanical polishing for end point detection |
| 12/04/2001 | US6325703 Polishing pads and methods relating thereto |
| 12/04/2001 | US6325702 Method and apparatus for increasing chemical-mechanical-polishing selectivity |
| 12/04/2001 | US6325699 Lapping apparatus and lapping method |
| 12/04/2001 | US6325698 Cleaning method and polishing apparatus employing such cleaning method |
| 12/04/2001 | US6325696 Piezo-actuated CMP carrier |
| 11/29/2001 | WO2001089767A2 A chemical-mechanical polishing system for the manufacture of semiconductor devices |
| 11/29/2001 | WO2001089765A1 In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing |
| 11/29/2001 | WO2001089763A2 Multilayer retaining ring for chemical mechanical polishing |
| 11/29/2001 | US20010046835 Protective coatings for CMP conditioning disk |
| 11/29/2001 | US20010046834 Pad surface texture formed by solid phase droplets |
| 11/29/2001 | US20010046832 Apparatus and methods for substantial planarization of solder bumps |
| 11/29/2001 | US20010046831 Improved methods and apparatus for chemical mechanical planarization (cmp) of a semiconductor wafer |
| 11/29/2001 | US20010046774 Planarization system with multiple polishing pads |
| 11/29/2001 | DE10024874A1 Polierflüssigkeit und Verfahren zur Strukturierung von Metallen und Metalloxiden Polishing liquid and method for patterning of metals and metal oxides |
| 11/28/2001 | EP1157783A2 Polishing method and polishing apparatus |
| 11/28/2001 | EP1157782A2 Polishing apparatus |
| 11/28/2001 | EP1157409A1 Combination cmp-etch method for forming a thin planar layer over the surface of a device |
| 11/28/2001 | EP1156903A1 Apparatus for performing chemical-mechanical planarization |
| 11/28/2001 | CN1323864A 抛光组合物 The polishing composition |
| 11/28/2001 | CN1075422C Automatic wafer lapping system |
| 11/27/2001 | US6323046 Method and apparatus for endpointing a chemical-mechanical planarization process |
| 11/27/2001 | US6322429 Conditioner assembly and a conditioner back support for a chemical mechanical polishing apparatus |
| 11/27/2001 | US6322427 Conditioning fixed abrasive articles |
| 11/27/2001 | US6322425 Colloidal polishing of fused silica |
| 11/27/2001 | US6322422 Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same |
| 11/27/2001 | US6321947 Multiple dispensing valve closure with threaded attachment to a container and with a twist-open spout |
| 11/22/2001 | WO2001088970A1 Semiconductor wafer thinning method, and thin semiconductor wafer |
| 11/22/2001 | WO2001087541A2 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
| 11/22/2001 | US20010044271 Fixed abrasive polishing pad |
| 11/22/2001 | US20010044270 Polishing apparatus |
| 11/22/2001 | US20010044269 Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies |
| 11/22/2001 | US20010044268 Carrier head for a chemical mechanical polishing apparatus |
| 11/22/2001 | US20010044267 Lapping machine |
| 11/22/2001 | US20010044266 Polishing apparatus |
| 11/22/2001 | US20010044265 Method and apparatus for supplying chemical-mechanical polishing slurries |
| 11/22/2001 | US20010044264 Polishing composition |
| 11/22/2001 | US20010044263 Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| 11/22/2001 | US20010044262 Apparatus and methods for substantial planarization of solder bumps |
| 11/22/2001 | US20010044261 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| 11/22/2001 | US20010044260 CMP polishing slurry dewatering and reconstitution |
| 11/22/2001 | US20010044259 Ultra fine particle film forming method and apparatus |
| 11/22/2001 | US20010044258 Method for lapping and a lapping apparatus |
| 11/22/2001 | US20010044257 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 11/22/2001 | US20010044210 Fabrication method for semiconductor integrated circuit device |
| 11/22/2001 | US20010044209 Method for modification of polishing pattern dependence in chemical mechanical polishing |
| 11/22/2001 | US20010042853 Oxygen-containing, such as metal oxides, silicates, borates or titanates, small particle size, narrow particle size distribution; displays |
| 11/22/2001 | US20010042690 Method and apparatus for electroplating and electropolishing |
| 11/22/2001 | US20010042596 Method and apparatus for endpointing a chemical-mechanical planarization process |
| 11/21/2001 | EP1156091A1 Polishing liquid and process of structuring metals and metal oxides |
| 11/21/2001 | EP1155778A2 Polishing apparatus |
| 11/21/2001 | EP1155777A1 Work polishing method and work polishing device |
| 11/21/2001 | EP1155092A1 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles |
| 11/21/2001 | EP1154877A2 A polishing machine and method |
| 11/20/2001 | US6320266 Technique for reducing breakage of thinned flip-chip multi-layer integrated circuit devices |
| 11/20/2001 | US6319885 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
| 11/20/2001 | US6319420 Method and apparatus for electrically endpointing a chemical-mechanical planarization process |
| 11/20/2001 | US6319106 Wafer polishing apparatus |
| 11/20/2001 | US6319105 Polishing apparatus |
| 11/20/2001 | US6319103 Chemical mechanical polishing apparatus |
| 11/20/2001 | US6319100 Disk edge polishing machine and disk edge polishing system |
| 11/20/2001 | US6319099 Apparatus and method for feeding slurry |
| 11/20/2001 | US6319098 Method of post CMP defect stability improvement |
| 11/20/2001 | US6319096 Fumed metal oxide liquid carrier for generating uniformed, layered surfaces with minimal defects |
| 11/20/2001 | US6319095 Colloidal suspension of abrasive particles containing magnesium as CMP slurry |
| 11/20/2001 | US6319094 Method and apparatus for controlling abrasive flow machining |
| 11/20/2001 | US6319093 Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement |
| 11/15/2001 | WO2001085868A1 Polishing composition |
| 11/15/2001 | WO2001085392A2 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication |
| 11/15/2001 | WO2000058055A9 Method and apparatus for pad removal and replacement |
| 11/15/2001 | US20010041527 Disk for conditioning polishing pads |