| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 01/09/2002 | EP1169162A1 Method and apparatus for plating and polishing a semiconductor substrate |
| 01/09/2002 | EP0921904B1 Apparatus and method for polishing semiconductor devices |
| 01/09/2002 | CN1330797A Method of processing semiconductor wafers to build in back surfact demage |
| 01/09/2002 | CN1330581A 抛光垫及抛光装置 Polishing pad and polishing equipment |
| 01/09/2002 | CN1330360A Terminal test in chemical machinery polishing of cloisonnee structure |
| 01/09/2002 | CN1077483C Autmatic lapping method and lapping apparatus using the same |
| 01/08/2002 | US6337281 Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
| 01/08/2002 | US6337280 Polishing cloth and method of manufacturing semiconductor device using the same |
| 01/08/2002 | US6337271 Polishing simulation |
| 01/08/2002 | US6336945 Abrading a raw substrate, lapping, polishing; aliphatic organic and sulfate oxyalkylene alkyl ether sulfate; wear resistance |
| 01/08/2002 | US6336853 Carrier having pistons for distributing a pressing force on the back surface of a workpiece |
| 01/08/2002 | US6336851 Substrate belt polisher |
| 01/08/2002 | US6336850 Slurry dispenser and polishing apparatus |
| 01/08/2002 | US6336847 Method and apparatus for honing a chip saw |
| 01/08/2002 | US6336846 Chemical-mechanical polishing apparatus and method |
| 01/08/2002 | US6336845 Method and apparatus for polishing semiconductor wafers |
| 01/08/2002 | US6336841 Method of CMP endpoint detection |
| 01/03/2002 | WO2002001620A2 Two step chemical mechanical polishing process |
| 01/03/2002 | WO2002001618A1 Slurry recycling system and method for cmp apparatus |
| 01/03/2002 | WO2001041973A3 Chemical-mechanical polishing method |
| 01/03/2002 | US20020002031 Projected gimbal point drive |
| 01/03/2002 | US20020002029 Polishing method and apparatus |
| 01/03/2002 | US20020002028 Polishing method and polishing apparatus |
| 01/03/2002 | US20020002027 Eliminating air pockets under a polishing pad |
| 01/03/2002 | US20020002026 Finishing element with finishing aids |
| 01/03/2002 | US20020001956 Method for supplying slurry to a semiconductor processing machine |
| 01/03/2002 | US20020001862 Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| 01/03/2002 | US20020001671 Multilayer structure; metallic layer, dielectric, resistor and connector |
| 01/03/2002 | US20020000322 Flow completion system |
| 01/03/2002 | US20020000315 Flow completion apparatus |
| 01/03/2002 | US20020000251 Multi-channel rotary joint |
| 01/03/2002 | DE10108542A1 Production of a wafer used in the production of integrated components comprises polishing the wafer, treating with an oxidant, cleaning, rinsing and drying, inspecting one polished side of the wafer |
| 01/02/2002 | EP1167482A2 Aqueous dispersion for chemical mechanical polishing used for polishing of copper |
| 01/02/2002 | EP1165288A1 A method and apparatus for stabilizing the process temperature during chemical mechanical polishing |
| 01/02/2002 | EP1165287A1 Apparatus and process for reconditioning polishing pads |
| 01/02/2002 | CN1329681A Method and apparatus for electrochemical mechanical deposition |
| 01/02/2002 | CN1329533A Reverse linear polisher with loadable housing |
| 01/02/2002 | CN1329118A Polishing composition and polishing method |
| 01/02/2002 | CN1328921A Printing plate support for lithographic printing and producing method thereof |
| 01/02/2002 | CN1077310C Automatic lapping method of thin film element and lapping apparatus using the same |
| 01/02/2002 | CN1077003C Lapping apparatus |
| 01/01/2002 | US6335286 Feedback control of polish buff time as a function of scratch count |
| 01/01/2002 | US6334810 Chemical mechanical polishing apparatus and method of using the same |
| 01/01/2002 | US6334807 Chemical mechanical polishing in-situ end point system |
| 12/27/2001 | WO2001098201A2 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system |
| 12/27/2001 | WO2001098028A1 Polishing pad |
| 12/27/2001 | WO2000062977A9 Method of conditioning wafer polishing pads |
| 12/27/2001 | US20010055942 Polishing method using a reconstituted dry particulate polishing composition |
| 12/27/2001 | US20010055941 Method of chemical mechanical polishing |
| 12/27/2001 | US20010055940 Control of CMP removal rate uniformity by selective control of slurry temperature |
| 12/27/2001 | US20010055939 Polishing pad with a partial adhesive coating |
| 12/27/2001 | US20010055937 Cleaning method and polishing apparatus employing such cleaning method |
| 12/27/2001 | US20010055936 Methods and apparatuses for planarizing microelectronic substrate assemblies |
| 12/26/2001 | CN2467262Y Special grinding device for sealing parts |
| 12/25/2001 | US6332835 Polishing apparatus with transfer arm for moving polished object without drying it |
| 12/25/2001 | US6332833 Method for fabricating silicon semiconductor discrete wafer |
| 12/25/2001 | US6332832 CMP polish pad and CMP processing apparatus using the same |
| 12/25/2001 | US6332830 Polishing method and polishing device |
| 12/25/2001 | US6332826 Polishing apparatus |
| 12/21/2001 | WO2001098027A1 A multi-zone grinding and/or polishing sheet |
| 12/20/2001 | WO2001096068A1 Device and method for measuring amount of grinding in magnetic head producing process |
| 12/20/2001 | WO2001096065A1 Method for polishing work |
| 12/20/2001 | WO2001096063A1 Magnetic head grinding device and method |
| 12/20/2001 | US20010053665 Polishing head of a chemical and mechanical polishing apparatus |
| 12/20/2001 | US20010053663 Polishing apparatus |
| 12/20/2001 | US20010053662 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 12/20/2001 | US20010053660 Methods for break-in and conditioning a fixed abrasive polishing pad |
| 12/20/2001 | US20010053658 Window portion with an adjusted rate of wear |
| 12/20/2001 | US20010053657 Apparatus and methods fo substantial planarization of solder bumps |
| 12/20/2001 | US20010053606 Light sensitive chemical-mechanical polishing method |
| 12/20/2001 | US20010052589 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 12/20/2001 | US20010052159 Rotating belt wafer edge cleaning apparatus |
| 12/19/2001 | EP1164559A1 Composition for polishing pad and polishing pad using the same |
| 12/19/2001 | CN1076249C Method and apparatus for shaping polishing pads |
| 12/19/2001 | CN1076248C Lapping apparatus |
| 12/18/2001 | US6331139 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates |
| 12/18/2001 | US6331137 Polishing pad having open area which varies with distance from initial pad surface |
| 12/18/2001 | US6331136 CMP pad conditioner arrangement and method therefor |
| 12/18/2001 | US6331135 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
| 12/13/2001 | WO2001094076A1 Chemical-hydrodynamic etch planarization |
| 12/13/2001 | WO2001094075A1 Orbital polishing apparatus |
| 12/13/2001 | WO2001094074A1 Polishing pad window for a chemical-mechanical polishing tool |
| 12/13/2001 | WO2001056032A3 Reduced voltage input/reduced voltage output repeaters for high resistance or high capacitance signal lines and methods therefor |
| 12/13/2001 | WO2000000560A3 Chemical mechanical polishing slurry and method for using same |
| 12/13/2001 | WO1999062671A9 Apparatus for polishing silicon wafers |
| 12/13/2001 | US20010051500 Polishing apparatus |
| 12/13/2001 | US20010051497 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
| 12/13/2001 | US20010051496 Methods and apparatuses for planarizing microelectronic substrate assemblies |
| 12/13/2001 | US20010051495 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies |
| 12/13/2001 | US20010051492 Method and apparatus for detecting wafer slipouts |
| 12/13/2001 | US20010051491 Multipoint bending apparatus for lapping heads of a data storage device |
| 12/13/2001 | US20010051433 Chemical mechanical polishing using cesium hydroxide |
| 12/13/2001 | US20010050268 Polishing pad of a polyurethane of propane diol |
| 12/13/2001 | US20010050142 Chemical-mechanical polishing apparatus with megasonic energy slurry supply system |
| 12/13/2001 | US20010049913 Mixture of abravive grains and oxidizer |
| 12/13/2001 | US20010049912 Prevention scratches |
| 12/12/2001 | EP1162081A2 Lithographic printing plate support and method of manufacturing the same |
| 12/12/2001 | EP1161322A1 Improved polishing pads and methods relating thereto |
| 12/11/2001 | US6328872 Method and apparatus for plating and polishing a semiconductor substrate |
| 12/11/2001 | US6328642 Integrated pad and belt for chemical mechanical polishing |