| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/05/2002 | US6343978 Method and apparatus for polishing workpiece |
| 02/05/2002 | US6343977 Multi-zone conditioner for chemical mechanical polishing system |
| 02/05/2002 | US6343976 Abrasive, method of polishing wafer, and method of producing semiconductor device |
| 02/05/2002 | US6343974 Real-time method for profiling and conditioning chemical-mechanical polishing pads |
| 02/05/2002 | US6343973 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| 01/31/2002 | WO2002009165A1 Work polishing method |
| 01/31/2002 | WO2002007931A2 Multi-chamber carrier head with a flexible membrane |
| 01/31/2002 | WO2001074533A3 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers |
| 01/31/2002 | WO2001072473A3 Carrier head with controllable edge pressure |
| 01/31/2002 | US20020013124 Polishing apparatus |
| 01/31/2002 | US20020013120 Method and apparatus for optical monitoring in chemical mechanical polishing |
| 01/31/2002 | US20020013058 In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| 01/31/2002 | US20020013007 Semiconductor wafer polishing end point detection method and apparatus |
| 01/31/2002 | US20020011417 Method and apparatus for plating and polishing a semiconductor substrate |
| 01/31/2002 | US20020011168 Lithographic printing plate support and method of manufacturing the same |
| 01/31/2002 | US20020011079 Process for producing glass substrate for information recording media, the glass substrate, and information recording device |
| 01/31/2002 | US20020011031 Inorganic abrasive and organic particles with anionic group, wherein the removal rate for silicon oxide film is at least 5 times the removal rate for silicon nitride film; used for a shallow trench isolation in semiconductor manufacturing |
| 01/31/2002 | DE10046893A1 Double-sided polishing involves flattening upper and lower polishing pads using plates with grinding bodies or grinding paper at least once after pads are stuck to polishing plates |
| 01/31/2002 | DE10036690A1 Double-sided polishing method for semiconductor wafers by simultaneously polishing at least twelve wafers |
| 01/30/2002 | EP1176631A1 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device |
| 01/30/2002 | EP1176630A1 Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device |
| 01/30/2002 | EP1175965A2 Polishing tool, manufacturing method therefor, polishing apparatus for polishing a semiconductor wafer and method of polishing a substrate |
| 01/30/2002 | EP1175964A2 Polishing surface temperature conditioning system for a chemical mechanical planarization process |
| 01/30/2002 | CN1333319A Slurry for chemical-mechanical polishing and forming method, semiconductor device making method |
| 01/29/2002 | US6342166 Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing |
| 01/29/2002 | US6341998 Integrated circuit (IC) plating deposition system and method |
| 01/29/2002 | US6341997 Method for recycling a polishing pad conditioning disk |
| 01/29/2002 | US6341995 Chemical mechanical polishing apparatus |
| 01/24/2002 | WO2002007154A2 Process and apparatus for finishing a magnetic slider |
| 01/24/2002 | WO2002006418A1 Polishing fluid composition |
| 01/24/2002 | US20020010232 Water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. |
| 01/24/2002 | US20020009959 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
| 01/24/2002 | US20020009958 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks |
| 01/24/2002 | US20020009955 Oxidizing polishing slurries for low dielectric constant materials |
| 01/24/2002 | US20020009954 Polishing apparatus |
| 01/24/2002 | US20020009953 Control of CMP removal rate uniformity by selective heating of pad area |
| 01/24/2002 | US20020009952 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies |
| 01/24/2002 | US20020009949 Process and apparatus for finishing a magnetic slider |
| 01/24/2002 | US20020009887 Insitu oxidation for polishing non-oxide ceramics |
| 01/24/2002 | US20020009886 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates |
| 01/24/2002 | US20020009825 Deadhesion method and mechanism for wafer processing |
| 01/24/2002 | US20020007913 Endpoint stabilization for polishing process |
| 01/23/2002 | EP1174912A1 Semiconductor wafer processing apparatus and processing method |
| 01/23/2002 | EP1174483A1 Polishing composition, manufacturing thereof and polishing method |
| 01/23/2002 | EP1174215A1 Lapping surface patterning system |
| 01/23/2002 | CN1332060A Abrading substances holding material and manufacturing method thereof |
| 01/22/2002 | US6340558 Polishing method and fabrication method of thin film magnetic head |
| 01/22/2002 | US6340434 Method and apparatus for chemical-mechanical polishing |
| 01/22/2002 | US6340327 Wafer polishing apparatus and process |
| 01/22/2002 | US6340326 System and method for controlled polishing and planarization of semiconductor wafers |
| 01/22/2002 | US6340325 Polishing pad grooving method and apparatus |
| 01/17/2002 | WO2002004573A2 Ready-to-use stable chemical-mechanical polishing slurries |
| 01/17/2002 | WO2002004172A2 Carrier head with flexible membranes to control the applied load and the dimension of the loading area |
| 01/17/2002 | WO2002004171A1 Method and apparatus for heating a polishing block |
| 01/17/2002 | WO2001056743B1 Interface assembly for lapping control feedback |
| 01/17/2002 | US20020006876 For disk shapes |
| 01/17/2002 | US20020006773 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
| 01/17/2002 | US20020006772 Polishing apparatus |
| 01/17/2002 | US20020006770 Removable/disposable platen top |
| 01/17/2002 | US20020006768 Polishing method using an abrading plate |
| 01/17/2002 | US20020006767 Ion exchange pad or brush and method of regenerating the same |
| 01/17/2002 | US20020006728 Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process |
| 01/17/2002 | US20020005957 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects |
| 01/17/2002 | US20020005504 Ta barrier slurry containing an organic additive |
| 01/17/2002 | US20020005017 Aqueous dispersion for chemical mechanical polishing |
| 01/17/2002 | DE10132368A1 Wafer-Poliervorrichtung The wafer polishing apparatus |
| 01/16/2002 | EP1171264A1 Method of conditioning wafer polishing pads |
| 01/16/2002 | CN1331838A Method for storing carrier for polishing wafer |
| 01/16/2002 | CN1331837A Combination CMP-etch method for forming thin planar layer over surface of device |
| 01/16/2002 | CN1331733A Slurries of abrasive inorganic oxide particles and method for adjusting abrasiveness of particles |
| 01/16/2002 | CN1077827C Lapping appts. lapping jig for use therein and workpiece mounting member attached to lapping jig |
| 01/15/2002 | US6338809 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 01/15/2002 | US6338744 Dispersion of silica particles in water, particle size of 50 to 300 nm and a refractive index of 1.41 to 1.44. synthesized in a liquid phase and produced without passing through a drying step; high scratch resistance |
| 01/15/2002 | US6338671 Apparatus for supplying polishing liquid |
| 01/15/2002 | US6338669 Polishing device |
| 01/15/2002 | US6338668 In-line chemical mechanical polish (CMP) planarizing method employing interpolation and extrapolation |
| 01/15/2002 | US6338667 System for real-time control of semiconductor wafer polishing |
| 01/10/2002 | WO2002002712A1 Polishing composition and magnetic recording disk substrate polished with the polishing composition |
| 01/10/2002 | WO2002002707A1 Silane containing polishing composition for cmp |
| 01/10/2002 | WO2002002706A1 Polishing composition for metal cmp |
| 01/10/2002 | WO2002002279A2 Grooved polishing pads and methods of use |
| 01/10/2002 | WO2002002277A2 A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers |
| 01/10/2002 | WO2002002276A2 Projected gimbal point drive |
| 01/10/2002 | WO2002002275A1 Wafer carrier with groove for decoupling retainer ring from wafer |
| 01/10/2002 | WO2002002274A2 Base-pad for a polishing pad |
| 01/10/2002 | WO2002002273A2 Carrier head with reduced moment wear ring |
| 01/10/2002 | WO2002002272A1 Oscillating fixed abrasive cmp system and methods for implementing the same |
| 01/10/2002 | WO2002002269A1 Polishing pad grooving method and apparatus |
| 01/10/2002 | US20020004365 Polishing pad for semiconductor and optical parts, and method for manufacturing the same |
| 01/10/2002 | US20020004361 Wafer polishing apparatus |
| 01/10/2002 | US20020004360 Polishing slurry |
| 01/10/2002 | US20020004358 Cluster tool systems and methods to eliminate wafer waviness during grinding |
| 01/10/2002 | US20020004357 Self-leveling pads and methods relating thereto |
| 01/10/2002 | US20020004306 Coaxial dressing for chemical mechanical polishing |
| 01/10/2002 | US20020003225 Slurry includes abrasive particles have a small particle size, narrow size distribution and a spherical morphology, and the particles are substantially unagglomerated, selected from silica, alumina, zirconia, ceria etc. and mixture |
| 01/10/2002 | US20020002798 CMP polishing slurry dewatering and reconstitution |
| 01/10/2002 | CA2413803A1 Polishing pad grooving method and apparatus |
| 01/09/2002 | EP1170090A1 Apparatus for and method of polishing workpiece |
| 01/09/2002 | EP1170089A1 Polishing apparatus |
| 01/09/2002 | EP1169671A1 Device and method for detecting a workpiece in an automatic processing device |