| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 02/28/2002 | WO2002016080A2 Substrate supporting carrier pad |
| 02/28/2002 | WO2002016079A1 Cmp device and production method for semiconductor device |
| 02/28/2002 | WO2002016075A2 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer |
| 02/28/2002 | WO2001074958A3 Polishing agent and method for producing planar layers |
| 02/28/2002 | US20020025769 Substrate supporting carrier pad |
| 02/28/2002 | US20020025764 Polishing apparatus |
| 02/28/2002 | US20020025761 Chemical mechanical polishing machine and chemical mechanical polishing method |
| 02/28/2002 | US20020023719 A buffing assembly, at least one buff pad, a slurry delivery system containing a slurry which is chemically reactive to the barrier layer, and an endpoint detection system (infra red, or optical or laser or motor current detection systems) |
| 02/28/2002 | US20020023715 Substrate polishing apparatus and substrate polishing mehod |
| 02/28/2002 | US20020023340 Method of separating a plate-like workpiece adsorption-held on an elastic adsorption pad |
| 02/27/2002 | EP1182242A1 Polishing composition and polishing method employing it |
| 02/27/2002 | EP1181134A1 Method and system for cleaning a chemical mechanical polishing pad |
| 02/27/2002 | CN2478728Y Optical disk lapping machine |
| 02/27/2002 | CN1337898A Fluid dispensing fixed abrasive polishing pad |
| 02/26/2002 | US6350691 Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media |
| 02/26/2002 | US6350393 Use of CsOH in a dielectric CMP slurry |
| 02/26/2002 | US6350346 Apparatus for polishing workpiece |
| 02/26/2002 | US6350188 Drive system for a carrier head support structure |
| 02/26/2002 | US6350186 Apparatus and method for chemical mechanical polishing |
| 02/26/2002 | US6350183 High pressure cleaning |
| 02/26/2002 | US6350180 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 02/26/2002 | US6350179 Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer |
| 02/26/2002 | US6350177 Combined CMP and wafer cleaning apparatus and associated methods |
| 02/26/2002 | US6350176 High quality optically polished aluminum mirror and process for producing |
| 02/21/2002 | WO2002015261A2 Bathless wafer measurement apparatus and method |
| 02/21/2002 | WO2002015247A2 Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| 02/21/2002 | WO2002015246A1 Method of polishing semiconductor wafer |
| 02/21/2002 | WO2002015237A2 Changing local compressibility of a wafer support member |
| 02/21/2002 | WO2002014018A2 Abrasive pad for cmp |
| 02/21/2002 | WO2002014015A1 Retaining ring for chemical-mechanical polishing head, polishing apparatus, slurry cycle system, and method |
| 02/21/2002 | WO2002014014A2 Chemical mechanical planarization of metal substrates |
| 02/21/2002 | WO2001078116A3 System for the preferential removal of silicon oxide |
| 02/21/2002 | WO2001061746A3 Test structure for metal cmp process control |
| 02/21/2002 | US20020022441 Slurry supply apparatus and method |
| 02/21/2002 | US20020022440 Supply of controlled amount of polishing slurry to semiconductor wafers |
| 02/21/2002 | US20020022439 Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers |
| 02/21/2002 | US20020022438 Polishing method and polishing apparatus |
| 02/21/2002 | US20020022082 Changing local compressibility of a wafer support member |
| 02/21/2002 | US20020020833 Oxidizing reactant selected from ammonium persulfate, hydrogen peroxide, nitric acid, co-reactant selected from phosphoric acid, sulfuric acid, nitric acid, oxalic acid, acetic acid, organic acids, additives |
| 02/21/2002 | US20020020714 Precision liquid mixing apparatus and method |
| 02/21/2002 | US20020020690 Dewatered CMP polishing compostions and methods for using same |
| 02/21/2002 | US20020020621 Semiconductor workpiece proximity plating apparatus |
| 02/21/2002 | US20020020495 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 02/21/2002 | CA2416549A1 Abrasive pad for cmp |
| 02/20/2002 | CN1336861A Improved polishing pads and methods relating thereto |
| 02/19/2002 | US6347983 ELG for both MRE sensor height and resistance monitoring |
| 02/19/2002 | US6347979 Slurry dispensing carrier ring |
| 02/19/2002 | US6347978 Composition and method for polishing rigid disks |
| 02/19/2002 | US6347977 Method and system for chemical mechanical polishing |
| 02/19/2002 | US6347975 Apparatus and method for processing thin-film magnetic head material |
| 02/19/2002 | US6347974 Automated polishing methods |
| 02/14/2002 | WO2002013248A1 Chemical-mechanical polishing apparatus, polishing pad, and method for manufacturing semiconductor device |
| 02/14/2002 | WO2002013237A2 Method and apparatus for a wafer carrier having an insert |
| 02/14/2002 | WO2002011947A2 Method for processing a semiconductor wafer using double-side polishing |
| 02/14/2002 | US20020019204 Precise polishing apparatus and method |
| 02/14/2002 | US20020019198 Polishing method and apparatus, and device fabrication method |
| 02/14/2002 | US20020019197 Method and apparatus for controlling pH during planarization and cleaning of microelectronic substrates |
| 02/14/2002 | US20020019196 Wafer for cleaning semiconductor device probe |
| 02/14/2002 | US20020019135 Method for reducing dishing effects during a chemical mechanical polishing process |
| 02/14/2002 | US20020019067 Method and apparatus for endpointing a chemical-mechanical planarization process |
| 02/14/2002 | US20020018848 Multilayer polishing pad for microelectronics |
| 02/14/2002 | US20020017365 Substrate holding apparatus and substrate polishing apparatus |
| 02/14/2002 | US20020017063 Polycrystalline diamond powder and at least one additive of: oxidizing agents, complex-forming agents, surfactants and organic bases; planarizing precious metals for use as electrode and barrier material in intergrated circuits |
| 02/14/2002 | DE10137862A1 Method to load double-sided polishing machine for polishing silicon wafers |
| 02/13/2002 | EP1179578A2 Polishing composition and method |
| 02/13/2002 | EP1178872A1 Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
| 02/13/2002 | CN1335799A A polishing machine and method |
| 02/13/2002 | CN1079179C Method for producing piezoelectric ceramic vibrator |
| 02/12/2002 | US6346202 Finishing with partial organic boundary layer |
| 02/12/2002 | US6346038 Wafer loading/unloading device and method for producing wafers |
| 02/12/2002 | US6346037 Wafer polishing machine |
| 02/12/2002 | US6346032 Fluid dispensing fixed abrasive polishing pad |
| 02/07/2002 | WO2002010729A1 In-situ method and apparatus for end point detection in chemical mechanical polishing |
| 02/07/2002 | WO2002009907A1 Method of chemical mechanical polishing |
| 02/07/2002 | WO2002009906A1 Apparatus and method for chemical mechanical polishing of substrates |
| 02/07/2002 | WO2001074536A3 Carrier head providing uniform upward and downward force on a wafer |
| 02/07/2002 | WO2001074534A3 A workpiece carrier with adjustable pressure zones and barriers |
| 02/07/2002 | US20020016275 Aqueous dispersion for chemical mechanical polishing used for polishing of copper |
| 02/07/2002 | US20020016146 Abrasive molding and abrasive disc provided with same |
| 02/07/2002 | US20020016145 Polishing pad and method for manufacturing the same |
| 02/07/2002 | US20020016139 Polishing tool and manufacturing method therefor |
| 02/07/2002 | US20020016138 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies |
| 02/07/2002 | US20020016136 Conditioner for polishing pads |
| 02/07/2002 | US20020016131 System for real-time control of semiconductor wafer polishing |
| 02/07/2002 | US20020016074 Apparatus and method for polishing substrate |
| 02/07/2002 | US20020016073 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 02/07/2002 | US20020016072 Method of manufacturing semiconductor wafer |
| 02/07/2002 | US20020016066 Method and apparatus for detecting polishing endpoint with optical monitoring |
| 02/07/2002 | US20020014448 Grinding slurry recycling apparatus |
| 02/07/2002 | US20020014310 Method and apparatus for endpointing a chemical-mechanical planarization process |
| 02/07/2002 | US20020014309 Abrasive molding and abrasive disc provided with same |
| 02/06/2002 | EP1177859A2 Substrate holding apparatus and substrate polishing apparatus |
| 02/06/2002 | EP1177858A1 Fixed-abrasive belt polisher |
| 02/06/2002 | EP1177068A1 Improved chemical mechanical polishing slurries for metal |
| 02/06/2002 | CN2475511Y Grinder for carbon brush of motor |
| 02/06/2002 | CN1334961A Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same |
| 02/06/2002 | CN1334849A Oxidizing polishing slurries for low dielectric constant materials |
| 02/06/2002 | CN1078836C Polishing apparatus |
| 02/05/2002 | US6344414 Chemical-mechanical polishing system having a bi-material wafer backing film assembly |
| 02/05/2002 | US6343979 Modular machine for polishing and planing substrates |