Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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03/21/2002 | WO2001098201A3 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system |
03/21/2002 | US20020034928 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
03/21/2002 | US20020034925 Process for fabricating a semiconductor device |
03/21/2002 | US20020034922 System for real-time control of semiconductor wafer polishing |
03/21/2002 | US20020034876 Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion and chemical mechanical polishing equipment used in the same |
03/21/2002 | US20020034875 For manufacturing semiconductor device |
03/21/2002 | US20020034122 Conductivity feedback control system for slurry blending |
03/21/2002 | US20020033230 Cold forming of thin walls into bowed out sections by reverse extrusion to form deep grooves; increase the "pull- out" resistance by increasing the "footprint" of the deformed sections; for attaching screws through walls or sheets |
03/21/2002 | US20020032989 Prewashing; slurrying in water |
03/21/2002 | US20020032987 Chemical mechanical polishing slurry and method for using same |
03/20/2002 | EP1189266A1 Production method for silicon wafer and soi wafer, and soi wafer |
03/20/2002 | EP1188807A2 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing |
03/20/2002 | EP1188518A2 Use of acoustic spectral analysis for monitoring/control of CMP processes |
03/20/2002 | EP1188516A1 Method and apparatus for polishing outer peripheral chamfered part of wafer |
03/20/2002 | CN1341277A Apparatus for plating semiconductor substrate, method for plating semiconductor substrate |
03/20/2002 | CN1341049A Polishing pad and process for forming same |
03/20/2002 | CN1340583A Polishing composition and polishing method for its use |
03/20/2002 | CN1340404A Method for processing laminated article pressing plate |
03/19/2002 | US6359471 Mixed swing voltage repeaters for high resistance or high capacitance signal lines and methods therefor |
03/19/2002 | US6358850 Slurry-less chemical-mechanical polishing of oxide materials |
03/19/2002 | US6358816 Method for uniform polish in microelectronic device |
03/19/2002 | US6358132 Apparatus for grinding spherical objects |
03/19/2002 | US6358131 Polishing apparatus |
03/19/2002 | US6358130 Polishing pad |
03/19/2002 | US6358129 Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members |
03/19/2002 | US6358128 Polishing apparatus |
03/19/2002 | US6358127 Method and apparatus for planarizing and cleaning microelectronic substrates |
03/19/2002 | US6358126 Polishing apparatus |
03/19/2002 | US6358125 Polishing liquid supply apparatus |
03/19/2002 | US6358124 Pad conditioner cleaning apparatus |
03/19/2002 | US6358122 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
03/19/2002 | US6358121 Carrier head with a flexible membrane and an edge load ring |
03/19/2002 | US6358119 Way to remove CU line damage after CU CMP |
03/19/2002 | US6358118 Field controlled polishing apparatus and method |
03/19/2002 | US6358116 Thrown wafer failsafe system for chemical/mechanical planarization |
03/19/2002 | US6358114 Method and apparatus for optical polishing |
03/19/2002 | US6357071 Rotating belt wafer edge cleaning apparatus |
03/19/2002 | CA2245498C Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers |
03/14/2002 | WO2002021581A2 Method for uniform polish microelectronic device |
03/14/2002 | WO2002020868A1 Method for producing a coating of fluorescent material |
03/14/2002 | WO2002020214A2 Method for polishing a memory or rigid disk with a polishing composition containing an oxidized halide and an acid |
03/14/2002 | WO2001071796A3 Method for electrochemical polishing of a conductive material |
03/14/2002 | US20020031990 Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers |
03/14/2002 | US20020031988 System and method for creating and navigating a linear hypermedia resource program |
03/14/2002 | US20020031985 Chemical mechanical polishing composition and process |
03/14/2002 | US20020031984 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
03/14/2002 | US20020031981 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
03/14/2002 | US20020031979 Method of polishing a magnetic head slider |
03/14/2002 | US20020031848 Method of determining the time for polishing the surface of an integrated circuit wafer |
03/13/2002 | CN1340210A Method and system for polishing semiconductor wafers |
03/13/2002 | CN1339346A Griding method for thin stone slab |
03/13/2002 | CN1080620C Chemical and mechanical grinding bench |
03/13/2002 | CN1080619C Chemical and mechanical grinding bench |
03/12/2002 | US6355184 Method of eliminating agglomerate particles in a polishing slurry |
03/12/2002 | US6355075 Polishing composition |
03/12/2002 | US6354930 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
03/12/2002 | US6354928 Polishing apparatus with carrier ring and carrier head employing like polarities |
03/12/2002 | US6354927 Micro-adjustable wafer retaining apparatus |
03/12/2002 | US6354925 Composite polishing pad |
03/12/2002 | US6354923 Apparatus for planarizing microelectronic substrates and conditioning planarizing media |
03/12/2002 | US6354922 Polishing apparatus |
03/12/2002 | US6354921 System for cross stream regassifier for improved chemical mechanical polishing in the manufacture of semiconductors |
03/12/2002 | US6354919 Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
03/12/2002 | US6354917 Method of processing a wafer utilizing a processing slurry |
03/12/2002 | US6354916 Modified plating solution for plating and planarization and process utilizing same |
03/12/2002 | US6354915 Hydrophilic polishing material; sufficiently thin to generally improve predictability and polishing performance. polishing surface comprising a plurality of nanoasperities |
03/12/2002 | US6354914 Wafer polishing apparatus |
03/12/2002 | US6354913 Abrasive and method for polishing semiconductor substrate |
03/12/2002 | US6354910 Apparatus and method for in-situ measurement of polishing pad thickness loss |
03/12/2002 | US6354908 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system |
03/12/2002 | US6354907 Polishing apparatus including attitude controller for turntable and/or wafer carrier |
03/07/2002 | WO2002019405A1 Polishing device |
03/07/2002 | WO2002019393A2 Method of processing a semiconductor wafer |
03/07/2002 | WO2002018101A2 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby |
03/07/2002 | WO2002018100A2 Method and apparatus for measuring a polishing condition |
03/07/2002 | WO2002018099A2 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
03/07/2002 | WO2001089763A3 Multilayer retaining ring for chemical mechanical polishing |
03/07/2002 | WO2001056031A3 Full swing voltage input/full swing voltage output bi-directional repeaters for high resistance or high capacitance bi-directional signal lines and methods therefor |
03/07/2002 | US20020028646 Chemical mechanical planarization or polishing pad with sections having varied groove patterns |
03/07/2002 | US20020028639 Aqueous solution for colloidal polishing of silicate substrates |
03/07/2002 | US20020028638 Method and apparatus for planarizing a microelectronic substrated with a tilted planarizing surface |
03/07/2002 | US20020028637 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface |
03/07/2002 | US20020028636 Polishing composition |
03/07/2002 | US20020028635 Utility wafer for chemical mechanical polishing |
03/07/2002 | US20020028632 Polishing composition and manufacturing and polishing methods |
03/07/2002 | US20020028581 Polishing with grindstone in liquid dispersant |
03/07/2002 | US20020027398 Method for manufacturing thin plate, piezoelectric plate, and piezoelectric vibrator |
03/07/2002 | DE10132433A1 Semiconductor wafer treatment method, involves removing deposits from periphery and rear-face of semiconductor wafer during each optional step in treatment processes |
03/06/2002 | EP1184480A2 Polishing of press plates coated with titanium diboride |
03/06/2002 | EP1183132A1 Stacked polishing pad having sealed edge |
03/06/2002 | CN1338353A Technology for machine conic sleeve barrel |
03/06/2002 | CN1080166C Method of and apparatus for polishing wafer |
03/06/2002 | CN1080164C Method and apparatus for optical polishing |
03/05/2002 | US6352595 Method and system for cleaning a chemical mechanical polishing pad |
03/05/2002 | US6352470 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates |
03/05/2002 | US6352469 Polishing apparatus with slurry screening |
03/05/2002 | US6352468 Lapping method and method for manufacturing lapping particles for use in the lapping method |
03/01/2002 | CA2354790A1 Polishing of press plates coated with titanium diboride |
02/28/2002 | WO2002017411A1 Polishing apparatus comprising pad and polishing method using the same |
02/28/2002 | WO2002017381A2 Method for preventing damage to wafers in a sequential multiple steps polishing process |