Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
03/2002
03/21/2002WO2001098201A3 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
03/21/2002US20020034928 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
03/21/2002US20020034925 Process for fabricating a semiconductor device
03/21/2002US20020034922 System for real-time control of semiconductor wafer polishing
03/21/2002US20020034876 Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion and chemical mechanical polishing equipment used in the same
03/21/2002US20020034875 For manufacturing semiconductor device
03/21/2002US20020034122 Conductivity feedback control system for slurry blending
03/21/2002US20020033230 Cold forming of thin walls into bowed out sections by reverse extrusion to form deep grooves; increase the "pull- out" resistance by increasing the "footprint" of the deformed sections; for attaching screws through walls or sheets
03/21/2002US20020032989 Prewashing; slurrying in water
03/21/2002US20020032987 Chemical mechanical polishing slurry and method for using same
03/20/2002EP1189266A1 Production method for silicon wafer and soi wafer, and soi wafer
03/20/2002EP1188807A2 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing
03/20/2002EP1188518A2 Use of acoustic spectral analysis for monitoring/control of CMP processes
03/20/2002EP1188516A1 Method and apparatus for polishing outer peripheral chamfered part of wafer
03/20/2002CN1341277A Apparatus for plating semiconductor substrate, method for plating semiconductor substrate
03/20/2002CN1341049A Polishing pad and process for forming same
03/20/2002CN1340583A Polishing composition and polishing method for its use
03/20/2002CN1340404A Method for processing laminated article pressing plate
03/19/2002US6359471 Mixed swing voltage repeaters for high resistance or high capacitance signal lines and methods therefor
03/19/2002US6358850 Slurry-less chemical-mechanical polishing of oxide materials
03/19/2002US6358816 Method for uniform polish in microelectronic device
03/19/2002US6358132 Apparatus for grinding spherical objects
03/19/2002US6358131 Polishing apparatus
03/19/2002US6358130 Polishing pad
03/19/2002US6358129 Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members
03/19/2002US6358128 Polishing apparatus
03/19/2002US6358127 Method and apparatus for planarizing and cleaning microelectronic substrates
03/19/2002US6358126 Polishing apparatus
03/19/2002US6358125 Polishing liquid supply apparatus
03/19/2002US6358124 Pad conditioner cleaning apparatus
03/19/2002US6358122 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
03/19/2002US6358121 Carrier head with a flexible membrane and an edge load ring
03/19/2002US6358119 Way to remove CU line damage after CU CMP
03/19/2002US6358118 Field controlled polishing apparatus and method
03/19/2002US6358116 Thrown wafer failsafe system for chemical/mechanical planarization
03/19/2002US6358114 Method and apparatus for optical polishing
03/19/2002US6357071 Rotating belt wafer edge cleaning apparatus
03/19/2002CA2245498C Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
03/14/2002WO2002021581A2 Method for uniform polish microelectronic device
03/14/2002WO2002020868A1 Method for producing a coating of fluorescent material
03/14/2002WO2002020214A2 Method for polishing a memory or rigid disk with a polishing composition containing an oxidized halide and an acid
03/14/2002WO2001071796A3 Method for electrochemical polishing of a conductive material
03/14/2002US20020031990 Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers
03/14/2002US20020031988 System and method for creating and navigating a linear hypermedia resource program
03/14/2002US20020031985 Chemical mechanical polishing composition and process
03/14/2002US20020031984 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
03/14/2002US20020031981 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
03/14/2002US20020031979 Method of polishing a magnetic head slider
03/14/2002US20020031848 Method of determining the time for polishing the surface of an integrated circuit wafer
03/13/2002CN1340210A Method and system for polishing semiconductor wafers
03/13/2002CN1339346A Griding method for thin stone slab
03/13/2002CN1080620C Chemical and mechanical grinding bench
03/13/2002CN1080619C Chemical and mechanical grinding bench
03/12/2002US6355184 Method of eliminating agglomerate particles in a polishing slurry
03/12/2002US6355075 Polishing composition
03/12/2002US6354930 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
03/12/2002US6354928 Polishing apparatus with carrier ring and carrier head employing like polarities
03/12/2002US6354927 Micro-adjustable wafer retaining apparatus
03/12/2002US6354925 Composite polishing pad
03/12/2002US6354923 Apparatus for planarizing microelectronic substrates and conditioning planarizing media
03/12/2002US6354922 Polishing apparatus
03/12/2002US6354921 System for cross stream regassifier for improved chemical mechanical polishing in the manufacture of semiconductors
03/12/2002US6354919 Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
03/12/2002US6354917 Method of processing a wafer utilizing a processing slurry
03/12/2002US6354916 Modified plating solution for plating and planarization and process utilizing same
03/12/2002US6354915 Hydrophilic polishing material; sufficiently thin to generally improve predictability and polishing performance. polishing surface comprising a plurality of nanoasperities
03/12/2002US6354914 Wafer polishing apparatus
03/12/2002US6354913 Abrasive and method for polishing semiconductor substrate
03/12/2002US6354910 Apparatus and method for in-situ measurement of polishing pad thickness loss
03/12/2002US6354908 Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system
03/12/2002US6354907 Polishing apparatus including attitude controller for turntable and/or wafer carrier
03/07/2002WO2002019405A1 Polishing device
03/07/2002WO2002019393A2 Method of processing a semiconductor wafer
03/07/2002WO2002018101A2 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
03/07/2002WO2002018100A2 Method and apparatus for measuring a polishing condition
03/07/2002WO2002018099A2 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
03/07/2002WO2001089763A3 Multilayer retaining ring for chemical mechanical polishing
03/07/2002WO2001056031A3 Full swing voltage input/full swing voltage output bi-directional repeaters for high resistance or high capacitance bi-directional signal lines and methods therefor
03/07/2002US20020028646 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
03/07/2002US20020028639 Aqueous solution for colloidal polishing of silicate substrates
03/07/2002US20020028638 Method and apparatus for planarizing a microelectronic substrated with a tilted planarizing surface
03/07/2002US20020028637 Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
03/07/2002US20020028636 Polishing composition
03/07/2002US20020028635 Utility wafer for chemical mechanical polishing
03/07/2002US20020028632 Polishing composition and manufacturing and polishing methods
03/07/2002US20020028581 Polishing with grindstone in liquid dispersant
03/07/2002US20020027398 Method for manufacturing thin plate, piezoelectric plate, and piezoelectric vibrator
03/07/2002DE10132433A1 Semiconductor wafer treatment method, involves removing deposits from periphery and rear-face of semiconductor wafer during each optional step in treatment processes
03/06/2002EP1184480A2 Polishing of press plates coated with titanium diboride
03/06/2002EP1183132A1 Stacked polishing pad having sealed edge
03/06/2002CN1338353A Technology for machine conic sleeve barrel
03/06/2002CN1080166C Method of and apparatus for polishing wafer
03/06/2002CN1080164C Method and apparatus for optical polishing
03/05/2002US6352595 Method and system for cleaning a chemical mechanical polishing pad
03/05/2002US6352470 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
03/05/2002US6352469 Polishing apparatus with slurry screening
03/05/2002US6352468 Lapping method and method for manufacturing lapping particles for use in the lapping method
03/01/2002CA2354790A1 Polishing of press plates coated with titanium diboride
02/2002
02/28/2002WO2002017411A1 Polishing apparatus comprising pad and polishing method using the same
02/28/2002WO2002017381A2 Method for preventing damage to wafers in a sequential multiple steps polishing process