| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 04/11/2002 | US20020042246 Substrate holding apparatus |
| 04/11/2002 | US20020042243 Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method |
| 04/11/2002 | US20020042208 Aqueous mixture containing phase transfer agents |
| 04/11/2002 | US20020042200 Using multilayer polymer pad |
| 04/11/2002 | US20020042199 Removal metal layer overcoating semiconductor; mixture containing oxidation inhibitor; reduce removal of metal in rcesses |
| 04/11/2002 | CA2328274A1 Controllably monitoring and reducing a material |
| 04/10/2002 | EP1195798A1 Method for producing semiconductor wafer and semiconductor wafer |
| 04/10/2002 | EP0703847B1 Magnetorheological polishing devices and methods |
| 04/10/2002 | CN1343752A Brightener compsn. |
| 04/10/2002 | CN1343751A Brightener compsn. |
| 04/10/2002 | CN1343750A Brightener compsn. |
| 04/10/2002 | CN1343550A Grinding method and appts. and grinding carrier used by grinding method and appts. |
| 04/09/2002 | US6368981 Method of manufacturing semiconductor device and chemical mechanical polishing apparatus |
| 04/09/2002 | US6368968 Ditch type floating ring for chemical mechanical polishing |
| 04/09/2002 | US6368200 Polishing pads from closed-cell elastomer foam |
| 04/09/2002 | US6368197 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates |
| 04/09/2002 | US6368194 Apparatus for controlling PH during planarization and cleaning of microelectronic substrates |
| 04/09/2002 | US6368193 Method and apparatus for planarizing and cleaning microelectronic substrates |
| 04/09/2002 | US6368191 Carrier head with local pressure control for a chemical mechanical polishing apparatus |
| 04/09/2002 | US6368190 Electrochemical mechanical planarization apparatus and method |
| 04/09/2002 | US6368189 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| 04/09/2002 | US6368186 Apparatus for mounting a rotational disk |
| 04/09/2002 | US6368184 Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes |
| 04/09/2002 | US6368182 Apparatus for optical inspection of wafers during polishing |
| 04/09/2002 | US6368181 Apparatus for optical inspection of wafers during polishing |
| 04/09/2002 | US6367486 Ethylenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal process |
| 04/04/2002 | WO2002026445A1 Polishing pad with built-in optical sensor |
| 04/04/2002 | WO2002026444A1 Wafer carrier for cmp system |
| 04/04/2002 | WO2002026441A1 Tool for applying resilient tape to chuck used for grinding or polishing wafers |
| 04/04/2002 | WO2000071971A9 Optical techniques for measuring layer thicknesses |
| 04/04/2002 | US20020039880 Polishing apparatus |
| 04/04/2002 | US20020039879 Carrier head with flexible membranes to provide controllable pressure and loading area |
| 04/04/2002 | US20020039878 Apparatus and method for feeding slurry |
| 04/04/2002 | US20020039877 Method and system for cleaning a chemical mechanical polishing pad |
| 04/04/2002 | US20020039875 Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor |
| 04/04/2002 | US20020039874 Temperature endpointing of chemical mechanical polishing |
| 04/04/2002 | DE10044425A1 Verfahren zur Herstellung einer Leuchstoffschicht A process for preparing a phosphor layer |
| 04/03/2002 | EP1193032A2 Polishing apparatus and polishing method |
| 04/03/2002 | EP1192022A1 Apparatus and method for the restoration of optical storage media |
| 04/02/2002 | USRE37622 Wafer polishing method and apparatus |
| 04/02/2002 | US6365522 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles |
| 04/02/2002 | US6364919 Constant pressure in dispersion chambers prevents macro particles would lead to scratching |
| 04/02/2002 | US6364757 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 04/02/2002 | US6364749 CMP polishing pad with hydrophilic surfaces for enhanced wetting |
| 04/02/2002 | US6364746 Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic-substrate assemblies |
| 04/02/2002 | US6364745 Mapping system for semiconductor wafer cassettes |
| 04/02/2002 | US6364744 CMP system and slurry for polishing semiconductor wafers and related method |
| 04/02/2002 | US6364743 Composite lapping monitor resistor |
| 04/02/2002 | US6363599 Method for manufacturing a magnetic disk including a glass substrate |
| 03/28/2002 | WO2002024415A1 Polishing pad having an advantageous micro-texture |
| 03/28/2002 | WO2002024413A2 Polishing by cmp for optimized planarization |
| 03/28/2002 | WO2002024410A1 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner |
| 03/28/2002 | WO2002024409A1 Polishing apparatus with electromagnetical attitude controller for the polishing pad carrier |
| 03/28/2002 | WO2001087541A3 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same |
| 03/28/2002 | WO2001081490A3 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces |
| 03/28/2002 | WO2001060242A3 Test structure for metal cmp process control |
| 03/28/2002 | US20020037695 Scored polishing pad and methods relating thereto |
| 03/28/2002 | US20020037693 Workpiece carrier retaining element |
| 03/28/2002 | US20020037685 Polishing apparatus and polishing method |
| 03/28/2002 | US20020037684 Dry chemical-mechanical polishing method |
| 03/28/2002 | US20020037682 Polishing or grinding method, processing method of optical element, processing method of fluorite, polishing or grinding apparatus, polishing and/or grinding apparatus for optical element, apparatus for processing surface of optical element, and lens |
| 03/28/2002 | US20020037681 Method and apparatus for controlled polishing |
| 03/28/2002 | US20020037680 Polishing apparatus and method with constant polishing pressure |
| 03/28/2002 | US20020037649 Method for carrying out planarization processing |
| 03/28/2002 | US20020037642 Process for forming a metal interconnect |
| 03/28/2002 | US20020037628 Method for uniform polish in microelectronic device |
| 03/28/2002 | US20020036505 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 03/28/2002 | US20020036182 Flattening fine roughness existing on a side face of a silicon block or a silicon stack used for manufacturing the silicon wafer. |
| 03/27/2002 | EP1190006A1 Slurry composition and method of chemical mechanical polishing using same |
| 03/27/2002 | EP1189730A1 Abrasive processing apparatus and method employing encoded abrasive product |
| 03/27/2002 | EP1189729A1 Method of modifying a surface of a structured wafer |
| 03/26/2002 | US6362108 Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant |
| 03/26/2002 | US6362107 Polishing pad and polishing device |
| 03/26/2002 | US6362105 Method and apparatus for endpointing planarization of a microelectronic substrate |
| 03/26/2002 | US6362104 Chemical mechanical polishing of a metal e.g titanium, aluminum, by using an oxidizer, photoactive solid catalyst, comprising a mixture of titanium dioxide and titanium trioxide, water and a pad. |
| 03/26/2002 | US6362103 Method and apparatus for rejuvenating a CMP chemical solution |
| 03/26/2002 | US6361832 Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines |
| 03/26/2002 | US6361648 Wafer transfer station for a chemical mechanical polisher |
| 03/26/2002 | US6361647 Method and apparatus for chemical mechanical polishing |
| 03/26/2002 | US6361646 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 03/26/2002 | US6361422 Method and apparatus for transferring semiconductor substrates using an input module |
| 03/26/2002 | US6361420 Method of chemical mechanical polishing with edge control |
| 03/26/2002 | US6361419 Carrier head with controllable edge pressure |
| 03/26/2002 | US6361418 Abrasive system |
| 03/26/2002 | US6361417 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates |
| 03/26/2002 | US6361414 Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process |
| 03/26/2002 | US6361413 Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic device substrate assemblies |
| 03/26/2002 | US6361411 Method for conditioning polishing surface |
| 03/26/2002 | US6361409 Polymeric polishing pad having improved surface layer and method of making same |
| 03/26/2002 | US6361406 Abrasion method of semiconductor device |
| 03/26/2002 | US6361405 Utility wafer for chemical mechanical polishing |
| 03/26/2002 | US6361403 Abrasive member, abrasive disc provided with same, and polishing process |
| 03/26/2002 | US6361402 Method for planarizing photoresist |
| 03/26/2002 | US6361400 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization |
| 03/26/2002 | US6361399 Slider processing apparatus, load applying apparatus and auxiliary device for processing slider |
| 03/26/2002 | US6361202 Static mixer for a viscous liquid |
| 03/26/2002 | US6360562 Methods for producing glass powders |
| 03/21/2002 | WO2002023613A2 Metal cmp process with reduced dishing |
| 03/21/2002 | WO2002022309A1 Polishing pad comprising particulate polymer and crosslinked polymer binder |
| 03/21/2002 | WO2002022308A1 Polishing sheet and method |