| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 05/02/2002 | US20020052172 Lapping machine, lapping method, and method of manufacturing magnetic head |
| 05/02/2002 | US20020052171 Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet |
| 05/02/2002 | US20020052169 Systems and methods to significantly reduce the grinding marks in surface grinding of semiconductor wafers |
| 05/02/2002 | US20020052164 Lapping machine, lapping method, and row tool |
| 05/02/2002 | US20020052116 Free Floating double side polishing of substrates |
| 05/02/2002 | US20020052115 Method of eliminating agglomerate particles in a polishing slurry |
| 05/02/2002 | US20020052064 Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| 05/02/2002 | US20020052052 Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers |
| 05/02/2002 | US20020051135 Apparatus for optical inspection of wafers during polishing |
| 05/02/2002 | EP1201368A2 Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof |
| 05/02/2002 | EP1201365A2 Frequency measuring device, polishing device using the same and eddy current sensor |
| 05/02/2002 | EP1200532A1 Cmp composition containing silane modified abrasive particles |
| 05/02/2002 | EP1200352A1 Improved ceria powder |
| 05/02/2002 | DE10062926A1 Machine for one sided surface machining by grinding, polishing or lapping at least one workpiece which has frame housing relevant machine tool using at least one workpiece holder |
| 05/01/2002 | CN1083754C Apparatus and method for polishing flat surface using belted polishing pad |
| 04/30/2002 | US6380086 High-speed planarizing apparatus for chemical-mechanical planarization of semiconductor wafers |
| 04/30/2002 | US6379538 Apparatus for separation and recovery of liquid and slurry abrasives used for polishing |
| 04/30/2002 | US6379406 Water polish mixture, abrasive particles of metal oxide for ions |
| 04/30/2002 | US6379235 Wafer support for chemical mechanical planarization |
| 04/30/2002 | US6379231 Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
| 04/30/2002 | US6379229 Polishing apparatus |
| 04/30/2002 | US6379228 Polishing machine having a plurality of abrasive pads |
| 04/30/2002 | US6379226 Method for storing carrier for polishing wafer |
| 04/30/2002 | US6379225 Planarization process with abrasive polishing slurry that is selective to a planarized surface |
| 04/30/2002 | US6379223 Method and apparatus for electrochemical-mechanical planarization |
| 04/30/2002 | US6379222 Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer |
| 04/30/2002 | US6379221 Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system |
| 04/30/2002 | US6379219 Chemical mechanical polishing machine and chemical mechanical polishing method |
| 04/30/2002 | US6379216 Rotary chemical-mechanical polishing apparatus employing multiple fluid-bearing platens for semiconductor fabrication |
| 04/25/2002 | WO2002033737A2 Multiprobe detection system for chemical-mechanical planarization tool |
| 04/25/2002 | WO2002033736A1 Chemical-mechanical polishing slurry and method |
| 04/25/2002 | WO2002033023A1 Slurry for chemical-mechanical polishing copper damascene structures |
| 04/25/2002 | WO2002032625A2 Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
| 04/25/2002 | WO2002032624A1 Segmented wafer polishing pad |
| 04/25/2002 | US20020049033 Polishing pad comprising a filled translucent region |
| 04/25/2002 | US20020049030 Wafer polishing device |
| 04/25/2002 | US20020049029 System and method for chemical mechanical polishing |
| 04/25/2002 | US20020049027 Fixed abrasive polishing pad |
| 04/25/2002 | US20020049025 Method of abrading silicon substrate |
| 04/25/2002 | US20020048958 Cleaning exposed surfaces of said conductive film and said barrier film; washing using a rinsing liquid; polishing until a portion of said insulator film is exposed; and washing exposed surfaces |
| 04/25/2002 | US20020048214 Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration |
| 04/25/2002 | US20020047705 Frequency measuring device, polishing device using the same and eddy current sensor |
| 04/25/2002 | US20020046435 Polishing cloth and method of manufacturing semiconductor device using the same |
| 04/25/2002 | DE10139086A1 Verfahren zum Trennen eines plattenartigen Werkstückes, welches durch Adsorption an einem elastischen Adsorptionskissen gehalten wird A method of separating a plate-like workpiece which is held by adsorption on a sorbent elastic |
| 04/24/2002 | EP1199135A1 Work holding panel for polishing, and device and method for polishing |
| 04/24/2002 | EP0930955B1 Polishing pad contour indicator for mechanical or chemical-mechanical planarization |
| 04/24/2002 | CN2487499Y General grinder capable of grinding multiple air valves at the same time |
| 04/24/2002 | CN1346300A Modular controlled platen preparation system and method |
| 04/24/2002 | CN1083618C New Chemical mechanical polishing process for layers of isolating material based on silicon derivatives or silicon |
| 04/23/2002 | US6376378 Polishing apparatus and method for forming an integrated circuit |
| 04/23/2002 | US6375791 Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer |
| 04/23/2002 | US6375693 Chemical-mechanical planarization of barriers or liners for copper metallurgy |
| 04/23/2002 | US6375559 Polishing system having a multi-phase polishing substrate and methods relating thereto |
| 04/23/2002 | US6375553 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks |
| 04/23/2002 | US6375551 Angstrom polishing of calcium fluoride optical VUV microlithography lens elements and preforms |
| 04/23/2002 | US6375550 Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer |
| 04/23/2002 | US6375549 Polishing head for wafer, and method for polishing |
| 04/23/2002 | US6375548 Chemical-mechanical polishing methods |
| 04/23/2002 | US6375544 System and method for reducing surface defects integrated in circuits |
| 04/23/2002 | US6375541 Polishing fluid polishing method semiconductor device and semiconductor device fabrication method |
| 04/23/2002 | US6375540 End-point detection system for chemical mechanical posing applications |
| 04/23/2002 | US6375539 Lapping machine, lapping method, and row tool |
| 04/23/2002 | CA2248910C Dispensing system and method for dispensing an aqueous solution |
| 04/18/2002 | WO2002031874A1 Abrasive cloth, polishing device and method for manufacturing semiconductor device |
| 04/18/2002 | WO2002031866A2 Infrared end-point system for cmp |
| 04/18/2002 | WO2002031231A1 Semiconductor production device and production method for semiconductor device |
| 04/18/2002 | WO2002031079A1 Abrasive material |
| 04/18/2002 | WO2002031072A1 Cmp slurry composition and a method for planarizing semiconductor device using the same |
| 04/18/2002 | WO2002030618A1 Activated slurry cmp system and methods for implementing the same |
| 04/18/2002 | WO2002030617A1 Polishing pad comprising a filled translucent region |
| 04/18/2002 | WO2001064391A3 Planarization system with a wafer transfer corridor and multiple polishing modules |
| 04/18/2002 | US20020045413 Substrate cleaning apparatus and substrate polishing apparatus with substrate cleaning apparatus |
| 04/18/2002 | US20020045412 Method for supplying slurry to polishing apparatus |
| 04/18/2002 | US20020045410 Polishing apparatus |
| 04/18/2002 | US20020045409 Method and apparatus for planarizing and cleaning microelectronic substrates |
| 04/18/2002 | US20020045407 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
| 04/18/2002 | US20020045406 Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet |
| 04/18/2002 | US20020045405 Method of forming ink fill slot of ink-jet printhead |
| 04/18/2002 | US20020045349 Method for chemical-mechanical-polishing a substrate |
| 04/18/2002 | US20020045348 Semiconductor wafer treating method and device for removing deposit on a semiconductor wafer |
| 04/18/2002 | US20020043027 Preventing formation of pits in copper wiring in chemical mechanical polishing of substrates for semiconductors, photomasks and memory hard disks |
| 04/18/2002 | DE10046933A1 Process for the chemical-mechanical polishing of silicon wafers comprises rotating a silicon surface to be cleaned on a polishing plate covered with a polishing cloth with continuous |
| 04/17/2002 | EP1197296A2 Pad conditioning disk |
| 04/17/2002 | EP1197293A1 Polishing device and method |
| 04/17/2002 | EP1197292A2 Substrate holding apparatus |
| 04/17/2002 | CN1345264A Polishing body, polisher, plishing method and method for producing semiconductor device |
| 04/17/2002 | CN1083154C Grinding method, and method for manufacturing semiconductor device and device for making semiconductor |
| 04/17/2002 | CN1082867C Device for grinding bar carrying a few slides |
| 04/17/2002 | CN1082866C Wafer polishing apparatus and plishing method |
| 04/16/2002 | US6372111 Chemical mechanical planarization |
| 04/16/2002 | US6371836 Groove cleaning device for chemical-mechanical polishing |
| 04/16/2002 | US6370763 Manufacturing method for magnetic heads |
| 04/11/2002 | WO2002029859A2 Method and apparatus for electrochemical planarization of a workpiece |
| 04/11/2002 | WO2002028979A1 Cerium based abrasive material and method for producing cerium based abrasive material |
| 04/11/2002 | WO2002028598A1 Method for conditioning polishing pads |
| 04/11/2002 | WO2002028597A1 Method and apparatus for electrochemical planarization of a workpiece |
| 04/11/2002 | WO2002028596A1 Web-style pad conditioning system and methods for implementing the same |
| 04/11/2002 | WO2002028595A1 Polishing apparatus and method with a refreshing polishing belt and loadable housing |
| 04/11/2002 | WO2002015237A3 Changing local compressibility of a wafer support member |
| 04/11/2002 | WO2002002274A3 Base-pad for a polishing pad |