| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 05/30/2002 | US20020063860 Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus |
| 05/29/2002 | EP1209731A1 Polishing composition and polishing method employing it |
| 05/29/2002 | EP1209727A1 Process for polishing the surface of a silicon wafer |
| 05/29/2002 | EP1207981A1 Spindle assembly for force controlled polishing |
| 05/29/2002 | DE19932829C2 Zweistufiges chemisch-mechanisches Polierverfahren Two-stage chemical mechanical polishing method |
| 05/29/2002 | CN1351531A Method and apparatus for plating and polishing a semiconductor substrate |
| 05/29/2002 | CN1351530A Method and apparatus for deposition on and polishing of a semiconductor surface |
| 05/28/2002 | US6395130 Hydrophobic optical endpoint light pipes for chemical mechanical polishing |
| 05/28/2002 | US6394886 Conformal disk holder for CMP pad conditioner |
| 05/28/2002 | US6394883 Method and apparatus for planarizing and cleaning microelectronic substrates |
| 05/23/2002 | WO2002041369A2 Electropolishing and chemical mechanical planarization |
| 05/23/2002 | WO2002014018A3 Abrasive pad for cmp |
| 05/23/2002 | WO2002001620A3 Two step chemical mechanical polishing process |
| 05/23/2002 | WO2001091969A3 Polishing methods and apparatus for semiconductor and integrated circuit manufacture |
| 05/23/2002 | WO2001046684A9 In-situ metalization monitoring using eddy current measurements and optical measurements |
| 05/23/2002 | US20020061722 Apparatus for producing polishing solution and apparatus for feeding the same |
| 05/23/2002 | US20020061720 Carrier head with controllable pressure and loading area for chemical mechanical polishing |
| 05/23/2002 | US20020061716 Workpiece carrier with adjustable pressure zones and barriers |
| 05/23/2002 | US20020061715 Modified plating solution for plating and planarization and process utilizing same |
| 05/23/2002 | US20020061714 Semiconductor processing methods of removing conductive material |
| 05/23/2002 | US20020061713 End-point detection system for chemical mechanical polishing applications |
| 05/23/2002 | US20020061651 Polishing agent, method of producing same, and method of polishing |
| 05/22/2002 | EP1112147B1 Support for temporary fixation of a self-sticking abrasive and/or polishing sheet |
| 05/22/2002 | CN2492341Y Positioning support for portable valve grinder |
| 05/21/2002 | US6390910 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 05/21/2002 | US6390909 Disk for conditioning polishing pads |
| 05/21/2002 | US6390908 Determining when to replace a retaining ring used in substrate polishing operations |
| 05/21/2002 | US6390905 Workpiece carrier with adjustable pressure zones and barriers |
| 05/21/2002 | US6390904 Retainers and non-abrasive liners used in chemical mechanical polishing |
| 05/21/2002 | US6390903 Precise polishing apparatus and method |
| 05/21/2002 | US6390902 Multi-conditioner arrangement of a CMP system |
| 05/21/2002 | US6390901 Polishing apparatus |
| 05/21/2002 | US6390897 Cleaning station integral with polishing machine for semiconductor wafers |
| 05/21/2002 | US6390895 Wetting abrasive; prepolishing |
| 05/21/2002 | US6390891 Method and apparatus for improved stability chemical mechanical polishing |
| 05/21/2002 | US6390890 Using abrasive mixture of resin and particles |
| 05/16/2002 | WO2002039485A2 Platen for retaining polishing material |
| 05/16/2002 | WO2002038336A1 A method and apparatus for controlled polishing |
| 05/16/2002 | WO2002038335A1 Methods, apparatus and slurries for chemical mechanical planarization |
| 05/16/2002 | WO2002018100A3 Method and apparatus for measuring a polishing condition |
| 05/16/2002 | WO2002002277A3 A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers |
| 05/16/2002 | US20020058469 Polishing pad having an advantageous micro-texture and methods relating thereto |
| 05/16/2002 | US20020058468 Semiconductor polishing pad |
| 05/16/2002 | US20020058466 Method and system for reducing thickness of spin-on glass on semiconductor wafers |
| 05/16/2002 | US20020058465 Method of abrading both faces of work piece |
| 05/16/2002 | US20020058464 Fixed abrasive polishing pad |
| 05/16/2002 | US20020058461 Method and apparatus for polishing |
| 05/16/2002 | US20020058426 Controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range |
| 05/16/2002 | US20020058418 Treatment of substrates |
| 05/16/2002 | US20020056548 Heat exchanger |
| 05/16/2002 | DE10147761A1 Verfahren zur Herstellen von Siliciumwafern Method for producing silicon wafers |
| 05/16/2002 | DE10054159A1 Verfahren zur Montage von Halbleiterscheiben Method for mounting semiconductor wafers |
| 05/15/2002 | EP1205968A2 Process for reclaiming Si wafers |
| 05/15/2002 | EP1205965A1 Abrasive compound for cmp, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive compound |
| 05/15/2002 | EP1205280A1 Wafer polishing method and wafer polishing device |
| 05/15/2002 | EP1001863B1 Method for producing a valve seat body for a fuel injection valve, and corresponding fuel injection valve |
| 05/15/2002 | EP0966338B1 Integrated pad and belt for chemical mechanical polishing |
| 05/15/2002 | CN1349446A Method of conditioning wafer polishing pads |
| 05/14/2002 | US6387812 Ultrasonic processing of chemical mechanical polishing slurries |
| 05/14/2002 | US6387809 A small amount of single-side lapping is repeated alternately on the two surfaces of a semiconductor silicon single crystal wafer to get to a predetermined total lapping stock removal |
| 05/14/2002 | US6387312 Molding a polishing pad having integral window |
| 05/14/2002 | US6387289 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 05/14/2002 | US6387190 Multistages; removal polishing particles, then purification |
| 05/14/2002 | US6387188 Pad conditioning for copper-based semiconductor wafers |
| 05/14/2002 | US6387139 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry |
| 05/14/2002 | US6386963 Conditioning disk for conditioning a polishing pad |
| 05/14/2002 | US6386962 Wafer carrier with groove for decoupling retainer ring from water |
| 05/14/2002 | US6386960 Chemical-mechanical polishing method and apparatus |
| 05/14/2002 | US6386957 Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus |
| 05/14/2002 | US6386956 Flattening polishing device and flattening polishing method |
| 05/14/2002 | US6386955 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 05/14/2002 | US6386950 Process for mechanical chemical polishing of layer of aluminium or aluminium alloy conducting material |
| 05/14/2002 | US6386947 Method and apparatus for detecting wafer slipouts |
| 05/14/2002 | US6386946 Repair machine for compact disk |
| 05/10/2002 | WO2002037554A1 Method for assembling planar workpieces |
| 05/10/2002 | WO2001072472A3 Carrier head with a flexible membrane having parts made with different elastomers |
| 05/09/2002 | US20020055324 Process for polishing silicon wafers |
| 05/09/2002 | US20020055323 Methods, apparatus and slurries for chemical mechanical planarization |
| 05/09/2002 | US20020055192 Chemical mechanical polishing of a metal layer with polishing rate monitoring |
| 05/09/2002 | US20020053358 Method of cleaning abrasive plates of abrasive machine and cleaning device |
| 05/09/2002 | US20020053121 Method for manufacturing a magnetic disk comprising a glass substrate using a protective layer over a glass workpiece |
| 05/08/2002 | EP1204139A1 Rotation holding device and semiconductor substrate processing device |
| 05/08/2002 | EP1007283A4 Mosaic polishing pads and methods relating thereto |
| 05/07/2002 | US6383934 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids |
| 05/07/2002 | US6383332 For semiconductors |
| 05/07/2002 | US6383240 Containing amphipathic compound; polishing semiconductors |
| 05/07/2002 | US6383066 Multilayered polishing pad, method for fabricating, and use thereof |
| 05/07/2002 | US6383065 Catalytic reactive pad for metal CMP |
| 05/07/2002 | US6383060 Method of polishing silicon wafer |
| 05/07/2002 | US6383059 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks |
| 05/07/2002 | US6383058 Adaptive endpoint detection for chemical mechanical polishing |
| 05/07/2002 | US6383056 Plane constructed shaft system used in precision polishing and polishing apparatuses |
| 05/02/2002 | WO2002035592A1 Polishing device |
| 05/02/2002 | WO2002034471A1 Pad quick release device for chemical mechanical planarization |
| 05/02/2002 | WO2002015261A3 Bathless wafer measurement apparatus and method |
| 05/02/2002 | WO2002014014A3 Chemical mechanical planarization of metal substrates |
| 05/02/2002 | US20020052301 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
| 05/02/2002 | US20020052175 Pressurized delivery method for abrasive particulate material |
| 05/02/2002 | US20020052174 Polishing apparatus, cleaning apparatus to be used for such a polishing apparatus and polishing/cleaning method as well as method of making a wiring section |
| 05/02/2002 | US20020052173 Chemical-mechanical polishing methods |