| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 06/18/2002 | US6406359 Apparatus for transferring semiconductor substrates using an input module |
| 06/18/2002 | US6405740 Accurate positioning of a wafer |
| 06/13/2002 | WO2002047141A1 Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 06/13/2002 | WO2002047140A1 Wafer polisher |
| 06/13/2002 | WO2002047139A2 Methode of forming a copper film on a substrate |
| 06/13/2002 | WO2002046283A1 Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam |
| 06/13/2002 | WO2002045906A1 Abrasive cloth and polishing method |
| 06/13/2002 | WO2001082356A3 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates |
| 06/13/2002 | US20020072313 Carrier head with local pressure control for a chemical mechanical polishing apparatus |
| 06/13/2002 | US20020072311 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
| 06/13/2002 | US20020072310 Abrasive liquid feed apparatus, method for feeding additive to abrasive liquid feed apparatus, and polishing apparatus |
| 06/13/2002 | US20020072309 Polishing method and polishing apparatus |
| 06/13/2002 | US20020072308 Backside integrated circuit die surface finishing technique and tool |
| 06/13/2002 | US20020072302 Method and apparatus for increasing chemical-mechanical-polishing selectivity |
| 06/13/2002 | US20020072301 Apparatus and method for detecting a work piece in an automatic processing apparatus |
| 06/13/2002 | US20020072296 Abrasive article having a window system for polishing wafers, and methods |
| 06/13/2002 | US20020072238 Chemical mechanical polishing method for slurry free fixed abrasive pads |
| 06/13/2002 | US20020071128 Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates |
| 06/13/2002 | US20020070126 Polishing method, polishing apparatus, plating method, and plating apparatus |
| 06/13/2002 | US20020069967 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 06/13/2002 | US20020069593 For use in semiconductor device fabrication |
| 06/13/2002 | US20020069591 Transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer onto transported backing layer, shaping fluid phase polymer into surface layer having measured thickness, and curing polymer to solidify |
| 06/13/2002 | DE10154942A1 Slide used for simultaneously removing material from both sides of semiconductor wafers between rotating plates comprises base body surface, surface of recess for receiving wafer, and surface of further recesses |
| 06/13/2002 | DE10059345A1 Semiconducting substrate holder for chemical-mechanical polishing has base body, protruding guide ring attached to base body, protruding step, sealing film on main surface and step |
| 06/12/2002 | EP1213094A2 Polishing apparatus having interlock function |
| 06/12/2002 | EP1212789A1 Polishing mixture and process for reducing incorporation of copper into silicon wafers |
| 06/12/2002 | EP1212171A1 Self-leveling pads and methods relating thereto |
| 06/12/2002 | EP1212170A1 Method and system for chemical mechanical polishing with a cylindrical polishing pad |
| 06/12/2002 | EP1017540B1 An abrasive means and a grinding process |
| 06/11/2002 | US6402925 Prevent accumulation by polishing |
| 06/11/2002 | US6402884 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 06/11/2002 | US6402883 Polishing pad conditioning surface having integral conditioning points |
| 06/11/2002 | US6402602 Rotary union for semiconductor wafer applications |
| 06/11/2002 | US6402601 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies |
| 06/11/2002 | US6402599 Slurry recirculation system for reduced slurry drying |
| 06/11/2002 | US6402598 Chemical mechanical polishing apparatus and method of washing contaminants off of the polishing head thereof |
| 06/11/2002 | US6402597 Polishing apparatus and method |
| 06/11/2002 | US6402595 Method for chemical mechanical polishing |
| 06/11/2002 | US6402594 Polishing method for wafer and holding plate |
| 06/11/2002 | US6402591 Planarization system for chemical-mechanical polishing |
| 06/11/2002 | US6402590 Carrier head with controllable struts for improved wafer planarity |
| 06/11/2002 | US6402589 Wafer grinder and method of detecting grinding amount |
| 06/06/2002 | WO2002045127A2 Methods of endpoint detection for wafer planarization |
| 06/06/2002 | WO2002044293A2 Method and composition for the removal of residual materials during substrate planarization |
| 06/06/2002 | WO2002043940A1 A method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
| 06/06/2002 | WO2002043925A1 Abrasive article having a window system for polishing wafers, and methods |
| 06/06/2002 | WO2002043922A1 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method |
| 06/06/2002 | WO2002043921A1 Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| 06/06/2002 | WO2002019393A3 Method of processing a semiconductor wafer |
| 06/06/2002 | US20020068517 Wafer polishing apparatus |
| 06/06/2002 | US20020068516 Apparatus and method for controlled delivery of slurry to a region of a polishing device |
| 06/06/2002 | US20020068513 Unsupported chemical mechanical polishing belt |
| 06/06/2002 | US20020068512 Apparatus and method for mounting a wafer in a polishing machine |
| 06/06/2002 | US20020068508 Directional flow control valve with recirculation for chemical-mechanical polishing slurries |
| 06/06/2002 | US20020068456 Method and system to provide material removal and planarization employing a reactive pad |
| 06/06/2002 | US20020068454 Transition metal ions; chelating agents; surfactants; oxidizers; corrosion inhibitors; and water. |
| 06/06/2002 | US20020068450 Method for chemical mechanical polishing |
| 06/06/2002 | US20020068434 System for planarizing microelectronic substrates having apertures |
| 06/06/2002 | US20020066234 Acidic slurry of an oxidizer, deionized water, a corrosion inhibitor and a surfactant |
| 06/06/2002 | DE10143938A1 Polishing machine for semiconductor wafers includes two-chamber carrier system with membrane and openings in correspondence |
| 06/06/2002 | DE10060343A1 Polierslurry für das chemisch-mechanische Polieren von Metall- und Dielektrikastrukturen Polishing slurry for chemical mechanical polishing of metal and dielectric structures |
| 06/06/2002 | DE10058305A1 Verfahren zur Oberflächenpolitur von Siliciumscheiben A method for surface polishing of silicon wafers |
| 06/06/2002 | CA2430377A1 Abrasive article having a window system for polishing wafers, and methods |
| 06/05/2002 | EP1211719A1 Polishing slurry for the chemical mechanical polishing of metal and dielectric structures |
| 06/05/2002 | EP1211024A2 Polishing method |
| 06/05/2002 | EP1211023A1 Polishing body, polisher, polishing method, and method for producing semiconductor device |
| 06/05/2002 | EP1210395A1 Compositions for insulator and metal cmp and methods relating thereto |
| 06/05/2002 | EP1210209A1 Molded polishing pad having integral window |
| 06/05/2002 | EP0921906B1 Abrasive construction for semiconductor wafer modification |
| 06/05/2002 | EP0876242B1 A polishing pad and a method for making a polishing pad with covalently bonded particles |
| 06/05/2002 | CN1352673A Compositions for and methods for reducing/eliminating scratches and defects in silicon dioxide CMP process |
| 06/05/2002 | CN1352589A Method of modifying a surface of a structured wafer |
| 06/05/2002 | CN1352588A Abrasive processing apparatu sand method for employing encoded abrasive product |
| 06/05/2002 | CN1352587A Apparatus and process for reconditioning polishing pads |
| 06/04/2002 | US6399551 Mixture containing chelate compound and solvent |
| 06/04/2002 | US6399501 Method and apparatus for detecting polishing endpoint with optical monitoring |
| 06/04/2002 | US6399498 Method and apparatus for polishing work |
| 06/04/2002 | US6399148 Multilayer structure; metallic layer, dielectric, resistor and connector |
| 06/04/2002 | US6398905 Fluoropolymer coating on a platen allows for removal of polishing pads with pressure sensitive adhesives; used for smoothening semiconductor wafers and optical lenses |
| 06/04/2002 | US6398827 Stable aqueous spherical moniliform colloidal silica bonded with metal oxide; monoplanar; iron oxide or inorganic salt accelerator; alumina disks; silica surfaces; semiconductorwafers |
| 06/04/2002 | US6398631 Method and apparatus to place wafers into and out of machine |
| 06/04/2002 | US6398630 Planarizing machine containing web-format polishing pad and web-format polishing pads |
| 06/04/2002 | US6398627 Slurry dispenser having multiple adjustable nozzles |
| 06/04/2002 | US6398626 Polishing apparatus |
| 06/04/2002 | US6398625 Apparatus and method of polishing with slurry delivery through a polishing pad |
| 06/04/2002 | US6398077 Package with multiple chambers and valves |
| 06/04/2002 | CA2364053A1 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures |
| 05/30/2002 | WO2002043129A2 Method for determinating an endpoint during cmp of a semiconductor wafer |
| 05/30/2002 | WO2002043128A1 Polishing device and method of manufacturing semiconductor device |
| 05/30/2002 | WO2002042033A1 Semiconductor wafer, polishing apparatus and method |
| 05/30/2002 | WO2002020214A3 Method for polishing a memory or rigid disk with a polishing composition containing an oxidized halide and an acid |
| 05/30/2002 | WO2002002279A3 Grooved polishing pads and methods of use |
| 05/30/2002 | US20020065032 Polishing pad |
| 05/30/2002 | US20020065029 Conditioner set for chemical-mechanical polishing station |
| 05/30/2002 | US20020065028 Bathless wafer measurement apparatus and method |
| 05/30/2002 | US20020065025 Chemical mechanical polishing method for copper |
| 05/30/2002 | US20020065022 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device |
| 05/30/2002 | US20020064971 Chemical Mechanical Polishing(CMP); Copper(Cu); performing CMP at low temperatures by adding a slurry that functions as a corrosion inhibitor; polishing apparatus with coolant |
| 05/30/2002 | US20020064955 Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same |
| 05/30/2002 | US20020064953 Organic polymer with dielectric constant of 4 or lower; for example polyarylene ethers |