| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 07/04/2002 | US20020084243 Composite material comprising a bonded laminate having a layer of macromolecular material bonded to the modified surface of a titanium sheet or a titanium alloy sheet, lightweight, high strength, corrosion resistant |
| 07/04/2002 | US20020083650 Polishing of semiconductor substrates |
| 07/04/2002 | US20020083577 Polishing member and apparatus |
| 07/04/2002 | DE10062496A1 Halter für flache Werkstücke, insbesondere Halbleiterwafer Holder for flat workpieces, in particular semiconductor wafers |
| 07/03/2002 | EP1218565A1 Cemented carbide wear part and lapping method |
| 07/03/2002 | EP1218466A1 Compositions for and methods of reducing/eliminating scratches and defects in silicon dioxide cmp process |
| 07/03/2002 | EP1218465A1 Polishing system with stopping compound and method of its use |
| 07/03/2002 | EP1218464A1 Chemical mechanical polishing systems and methods for their use |
| 07/03/2002 | EP1218310A1 A1 2?O 3?/SiC NANOCOMPOSITE ABRASIVE GRAINS, METHOD FOR PRODUCING THEM AND THEIR USE |
| 07/03/2002 | EP1218144A1 Dissolution of metal particles produced by polishing |
| 07/03/2002 | EP1218143A1 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
| 07/03/2002 | CN2498383Y Hydraulic device of steel ball machining apparatus |
| 07/03/2002 | CN1356369A Apparatus for preparing grinding liquid |
| 07/03/2002 | CN1086976C Chemical and mechanical lapping device and method |
| 07/02/2002 | US6413873 System for chemical mechanical planarization |
| 07/02/2002 | US6413403 Controlling electrolyte flow and distribution of electric, magnetic or electromagnetic field; depositing, removing, polishing, and/or modifying conductive material; uniformity; chemical mechanical polishing |
| 07/02/2002 | US6413388 Pad designs and structures for a versatile materials processing apparatus |
| 07/02/2002 | US6413288 CMP polishing slurry dewatering and reconstitution |
| 07/02/2002 | US6413156 Method and apparatus for polishing workpiece |
| 07/02/2002 | US6413155 Polishing apparatus |
| 07/02/2002 | US6413154 Polishing apparatus |
| 07/02/2002 | US6413153 Finishing element including discrete finishing members |
| 07/02/2002 | US6413152 Apparatus for performing chemical-mechanical planarization with improved process window, process flexibility and cost |
| 07/02/2002 | US6413151 CMP slurry recycling apparatus and method for recycling CMP slurry |
| 07/02/2002 | US6413149 For semiconductor wafers |
| 07/02/2002 | US6413146 Polishing apparatus |
| 06/27/2002 | WO2002050893A2 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process |
| 06/27/2002 | WO2002050336A2 Integrated mutli-step gap fill and all feature planarization for conductive materials |
| 06/27/2002 | WO2002049806A1 Belt polishing device with double retainer ring |
| 06/27/2002 | WO2002049805A1 Polishing platen with pressurized membrane |
| 06/27/2002 | WO2002049804A1 Jet-induced finishing of a substrate surface |
| 06/27/2002 | WO2002015237B1 Changing local compressibility of a wafer support member |
| 06/27/2002 | WO2000063963A9 Non-abrasive conditioning for polishing pads |
| 06/27/2002 | US20020081958 Polishing pad installation tool |
| 06/27/2002 | US20020081956 Carrier head with vibration dampening |
| 06/27/2002 | US20020081955 Wafer polishing apparatus |
| 06/27/2002 | US20020081951 Apparatus and method for qualifying a chemical mechanical planarization process |
| 06/27/2002 | US20020081950 Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity |
| 06/27/2002 | US20020081948 Flexible bending member for a workpiece carrier apparatus |
| 06/27/2002 | US20020081947 Platen design for improving edge performance in CMP applications |
| 06/27/2002 | US20020081946 Base-pad for a polishing pad |
| 06/27/2002 | US20020081945 Piezoelectric platen design for improving performance in CMP applications |
| 06/27/2002 | US20020081943 Semiconductor substrate and lithographic mask processing |
| 06/27/2002 | US20020081853 Abrasive slurry and process for a chemical-mechanical polishing of a precious-metal surface |
| 06/27/2002 | US20020078632 Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof |
| 06/27/2002 | DE10063491A1 Saure Polierslurry für das chemisch-mechanische Polieren von SiO¶2¶-Isolationsschichten Acid polishing slurry for chemical mechanical polishing of SiO¶2¶ insulating layers |
| 06/27/2002 | DE10063488A1 Polierslurry für das chemisch-mechanische Polieren von Siliciumdioxid-Filmen Polishing slurry for chemical mechanical polishing of silicon dioxide films |
| 06/27/2002 | DE10062497A1 Halter für flache Werkstücke, insbesondere Halbleiterwafer Holder for flat workpieces, in particular semiconductor wafers |
| 06/27/2002 | DE10060697A1 Producing semiconductor wafers used in the production of processor and storage components comprises polishing both sides of the wafer using polishing plates |
| 06/27/2002 | DE10060696A1 Method by which edges of brittle hard materials may be ground has the tool subjected to ultrasonic frequencies |
| 06/26/2002 | EP1217651A1 Acid polishing slurry for the chemical mechanical polishing of SiO2-isolation layers |
| 06/26/2002 | EP1217650A1 Polishing slurry for the chemical mechanical polishing of silicon dioxide films |
| 06/26/2002 | EP1217322A2 Heat Exchanger |
| 06/26/2002 | EP1216316A1 Polishing of fluoride crystal optical lenses and preforms using cerium oxide for microlithography |
| 06/26/2002 | EP1216118A1 Polishing pad treatment for surface conditioning |
| 06/26/2002 | CN1355769A Improved ceria oxide powder |
| 06/25/2002 | US6410441 Auto slurry deliver fine-tune system for chemical-mechanical-polishing process and method of using the system |
| 06/25/2002 | US6410440 Method and apparatus for a gaseous environment providing improved control of CMP process |
| 06/25/2002 | US6410439 Semiconductor polishing apparatus and method for chemical/mechanical polishing of films |
| 06/25/2002 | US6409936 Integrated circuit; corundum abrasive particles; etchant; nonionic surfactant brij (polyoxyethylene cetyl ether) |
| 06/25/2002 | US6409904 Method and apparatus for depositing and controlling the texture of a thin film |
| 06/25/2002 | US6409780 Solid material with water and inorganic particles in a slurry |
| 06/25/2002 | US6409586 Fixed abrasive polishing pad |
| 06/25/2002 | US6409585 Polishing apparatus and holder for holding an article to be polished |
| 06/25/2002 | US6409583 Apparatus for polishing wafers |
| 06/25/2002 | US6409582 Polishing apparatus |
| 06/25/2002 | US6409581 Belt polishing pad method |
| 06/25/2002 | US6409580 Rigid polishing pad conditioner for chemical mechanical polishing tool |
| 06/25/2002 | US6409579 Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish |
| 06/25/2002 | US6409577 Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers |
| 06/25/2002 | US6409576 Polishing apparatus |
| 06/20/2002 | WO2002049082A2 Process of shaping a semiconductor substrate and/or a lithographic mask |
| 06/20/2002 | WO2002048279A1 Abrasive, abrasive slurry, and method for manufacturing abrasive |
| 06/20/2002 | WO2002047870A1 Arrangement and method for mounting a backing film to a polish head |
| 06/20/2002 | WO2002047868A1 Composition for texturing process |
| 06/20/2002 | WO2002016080A3 Substrate supporting carrier pad |
| 06/20/2002 | WO2000054935A9 Method and apparatus for endpoint detection for chemical mechanical polishing |
| 06/20/2002 | US20020077053 Flexible polishing pad having reduced surface stress |
| 06/20/2002 | US20020077051 Holder for flat workpieces, particularly semiconductor wafers |
| 06/20/2002 | US20020077046 Holder for polished work and manufacturing method thereof |
| 06/20/2002 | US20020077045 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| 06/20/2002 | US20020077044 Apparatus and method for lapping magnetic heads |
| 06/20/2002 | US20020077039 Process for the surface polishing of silicon wafers |
| 06/20/2002 | US20020077037 Fixed abrasive articles |
| 06/20/2002 | US20020077036 Polishing pads and methods relating thereto |
| 06/20/2002 | US20020077035 Ion exchange materials for chemical mechanical polishing |
| 06/20/2002 | US20020077034 Substrate polishing article |
| 06/20/2002 | US20020077031 Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
| 06/20/2002 | US20020076932 Method of polishing or planarizing a substrate |
| 06/20/2002 | US20020074478 Holder for flat workpieces, particularly semiconductor wafers |
| 06/20/2002 | US20020074311 Methods of endpoint detection for wafer planarization |
| 06/20/2002 | CA2365593A1 Polishing slurry for the chemical-mechanical polishing of silica films |
| 06/19/2002 | EP1215011A1 Arrangement and method for mounting a backing film to a polish head |
| 06/19/2002 | EP1214175A1 Unsupported polishing belt for chemical mechanical polishing |
| 06/19/2002 | EP1214174A1 Windowless belt and method for in-situ wafer monitoring |
| 06/18/2002 | US6407000 Microelectronics |
| 06/18/2002 | US6406364 Polishing solution feeder |
| 06/18/2002 | US6406363 Unsupported chemical mechanical polishing belt |
| 06/18/2002 | US6406362 Seal for use with a chemical mechanical planarization apparatus |
| 06/18/2002 | US6406361 Carrier head for chemical mechanical polishing |