| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
|---|
| 07/24/2002 | EP1224060A1 Polishing pad |
| 07/24/2002 | CN1359998A Acidic polishing cream for chemicomechanically polishing SiO2 isolating layer |
| 07/24/2002 | CN1359997A Polishing cream for polishing silicon dioxide film by chemicomechanical process |
| 07/23/2002 | US6424137 Use of acoustic spectral analysis for monitoring/control of CMP processes |
| 07/23/2002 | US6423638 Filter apparatus and method therefor |
| 07/23/2002 | US6423125 Polishing composition |
| 07/23/2002 | US6422929 Polishing pad for a linear polisher and method for forming |
| 07/23/2002 | US6422928 Abrasive machine |
| 07/23/2002 | US6422927 Carrier head with controllable pressure and loading area for chemical mechanical polishing |
| 07/23/2002 | US6422923 Apparatus and methods for substantial planarization of solder bumps |
| 07/23/2002 | US6422922 Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece |
| 07/23/2002 | US6422921 Heat activated detachable polishing pad |
| 07/23/2002 | US6422919 Apparatus and methods for substantial planarization of solder bumps |
| 07/18/2002 | WO2002056356A1 Polishing method, polishing device, and semiconductor device producing method |
| 07/18/2002 | WO2002056351A2 Polishing of semiconductor substrates |
| 07/18/2002 | WO2002032625A3 Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
| 07/18/2002 | WO2002007931A3 Multi-chamber carrier head with a flexible membrane |
| 07/18/2002 | WO2002004172A3 Carrier head with flexible membranes to control the applied load and the dimension of the loading area |
| 07/18/2002 | US20020094767 Carrier head with multi-part flexible membrane |
| 07/18/2002 | US20020094765 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 07/18/2002 | US20020094760 Protective film separator in semiconductor wafer grinding process |
| 07/18/2002 | US20020094759 Multi-zone pressure control carrier |
| 07/18/2002 | US20020094758 Lapping monitor for monitoring the lapping of transducers |
| 07/18/2002 | US20020093002 Chemical mechanical polishing slurry |
| 07/18/2002 | DE10065380A1 Verfahren zur Charakterisierung und Simulation eines chemisch-mechanischen Polier-Prozesses A method for characterizing and simulation of a chemical mechanical polishing process |
| 07/17/2002 | EP1222056A1 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization |
| 07/17/2002 | CN1087870C Improved polishing slurries and method for their use |
| 07/16/2002 | US6420265 Method for polishing semiconductor device |
| 07/16/2002 | US6419785 Polishing semiconductors |
| 07/16/2002 | US6419574 Abrasive tool with metal binder phase |
| 07/16/2002 | US6419572 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 07/16/2002 | US6419568 Fixed abrasive polishing pad |
| 07/16/2002 | US6419567 Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method |
| 07/16/2002 | US6419560 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies |
| 07/16/2002 | US6419559 Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet |
| 07/16/2002 | US6419558 Apparatus, backing plate, backing film and method for chemical mechanical polishing |
| 07/16/2002 | US6419557 Polishing method and polisher used in the method |
| 07/16/2002 | US6419555 Process and apparatus for polishing a workpiece |
| 07/16/2002 | US6419554 Removal of titanium nitride using etching or oxidation solutions |
| 07/16/2002 | US6419553 Methods for break-in and conditioning a fixed abrasive polishing pad |
| 07/16/2002 | US6419550 Apparatus and methods for substantial planarization of solder bumps |
| 07/11/2002 | WO2002054471A1 Apparatus and method for abrading semiconductor wafer |
| 07/11/2002 | WO2002053490A2 Method of making optical fluoride laser crystal components |
| 07/11/2002 | WO2002053324A1 Polishing pad and method of use thereof |
| 07/11/2002 | WO2002053322A2 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads |
| 07/11/2002 | WO2002053320A2 Wafer support for chemical mechanical planarization |
| 07/11/2002 | WO2002053273A2 Process and apparatus for blending and distributing a slurry solution |
| 07/11/2002 | WO2000073396A9 Slurry composition and method of chemical mechanical polishing using same |
| 07/11/2002 | WO2000067951A9 Optical endpoint detection during chemical mechanical planarization |
| 07/11/2002 | US20020090899 Chemical mechanical planarization belt assembly and method of assembly |
| 07/11/2002 | US20020090896 Pad Cleaning for a CMP system |
| 07/11/2002 | US20020090895 Abrasive, method of polishing target member and process for producing semiconductor device |
| 07/11/2002 | US20020090894 Method for polishing a semiconductor substrate member |
| 07/11/2002 | US20020090893 Method for improving curvature of the polished surface by chemical mechanical polishing |
| 07/11/2002 | US20020090889 Apparatus and method of determining an endpoint during a chemical-mechanical polishing process |
| 07/11/2002 | US20020090887 Polishing pad with built-in optical sensor |
| 07/11/2002 | US20020090886 Method and apparatus for hard pad polishing |
| 07/11/2002 | US20020090884 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing |
| 07/11/2002 | US20020090819 Windowless belt and method for improved in-situ wafer monitoring |
| 07/11/2002 | US20020090799 Substrate grinding systems and methods to reduce dot depth variation |
| 07/11/2002 | US20020090745 Rule to determine CMP polish time |
| 07/11/2002 | US20020090589 Method of adhering wafer and wafer adhering device |
| 07/11/2002 | US20020089676 Method and apparatus for in-situ monitoring of thickness during chemical -mechanical polishing |
| 07/10/2002 | CN1358125A Apparatus for polishing magnetic head and polishing method |
| 07/10/2002 | CN1357586A Polishing composition and polishing method of substrate for memory and hard disk |
| 07/10/2002 | CN1357585A Chemical and mechanical polishing paste for metal and dielectric structure |
| 07/10/2002 | CN1087493C Process for polishing semiconductor substrate |
| 07/09/2002 | US6416617 Using a torque detector which detects the rotation torque of polishing platen or substrate holder and adaptively dressing the polishing pad if the rotation torque detected is equal to or smaller than a predetermined value |
| 07/09/2002 | US6416616 Apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 07/09/2002 | US6416615 Device for detecting abnormality in chemical-mechanical polishing operation |
| 07/09/2002 | US6416402 Methods of polishing microelectronic substrates, and methods of polishing wafers |
| 07/09/2002 | US6416401 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives |
| 07/09/2002 | US6416399 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416398 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416397 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416395 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416393 Polishing; hydrophobic surfaces using aqueous solution containing hydrogen fluoride |
| 07/09/2002 | US6416391 Using fluid stream |
| 07/09/2002 | US6416388 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416387 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416386 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416385 Method and apparatus for polishing semiconductor wafers |
| 07/09/2002 | US6416384 Method and apparatus for polishing |
| 07/04/2002 | WO2002052634A2 Method for characterising and simulating a chemical-mechanical polishing process |
| 07/04/2002 | WO2002051955A1 Prevention of precipitation defects on copper interconnects during cmp by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
| 07/04/2002 | WO2002051589A1 Method and apparatus for chemical-mechanical polishing (cmp) using upstream and downstream fluid dispensing means |
| 07/04/2002 | WO2002051587A1 Methods for making reinforced wafer polshing pads and apparatuses implementing the same |
| 07/04/2002 | WO2001074959A3 Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 07/04/2002 | US20020086632 Wafer polishing pad centering apparatus |
| 07/04/2002 | US20020086626 Seal for use with a chemical mechanical planarization apparatus |
| 07/04/2002 | US20020086624 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 07/04/2002 | US20020086622 Method and apparatus for conditioning a polishing pad with sonic energy |
| 07/04/2002 | US20020086620 Method and apparatus for conditioning a polishing pad with sonic energy |
| 07/04/2002 | US20020086619 Substrate polishing article |
| 07/04/2002 | US20020086617 Rotary union for semiconductor wafer applications |
| 07/04/2002 | US20020086615 Multi characterized chemical mechanical polishing pad and method for fabricating the same |
| 07/04/2002 | US20020086538 Method for polishing semiconductor device |
| 07/04/2002 | US20020086536 Ditch type floating ring for chemical mechanical polishing |
| 07/04/2002 | US20020086531 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process |
| 07/04/2002 | US20020085447 Process and apparatus for blending and distributing a slurry solution |