| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 08/13/2002 | US6431952 Apparatus and methods for substantial planarization of solder bumps |
| 08/08/2002 | WO2002061817A1 Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium |
| 08/08/2002 | WO2002061810A1 Ammonium oxalate-containing polishing system and method |
| 08/08/2002 | WO2002061008A2 Alkali metal-containing polishing system and method |
| 08/08/2002 | WO2002060646A1 System for magnetorheological finishing of substrates |
| 08/08/2002 | WO2002060643A2 Spherical drive assembly for chemical mechanical planarization |
| 08/08/2002 | US20020106980 Abrasive article suitable for modifying a semiconductor wafer |
| 08/08/2002 | US20020106979 Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof |
| 08/08/2002 | US20020106978 Chemical mechanical machining and surface finishing |
| 08/08/2002 | US20020106977 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 08/08/2002 | US20020106975 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 08/08/2002 | US20020106971 Method and apparatus for conditioning a polishing pad |
| 08/08/2002 | US20020106900 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures |
| 08/08/2002 | US20020106899 Method for applying uniform pressurized film across wafer |
| 08/08/2002 | US20020106897 Polishing of metal substrates |
| 08/08/2002 | US20020106829 Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof |
| 08/08/2002 | US20020104764 Applying a voltage across a polishing pad and the substrate, while an electropolishing electrolyte is dispensed at an interface of the substrate and the polishing pad, and while pooling the electrolyte about the substrate |
| 08/08/2002 | US20020104268 Slurry for chemical mechanical polishing |
| 08/07/2002 | EP1229094A2 Polishing composition and polishing method employing it |
| 08/07/2002 | EP1229093A1 Polishing composition and polishing method employing it |
| 08/07/2002 | EP1228161A1 Cmp products |
| 08/07/2002 | EP1228159A1 Improved cmp products |
| 08/07/2002 | EP1227912A1 Methods and apparatuses for planarizing microelectronic substrate assemblies |
| 08/07/2002 | EP1213094A9 Polishing apparatus having interlock function |
| 08/07/2002 | CN1362906A Apparatus and method for the restoration of optical storage media |
| 08/06/2002 | US6429132 Combination CMP-etch method for forming a thin planar layer over the surface of a device |
| 08/06/2002 | US6429131 CMP uniformity |
| 08/06/2002 | US6429130 Method and apparatus for end point detection in a chemical mechanical polishing process using two laser beams |
| 08/06/2002 | US6428586 Transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer onto transported backing layer, shaping fluid phase polymer into surface layer having measured thickness, and curing polymer to solidify |
| 08/06/2002 | US6428405 Abrasive pad and polishing method |
| 08/06/2002 | US6428404 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies |
| 08/06/2002 | US6428403 Polishing apparatus |
| 08/06/2002 | US6428400 Drainage structure in polishing plant |
| 08/06/2002 | US6428399 Polishing apparatus for polishing a hard material-coated wafer |
| 08/06/2002 | US6428398 Method for wafer polishing and method for polishing-pad dressing |
| 08/06/2002 | US6428397 Wafer edge polishing method and apparatus |
| 08/06/2002 | US6428395 Method of polishing at least one surface of a silicon-based part |
| 08/06/2002 | US6428394 Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed |
| 08/06/2002 | US6428389 Polishing apparatus |
| 08/06/2002 | US6428388 Finishing element with finishing aids |
| 08/06/2002 | US6428387 Method for chemical mechanical polishing using a high selective slurry |
| 08/06/2002 | US6428386 Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 08/06/2002 | US6427991 Non-contact workpiece holder using vortex chuck with central gas flow |
| 08/01/2002 | WO2002059947A2 Carrier head for holding a wafer and allowing processing on a front face thereof to occur |
| 08/01/2002 | WO2002059943A2 Chemical mechanical polishing of copper-oxide damascene structures |
| 08/01/2002 | WO2002059393A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| 08/01/2002 | WO2002058885A1 Pressure vessel systems and methods for dispensing liquid chemical compositions |
| 08/01/2002 | US20020102931 Work holding member for mechanical abrasion, abrading method, and abrading machine |
| 08/01/2002 | US20020102928 System for magnetorheological finishing of substrates |
| 08/01/2002 | US20020102925 Surface polishing method and apparatus |
| 08/01/2002 | US20020102924 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor |
| 08/01/2002 | US20020102923 Polishing composition and polishing method for polishing a substrate to be used for a memory hard disk employing it |
| 08/01/2002 | US20020102921 Fixed abrasive polishing pad |
| 08/01/2002 | US20020102917 Polishing method using dynamic feedback recipe |
| 08/01/2002 | US20020102853 Articles for polishing semiconductor substrates |
| 08/01/2002 | US20020100895 For polishing multiple metal layers and thin-films where one of the layers or films is comprises of copper or a copper containing alloy |
| 08/01/2002 | US20020100743 Multi-step polish process to control uniformity when using a selective slurry on patterned wafers |
| 08/01/2002 | DE10122283A1 Chemisch-mechanisches Polierverfahren Chemical mechanical polishing method |
| 08/01/2002 | DE10103062A1 Chemisch-mechanisches Polierverfahren für emulsionsfreie feste Schleifkissen Chemical mechanical polishing method for emulsion-free solid abrasive pad |
| 08/01/2002 | CA2431591A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| 07/31/2002 | EP1226220A1 Polishing system and method of its use |
| 07/31/2002 | CN2502842Y Diesel engine valve lapping machine |
| 07/31/2002 | CN1361923A Polishing mixture and process for reducing the incorporation of copper into silicon wafers |
| 07/30/2002 | US6426297 Differential pressure chemical-mechanical polishing in integrated circuit interconnects |
| 07/30/2002 | US6426296 Method and apparatus for obtaining a precision thickness in semiconductor and other wafers |
| 07/30/2002 | US6426295 Mixing surfactant of at least 100 parts per million to slurries to form polishing solution, chemical-mechanical planarizing of semiconductor wafer using polishing solution to form microelectronic substrate |
| 07/30/2002 | US6426294 Polishing conductive material film comprising copper or copper alloy using aqueous composition comprising pyridine-based carboxylic acid and acid having one carboxyl and one hydroxyl group or oxalic acid, abrasive grains and oxidizing agent |
| 07/30/2002 | US6425816 Polishing pads and methods relating thereto |
| 07/30/2002 | US6425815 Fixed abrasive polishing pad |
| 07/30/2002 | US6425812 Polishing head for chemical mechanical polishing using linear planarization technology |
| 07/30/2002 | US6425810 Polishing apparatus |
| 07/30/2002 | US6425809 Polishing apparatus |
| 07/30/2002 | US6425806 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 07/30/2002 | US6425804 Pressurized delivery system for abrasive particulate material |
| 07/30/2002 | US6425803 Scored polishing pad and methods relating thereto |
| 07/30/2002 | US6425802 Apparatus for supplying flush fluid |
| 07/30/2002 | US6425801 Polishing process monitoring method and apparatus, its endpoint detection method, and polishing machine using same |
| 07/25/2002 | WO2002057382A2 A cmp polishing pad including a solid catalyst |
| 07/25/2002 | WO2002057071A2 Catalytic reactive pad for metal cmp |
| 07/25/2002 | WO2002057052A1 Abrasive free polishing in copper damascene applications |
| 07/25/2002 | WO2002023613A3 Metal cmp process with reduced dishing |
| 07/25/2002 | WO2001089767A3 A chemical-mechanical polishing system for the manufacture of semiconductor devices |
| 07/25/2002 | US20020098790 Open structure polishing pad and methods for limiting pore depth |
| 07/25/2002 | US20020098789 Polishing pad and methods for improved pad surface and pad interior characteristics |
| 07/25/2002 | US20020098786 Retention plate for polishing semiconductor substrate |
| 07/25/2002 | US20020098785 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
| 07/25/2002 | US20020098784 Abrasive free polishing in copper damascene applications |
| 07/25/2002 | US20020098782 Polishing pads and methods relating thereto |
| 07/25/2002 | US20020098780 Apparatus for polishing a semiconductor wafer and method therefor |
| 07/25/2002 | US20020098779 Method and apparatus for enhanced CMP using metals having reductive properties |
| 07/25/2002 | US20020098778 Polishing pad, polishing apparatus and polishing method using the same |
| 07/25/2002 | US20020098777 Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
| 07/25/2002 | US20020098702 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 07/25/2002 | US20020098701 Polishing method |
| 07/25/2002 | US20020098700 In closed container without generating hydrogen gas; a dry acid, iron, and an inhibited carbon dioxide generating compound (an encapsulated carbonate or bicarbonate); activated by injection of water; delayed carbon dioxide generation |
| 07/25/2002 | US20020098698 Method for polishing semiconductor device |
| 07/25/2002 | US20020098696 Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids |
| 07/25/2002 | US20020096659 Polishing composition and polishing method employing it |
| 07/25/2002 | US20020095874 Slurry for chemical mechanical polishing |
| 07/25/2002 | US20020095872 For polishing a metal film formed on an insulating film with a concave on a substrate |