| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 08/28/2002 | CN1366547A Polishing composition and magnetic recording disk substrate polished with polishing composition |
| 08/27/2002 | US6440319 Method and apparatus for predicting process characteristics of polyurethane pads |
| 08/27/2002 | US6440263 Indirect endpoint detection by chemical reaction and chemiluminescence |
| 08/27/2002 | US6440186 Polishing composition and polishing method employing it |
| 08/27/2002 | US6439989 Polymeric polishing pad having continuously regenerated work surface |
| 08/27/2002 | US6439987 Tool and method for the abrasive machining of a substantially planar surface |
| 08/27/2002 | US6439984 Molded non-abrasive substrate carrier for use in polishing operations |
| 08/27/2002 | US6439981 Arrangement and method for polishing a surface of a semiconductor wafer |
| 08/27/2002 | US6439980 Workpiece carrier and polishing apparatus having workpiece carrier |
| 08/27/2002 | US6439978 Substrate polishing system using roll-to-roll fixed abrasive |
| 08/27/2002 | US6439977 Rotational slurry distribution system for rotary CMP system |
| 08/27/2002 | US6439976 Polishing tape |
| 08/27/2002 | US6439972 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method |
| 08/27/2002 | US6439971 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 08/27/2002 | US6439970 Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 08/27/2002 | US6439968 Polishing pad having a water-repellant film theron and a method of manufacture therefor |
| 08/27/2002 | US6439967 Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies |
| 08/27/2002 | US6439965 Polishing pad and surface polishing method |
| 08/27/2002 | US6439964 Method of controlling a polishing machine |
| 08/27/2002 | US6439963 System and method for mitigating wafer surface disformation during chemical mechanical polishing (CMP) |
| 08/27/2002 | US6439962 Cleaning apparatus |
| 08/22/2002 | WO2002065529A2 Chemical-mechanical planarization using ozone |
| 08/22/2002 | WO2002064315A1 Polishing disk with end-point detection port |
| 08/22/2002 | WO2002064314A1 Method and apparatus for electrochemical planarization of a workpiece |
| 08/22/2002 | WO2002016080A8 Substrate supporting carrier pad |
| 08/22/2002 | WO2001063655A8 Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method |
| 08/22/2002 | WO2000012264A9 Polishing pad having open area which varies with distance from initial pad surface |
| 08/22/2002 | US20020115734 Method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
| 08/22/2002 | US20020115397 System and method for CMP head having multi-pressure annular zone subcarrier material removal control |
| 08/22/2002 | US20020115392 Wafer planarization apparatus and planarization method thereof |
| 08/22/2002 | US20020115388 System and method for reducing surface defects in integrated circuits |
| 08/22/2002 | US20020115387 Double-side polishing process with reduced scratch rate and device for carrying out the process |
| 08/22/2002 | US20020115385 Composite polishing pads for chemical-mechanical polishing |
| 08/22/2002 | US20020115384 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 08/22/2002 | US20020115380 Polishing end point detecting device for wafer polishing apparatus |
| 08/22/2002 | US20020115379 Polishing disk with end-point detection port |
| 08/22/2002 | US20020115283 Planarization by selective electro-dissolution |
| 08/22/2002 | US20020112758 Pressure vessel systems and methods for dispensing liquid chemical compositions |
| 08/22/2002 | US20020112343 Determination of track width of magnetoresistive sensors during magnetic head fabrication using magnetic fields |
| 08/21/2002 | EP1232835A2 Wafer planarization apparatus and planarization method thereof |
| 08/21/2002 | CN1364667A Multilayer folding riffled steel for knife and sword and its producing method |
| 08/20/2002 | US6437868 In-situ automated contactless thickness measurement for wafer thinning |
| 08/20/2002 | US6436834 Abrasion accelerator enhances the removal rate of a dielectric layer by chelation in either an acidic or a basic medium; methyl glycinate, glycinamide, aminoguanidine, semicarbazide, guanidine, urea, formamidine, acetamidine, formamide, |
| 08/20/2002 | US6436830 Delivering processed slurry to the polishing device. the slurry processor including a metal separator for separating metal particles, polished from the semiconductor wafer, from the used slurry. the slurry can be continuously recirculated |
| 08/20/2002 | US6436828 Chemical mechanical polishing using magnetic force |
| 08/20/2002 | US6436811 Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry |
| 08/20/2002 | US6436302 Post CU CMP polishing for reduced defects |
| 08/20/2002 | US6436228 Substrate retainer |
| 08/20/2002 | US6435958 Abrasive means and a grinding process |
| 08/20/2002 | US6435957 Wafer polishing pad centering apparatus |
| 08/20/2002 | US6435956 Wafer holder and polishing device |
| 08/20/2002 | US6435955 Abrasive machine |
| 08/20/2002 | US6435952 Apparatus and method for qualifying a chemical mechanical planarization process |
| 08/20/2002 | US6435950 Pressurized delivery method for abrasive particulate material |
| 08/20/2002 | US6435949 Workpiece polishing apparatus comprising a fluid pressure bag provided between a pressing surface and the workpiece and method of use thereof |
| 08/20/2002 | US6435948 Magnetic finishing apparatus |
| 08/20/2002 | US6435947 CMP polishing pad including a solid catalyst |
| 08/20/2002 | US6435945 Chemical mechanical polishing with multiple polishing pads |
| 08/20/2002 | US6435944 Chemical mechanical polishing (cmp); peroxycarboxylic acid or urea peroxyacid which dissociates into oxidizer and complexing agent; abrasive slurry; minimizing overetching; prevents dishing |
| 08/20/2002 | US6435943 Method of chemical mechanical polishing organic silicon material with low dielectric constant |
| 08/20/2002 | US6435942 Chemical mechanical polishing processes and components |
| 08/20/2002 | US6435941 Apparatus and method for chemical mechanical planarization |
| 08/15/2002 | WO2002062917A1 Cerium based abrasive material and method for preparation thereof |
| 08/15/2002 | WO2002062727A1 Porous ceramic and method for preparation thereof, and microstrip substrate |
| 08/15/2002 | WO2002062528A2 Chemical mechanical machining and surface finishing |
| 08/15/2002 | WO2002062527A1 Abrasive article suitable for modifying a semiconductor wafer |
| 08/15/2002 | WO2002062523A1 Surface polishing method and apparatus |
| 08/15/2002 | WO2002033737A3 Multiprobe detection system for chemical-mechanical planarization tool |
| 08/15/2002 | WO2002021581A3 Method for uniform polish microelectronic device |
| 08/15/2002 | WO2002016075A3 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer |
| 08/15/2002 | WO2001052307A9 Semiconductor workpiece proximity plating methods and apparatus |
| 08/15/2002 | WO2001041973A9 Chemical-mechanical polishing method |
| 08/15/2002 | US20020111125 Flattening and machining method and apparatus |
| 08/15/2002 | US20020111124 Method and apparatus for uniformly planarizing a microelectronic substrate |
| 08/15/2002 | US20020111123 Method and apparatus for uniformly planarizing a microelectronic substrate |
| 08/15/2002 | US20020111122 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| 08/15/2002 | US20020111121 Method and apparatus for electrochemical-mechanical planarization |
| 08/15/2002 | US20020111120 Fixed abrasive article for use in modifying a semiconductor wafer |
| 08/15/2002 | US20020111027 Polishing compositions for noble metals |
| 08/15/2002 | US20020111026 Polishing uisng ozone and abrasives |
| 08/15/2002 | US20020110661 Abrasive molding and abrasive disc provided with same |
| 08/15/2002 | US20020109122 Clean aqueous planarizing solution consists of an etchant selected from oxalic acid, ascorbic acid and phosphoric acid and a buffer |
| 08/15/2002 | US20020108861 Platen of conductive material is disposed proximate to the polishing pad and is configured to have a negative charge during planarization process; demetallization of a workpiece surface such as semiconductor |
| 08/15/2002 | CA2435732A1 Chemical mechanical machining and surface finishing |
| 08/14/2002 | EP1230068A1 Method and apparatus for lapping of workpieces |
| 08/14/2002 | EP1124666B1 Use of zeta potential during chemical mechanical polishing for end point detection |
| 08/14/2002 | CN2505234Y Magnetic equalizing star lapping machine |
| 08/14/2002 | CN2505233Y Lapping device for internal wall of curved elbow |
| 08/14/2002 | CN2505232Y Self-turning abrasive disk pressing star lapping machine |
| 08/14/2002 | CN1364107A Method and apparatus for polishing outer peripheral chamfered part of wafer |
| 08/14/2002 | CN1089050C Polishing method, device and buff wheel therefor |
| 08/13/2002 | US6432823 Off-concentric polishing system design |
| 08/13/2002 | US6432728 Method for integration optimization by chemical mechanical planarization end-pointing technique |
| 08/13/2002 | US6432258 Apparatus for and method of polishing workpiece |
| 08/13/2002 | US6431968 Carrier head with a compressible film |
| 08/13/2002 | US6431964 Planarization apparatus and method |
| 08/13/2002 | US6431960 Fixed abrasive polishing pad |
| 08/13/2002 | US6431959 System and method of defect optimization for chemical mechanical planarization of polysilicon |
| 08/13/2002 | US6431957 Directional flow control valve with recirculation for chemical-mechanical polishing slurries |
| 08/13/2002 | US6431953 CMP process involving frequency analysis-based monitoring |