| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/19/2002 | US20020132567 Apparatus and system of chemical mechanical polishing |
| 09/19/2002 | US20020132563 Polishing of semiconductor substrates |
| 09/19/2002 | US20020132561 Low amplitude, high speed polisher and method |
| 09/19/2002 | US20020132559 Polishing apparatus |
| 09/19/2002 | US20020130049 Forming a passivation layer on a substrate surface; polishing substrate in an electrolyte solution; applying an anodic bias to substrate surface; removing material from portion of substrate surface |
| 09/19/2002 | US20020130034 Pad designs and structures for a versatile materials processing apparatus |
| 09/19/2002 | US20020129560 Acidic polishing slurry for the chemical-mechanical polishing of SiO2 isolation layers |
| 09/19/2002 | US20020129559 Ratio of volume-cumulative (95%) average particle size (d95) to volume-cumulative (50%) average particle size (d50) (d95/d50) of 1.2-3 |
| 09/18/2002 | EP1240977A2 Polishing apparatus |
| 09/18/2002 | CN2511436Y Improved optical fiber grinder |
| 09/18/2002 | CN2511435Y Improved structure for arch marble grinding mill |
| 09/18/2002 | CN1370209A Polishing system with stopping compound and method of its use |
| 09/18/2002 | CN1370208A Chemical mechanical polishing systems and methods for their use |
| 09/18/2002 | CN1370207A Polishing system and method of its use |
| 09/18/2002 | CN1369534A Abrasive compsns. and abrasive process using such compsns. |
| 09/18/2002 | CN1369530A Polishing compsns. and polishing method using same |
| 09/17/2002 | US6451700 Method and apparatus for measuring planarity of a polished layer |
| 09/17/2002 | US6451699 Method and apparatus for planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom |
| 09/17/2002 | US6451076 Resin overcoating on abrasive |
| 09/17/2002 | US6450868 Carrier head with multi-part flexible membrane |
| 09/17/2002 | US6450863 Method and apparatus for uniformly planarizing a microelectronic substrate |
| 09/17/2002 | US6450859 Method and apparatus for abrading a substrate |
| 09/12/2002 | WO2002071445A2 Polishing chemical delivery for small head chemical mechanical planarization |
| 09/12/2002 | WO2002070200A1 Method for manufacturing a polishing pad having a compressed translucent region |
| 09/12/2002 | WO2002070199A1 Device for polishing optical disk |
| 09/12/2002 | WO2002070194A1 Reel-to-reel substrate tape polishing system |
| 09/12/2002 | WO2002053320A3 Wafer support for chemical mechanical planarization |
| 09/12/2002 | US20020128327 Polishing composition and magnetic recording disk substrate polished with the polishing composition |
| 09/12/2002 | US20020127959 Platen with lateral web tensioner |
| 09/12/2002 | US20020127958 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 09/12/2002 | US20020127957 Chemical mechanical polish pad conditioning device |
| 09/12/2002 | US20020127956 Method of sealing wafer backside for full-face electrochemical plating |
| 09/12/2002 | US20020127955 Method and apparatus for uniformly planarizing a microelectronic substrate |
| 09/12/2002 | US20020127953 Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
| 09/12/2002 | US20020127951 Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device |
| 09/12/2002 | US20020127950 Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same |
| 09/12/2002 | US20020127862 Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making same |
| 09/12/2002 | US20020127860 Filter apparatus and method therefor |
| 09/12/2002 | US20020127496 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 09/12/2002 | US20020126421 Lapping apparatus, magnetic head and method of manufacturing the same |
| 09/12/2002 | US20020125461 Ammonium oxalate-containing polishing system and method |
| 09/12/2002 | US20020124958 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 09/12/2002 | US20020124957 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 09/12/2002 | US20020124475 CMP polishing slurry dewatering and reconstitution |
| 09/12/2002 | US20020124373 Polishing apparatus |
| 09/11/2002 | EP1238756A1 Chemical mechanical polishing with multiple polishing pads |
| 09/11/2002 | EP1238755A1 Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer |
| 09/11/2002 | EP1238417A1 Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics |
| 09/11/2002 | EP1169671B1 Device and method for detecting a workpiece in an automatic processing device |
| 09/10/2002 | US6447695 Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devices |
| 09/10/2002 | US6447694 Composition for chemical mechanical polishing |
| 09/10/2002 | US6447693 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces |
| 09/10/2002 | US6447563 Chemical mechanical polishing slurry system having an activator solution |
| 09/10/2002 | US6447385 Polishing apparatus |
| 09/10/2002 | US6447382 Apparatus for removing semiconductor wafers from within the runner disks of a double-sided polishing machine |
| 09/10/2002 | US6447381 Polishing apparatus |
| 09/10/2002 | US6447380 Polishing apparatus and substrate retainer ring providing continuous slurry distribution |
| 09/10/2002 | US6447379 Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor |
| 09/10/2002 | US6447375 Chemical mechanical polishing; drying, solidifying, batch processing, packaging |
| 09/10/2002 | US6447374 Chemical mechanical planarization system |
| 09/10/2002 | US6447373 Chemical mechanical polishing slurries for metal |
| 09/10/2002 | US6447372 Polishing agent for semiconductor substrates |
| 09/10/2002 | US6447369 Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates |
| 09/10/2002 | US6447368 Carriers with concentric balloons supporting a diaphragm |
| 09/10/2002 | US6447367 Processing jig |
| 09/06/2002 | WO2002069391A1 Method of forming a thin wax layer on a mounting block for mounting a semiconductor wafer |
| 09/06/2002 | WO2002031866A3 Infrared end-point system for cmp |
| 09/06/2002 | WO2001010595A9 Method for manufacturing a magnetic disk comprising a glass substrate |
| 09/05/2002 | US20020123300 Method for manufacturing a polishing pad having a compressed translucent region |
| 09/05/2002 | US20020123299 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structurs that include copper and tungsten and polishing methods |
| 09/05/2002 | US20020123298 Linear reciprocating disposable belt polishing method and apparatus |
| 09/05/2002 | US20020123224 Chemical mechanical polishing slurry |
| 09/05/2002 | US20020121445 Mask plate design |
| 09/04/2002 | EP1236540A2 Wafer abrasive machine |
| 09/04/2002 | CN1367809A CMP composition containing silane modified abrasive particles |
| 09/03/2002 | US6444139 Chemical mechanical polishing |
| 09/03/2002 | US6443826 Polishing head of a chemical mechanical polishing apparatus and, retainer ring of the same |
| 09/03/2002 | US6443824 Fluid-pressure regulated wafer polishing head |
| 09/03/2002 | US6443823 Carrier head with layer of conformable material for a chemical mechanical polishing system |
| 09/03/2002 | US6443822 Wafer processing apparatus |
| 09/03/2002 | US6443821 Workpiece carrier and polishing apparatus having workpiece carrier |
| 09/03/2002 | US6443820 Polishing apparatus |
| 09/03/2002 | US6443815 Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing |
| 09/03/2002 | US6443810 Polishing platen equipped with guard ring for chemical mechanical polishing |
| 09/03/2002 | US6443809 Polishing apparatus and method for forming an integrated circuit |
| 09/03/2002 | US6443808 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| 09/03/2002 | US6443807 Polishing process for use in method of fabricating semiconductor device |
| 08/29/2002 | WO2002067309A1 Polishing compound and method for polishing substrate |
| 08/29/2002 | WO2002067307A1 Apparatus and method for surface polishing |
| 08/29/2002 | WO2002066206A2 Wafer carrier and method of material removal from a semiconductor wafer |
| 08/29/2002 | WO2002007154A3 Process and apparatus for finishing a magnetic slider |
| 08/29/2002 | WO2001064395A3 A modular control system and method for a cmp tool |
| 08/29/2002 | US20020119735 Wafer abrasive machine |
| 08/29/2002 | US20020119733 See attached list (k. yasui et al) |
| 08/29/2002 | US20020119731 Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 08/29/2002 | US20020119286 Conductive polishing article for electrochemical mechanical polishing |
| 08/28/2002 | EP1234010A2 Use of cesium hydroxide in a dielectric cmp slurry |
| 08/28/2002 | EP1234009A1 Composition and method for planarizing surfaces |
| 08/28/2002 | CN1366549A Polishing compound and method for preparation thereof, and polishing method |
| 08/28/2002 | CN1366548A Composition for use in polishing magnetic disk substrate and method for preparing same |